Devices incorporating stacked bonds and methods of forming the same
A packaged semiconductor device includes a first bond pad, a second bond pad, a first bond wire that includes a first end bonded to the first bond pad and a second end bonded to the second bond pad, and a second bond wire that includes a first end that is electrically connected to the first bond pad and a second end that is electrically connected to the second bond pad. The first end of the second bond wire is bonded to the first end of the first bond wire. A method of bonding a bond wire includes bonding a first end of a first bond wire to a contact surface of a first bond pad and bonding a first end of a second bond wire to a surface of the first end of the first bond wire.
1. A packaged semiconductor device comprising:
a first bond wire comprising a first end and a second end; and
a second bond wire comprising a first end and a second end, wherein the first end of the second bond wire is bonded to a surface of the first end of the first bond wire,
wherein the first end of the second bond wire and the first end of the first bond wire comprise respective widths in a horizontal direction or respective thicknesses in a vertical direction that differ from one another, and
wherein an operating frequency of the packaged semiconductor device is between 500 MHz and 75 GHz.
2. The packaged semiconductor device of claim 1 , wherein the second end of the second bond wire is bonded to a surface of the second end of the first bond wire.
3. The packaged semiconductor device of claim 1 , wherein the second end of the second bond wire is bonded to a contact surface of a pad.
4. The packaged semiconductor device of claim 3 , wherein the second end of the first bond wire is bonded to the contact surface of the pad, and
wherein the second end of the first bond wire is separated from the second end of the second bond wire.
5. The packaged semiconductor device of claim 1 , further comprising a monolithic microwave integrated circuit (MMIC).
6. A packaged semiconductor device comprising:
a first bond wire comprising a first end and a second end; and
a second bond wire comprising a first end and a second end, wherein the first end of the second bond wire comprises a second bonding portion that is bonded to a surface of a first bonding portion of the first end of the first bond wire,
wherein a thickness of the first bonding portion of the first bond wire in a vertical direction is smaller than a thickness of the second bonding portion of the second bond wire in the vertical direction.
7. The packaged semiconductor device of claim 6 , wherein the first bonding portion is bonded to a contact surface of a pad.
8. The packaged semiconductor device of claim 6 , wherein an operating frequency of the packaged semiconductor device is between 500 MHz and 75 GHz.
9. The packaged semiconductor device of claim 6 , wherein the second bond wire comprises a round wire comprising a predominantly round cross-section.
10. The packaged semiconductor device of claim 9 , wherein the first bond wire comprises a wire ribbon comprising a predominantly rectangular cross-section.
11. The packaged semiconductor device of claim 7 , wherein a width of the first bonding portion of the first bond wire in a horizontal direction is greater than a width of the second bonding portion of the second bond wire in the horizontal direction.
12. The packaged semiconductor device of claim 6 , wherein greater than twenty-five percent of a circumference of the second bond wire contacts the surface of the first end of the first bond wire or greater than twenty-five percent of a circumference of the first bond wire contacts a surface of the second bond wire.
13. The packaged semiconductor device of claim 6 , further comprising a third bond wire comprising a first end and a second end,
wherein the second end of the third bond wire is bonded to the second end of the second bond wire.
14. A packaged semiconductor device comprising:
a first bond pad;
a second bond pad;
a first bond wire comprising a first end bonded to the first bond pad and a second end bonded to the second bond pad; and
a second bond wire comprising a first end that is electrically connected to the first bond pad and a second end that is electrically connected to the second bond pad, wherein the first end of the second bond wire is bonded to the first end of the first bond wire,
wherein the first end of the second bond wire and the first end of the first bond wire comprise respective widths in a horizontal direction or respective thicknesses in a vertical direction that differ from one another, and
wherein an operating frequency of the packaged semiconductor device is between 500 MHz and 75 GHz.
15. The packaged semiconductor device of claim 14 , wherein the second end of the second bond wire is bonded to a surface of the second end of the first bond wire.
16. The packaged semiconductor device of claim 14 , wherein the second end of the second bond wire is bonded to the second bond pad.
17. The packaged semiconductor device of claim 16 , wherein the second end of the first bond wire is separated from the second end of the second bond wire.
18. The packaged semiconductor device of claim 14 , further comprising a monolithic microwave integrated circuit (MMIC).
19. A packaged semiconductor device comprising:
a first bond pad;
a second bond pad;
a first bond wire comprising a first end bonded to the first bond pad and a second end bonded to the second bond pad; and
a second bond wire comprising a first end that is electrically connected to the first bond pad and a second end that is electrically connected to the second bond pad, wherein the first end of the second bond wire comprises a second bonding portion that is bonded to a first bonding portion of the first end of the first bond wire,
wherein a width of the first bonding portion of the first bond wire in a horizontal direction is greater than a width of the second bonding portion of the second bond wire in the horizontal direction.
20. The packaged semiconductor device of claim 19 , wherein the first bonding portion is bonded to the first bond pad.
21. The packaged semiconductor device of claim 19 , wherein an operating frequency of the packaged semiconductor device is between 500 MHz and 75 GHz.
22. The packaged semiconductor device of claim 19 , wherein the second bond wire comprises a round wire comprising a predominantly round cross-section.
23. The packaged semiconductor device of claim 22 , wherein the first bond wire comprises a wire ribbon comprising a predominantly rectangular cross-section.
24. The packaged semiconductor device of claim 20 , wherein a thickness of the first bonding portion of the first bond wire in a vertical direction is smaller than a thickness of the second bonding portion of the second bond wire in the vertical direction.
25. The packaged semiconductor device of claim 19 , wherein greater than fifty percent of a lower surface of the second bond wire contacts an upper surface of the first bond wire or greater than fifty percent of the upper surface of the first bond wire contacts the lower surface of the second bond wire.
26. The packaged semiconductor device of claim 19 , further comprising a third bond wire comprising a first end that is electrically connected to the first bond pad and a second end that is electrically connected to the second bond pad,
wherein the second end of the third bond wire is bonded to the second end of the second bond wire.
27. The packaged semiconductor device of claim 19 , further comprising an input lead, wherein one of the first bond pad or the second bond pad is electrically coupled between the first bond wire and the input lead.
28. The packaged semiconductor device of claim 19 , further comprising an output lead, wherein one of the first bond pad or the second bond pad is electrically coupled between the first bond wire and the output lead.
29. A method of bonding a bond wire comprising:
bonding a first end of a first bond wire to a contact surface of a first bond pad; and
bonding a first end of a second bond wire to a surface of the first end of the first bond wire by placing the first end of the second bond wire on the surface of the first end of the first bond wire and applying a second pressure to the first end of the second bond wire.
30. The method of claim 29 , wherein bonding the first end of the first bond wire to the contact surface of the first bond pad comprises placing the first end of the first bond wire on the contact surface and applying a first pressure to the first end of the first bond wire.
31. The method of claim 30 , wherein the second pressure is less than the first pressure.
32. The method of claim 29 , further comprising bonding a second end of the second bond wire to a surface of a second end of the first bond wire.
33. The method of claim 29 , further comprising bonding a second end of the second bond wire to a contact surface of a second bond pad.
34. The method of claim 33 , wherein the second end of the second bond wire is bonded at a point that is separated from the second end of the first bond wire.
35. The method of claim 29 , further comprising bonding a third bond wire to a surface of a second end of the second bond wire.
36. The method of claim 29 , wherein at least one of the first bond wire and the second bond wire comprises a round wire comprising a predominantly round cross-section.
37. The method of claim 29 , wherein at least one of the first bond wire and the second bond wire comprises a wire ribbon comprising a predominantly rectangular cross-section.