Cavity packages
An integrated device package is disclosed. The integrated device package can include an integrated device die, an element, a cavity, and an electrical interconnect. The element can have an antenna structure. The element can be attached to a surface of the integrated device. The cavity can be disposed between the integrated device die and the antenna structure. The electrical interconnect can connect the integrated device die and the antenna structure.
1. A method of manufacturing an integrated device package, the method comprising:
forming a recess in a semiconductor element comprising an antenna structure; and
directly bonding the semiconductor element with an integrated device die without an intervening adhesive, wherein the recess is disposed between the antenna structure and the integrated device die.
2. The method of claim 1 , wherein forming the recess comprises etching a portion of the semiconductor element.
3. The method of claim 1 , wherein forming the recess comprises coating portions of the recess with metal.
4. The method of claim 2 , wherein etching the portion comprises etching a frame portion of the semiconductor element.
5. The method of claim 1 , further comprising polishing a surface of the semiconductor element.
6. The method of claim 5 , further comprising polishing a surface of the integrated device die prior to directly bonding the semiconductor element with the integrated device die.
7. The method of claim 1 , further comprising making an electrical connection between first interconnects in the semiconductor element and second interconnects in the integrated device die.
8. The method of claim 7 , wherein directly bonding the semiconductor element with an integrated device die comprises directly bonding a nonconductive region of the semiconductor element with a nonconductive region of the integrated device die without an intervening adhesive, the making the electrical connection comprises directly bonding the first interconnects in the semiconductor element and the second interconnects in the integrated device die without an intervening adhesive.
9. The method of claim 1 , further comprising filling the recess with air.
10. The method of claim 1 , further comprising forming the antenna structure.
11. The method of claim 10 , wherein the forming the antenna structure comprises forming the antenna structure on a surface of the semiconductor element prior to the forming the recess.
12. The method of claim 10 , wherein the forming the antenna structure comprises forming the antenna structure on a surface of the semiconductor element that is exposed to the recess.
13. The method of claim 1 , further comprising forming a second antenna structure at or near a surface of the integrated device die that faces the semiconductor element.
14. The method of claim 1 , further comprising forming an interconnect that extends at least partially through a thickness of a non-conductive frame portion of the semiconductor element.
15. The method of claim 14 , wherein the forming the interconnect comprises making a hole by way of etching or drilling the non-conductive frame portion of the semiconductor element and filling the hole with a conductive material.
16. A method of manufacturing an integrated device package, the method comprising:
forming a recess in a semiconductor element comprising an antenna structure, forming the recess comprising etching a portion of the semiconductor element; and
directly bonding the semiconductor element with an integrated device die without an intervening adhesive, wherein the recess is disposed between the antenna structure and the integrated device die.
17. The method of claim 16 , wherein bonding the semiconductor element with the integrated device die comprises bonding the semiconductor element directly to the integrated device die without an intervening adhesive.
18. The method of claim 17 , further comprising making an electrical connection between first interconnects in the semiconductor element and second interconnects the integrated device die.
19. The method of claim 18 , wherein the making the electrical connection comprises directly bonding the first interconnects in the semiconductor element and the second interconnects in the integrated device die without an intervening adhesive.
20. A method of manufacturing an integrated device package, the method comprising:
providing a semiconductor element comprising an antenna structure; and
directly bonding the semiconductor element with an integrated device die without an intervening adhesive.
21. The method of claim 20 , further comprising forming a recess between the antenna structure and integrated device die.
22. The method of claim 21 , further comprising forming the recess in the semiconductor element.
23. The method of claim 20 , wherein directly bonding the semiconductor element with the integrated device die comprises directly bonding a nonconductive region of the semiconductor element with a nonconductive region of the integrated device die without an adhesive, and directly bonding first interconnects in the semiconductor element with second interconnects in the integrated device die without an intervening adhesive.