On-board radiation sensing apparatus
Systems, methods, and apparatuses for providing on-board electromagnetic radiation sensing using beam splitting in a radiation sensing apparatus. The radiation sensing apparatuses can include a micro-mirror chip including a plurality of light reflecting surfaces. The apparatuses can also include an image sensor including an imaging surface. The apparatuses can also include a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit can include a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip. The apparatuses can also include an enclosure configured to enclose at least the beamsplitter and a light source. With the apparatuses, the light source can be attached to a printed circuit board (PCB). Also, the enclosure can include an inner surface that has an angled reflective surface that is configured to reflect light from the light source in a direction towards the beamsplitter.
1. A radiation sensing apparatus, comprising:
a micro-mirror chip comprising a plurality of light reflecting surfaces;
an image sensor comprising an imaging surface; and
a beamsplitter unit located between the micro-mirror chip and the image sensor, comprising a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip,
wherein the beamsplitter unit is configured to reflect light toward the micro-mirror chip.
2. The radiation sensing apparatus of claim 1 , further comprising an enclosure, either configured to:
enclose at least the beamsplitter and a light source, the light source being attached to a printed circuit board (PCB), the enclosure comprising an inner surface that comprises an angled reflective surface that is configured to reflect light from the light source in a direction towards the beamsplitter; or
enclose at least the beamsplitter, the beamsplitter and a light source being attached to a printed circuit board (PCB), and the light source being attached to the PCB by a flexible connector.
3. The radiation sensing apparatus of claim 1 , wherein the enclosure is further configured to enclose the image sensor.
4. The radiation sensing apparatus of claim 1 , wherein the enclosure is further configured to enclose the micro-mirror chip.
5. The radiation sensing apparatus of claim 1 , wherein the angled reflective surface is a 45-degree reflective surface that is 45 degrees from the imaging surface.
6. The radiation sensing apparatus of claim 5 , wherein the light source emits a center light ray along the z-axis, and wherein the 45-degree reflective surface is configured to reflect the center light ray at a 90-degree angle in a direction towards the beamsplitter.
7. The radiation sensing apparatus of claim 5 , wherein the partially-reflective surface of the beamsplitter is a 45-degree partially-reflective surface that is 45 degrees from the imaging surface and 45 degrees from the micro-mirror chip.
8. The radiation sensing apparatus of claim 7 , wherein the 45-degree partially-reflective surface of the beamsplitter is parallel to the angled reflective surface of the enclosure.
9. The radiation sensing apparatus of claim 1 , wherein the micro-mirror chip is configured to reflect light toward the image sensor.
10. The radiation sensing apparatus of claim 9 , wherein the light reflected by the micro-mirror chip passes through the beamsplitter unit without being reflected.
11. The radiation sensing apparatus of claim 1 , further comprising an enclosure with an opening, wherein the opening is located above the micro-mirror chip such that radiation that passes through the opening and a radiation lens emits onto a plurality of radiation absorption surfaces of the micro-mirror chip.
12. The radiation sensing apparatus of claim 11 , wherein the radiation lens is embedded within a cone enclosure.
13. The radiation sensing apparatus of claim 11 , wherein the enclosure comprises a radiation filter within the opening of the enclosure and between the radiation lens and the micro-mirror chip such that radiation that emits from the radiation lens passes through the radiation filter onto the plurality of radiation absorption surfaces of the micro-mirror chip.
14. The radiation sensing apparatus of claim 11 , wherein a chamber is formed at least in part by interior surfaces of the enclosure.
15. The radiation sensing apparatus of claim 14 , wherein the chamber houses the micro-mirror chip entirely.
16. The radiation sensing apparatus of claim 14 , wherein the micro-mirror chip is partially within the opening of the enclosure and partially within the chamber.
17. The radiation sensing apparatus of claim 1 , wherein the beamsplitter is configured to split a light ray to a first light ray and a second light ray, wherein the first light ray reflects from the first beamsplitter towards the plurality of light reflecting surfaces of the micro-mirror chip and the second light ray passes through the beamsplitter towards a sidewall of the enclosure.
18. The radiation sensing apparatus of claim 17 , wherein each light reflecting surface of the plurality of light reflecting surfaces of the micro-mirror chip reflects a light ray that is split at the partially-reflective surface of the beamsplitter to a third light ray and a fourth light ray such that only the third light ray passes through the partially-reflective surface to the imaging surface of the image sensor.
19. A radiation sensing apparatus, comprising:
a micro-mirror chip comprising a plurality of light reflecting surfaces;
an image sensor comprising an imaging surface; and
a beamsplitter unit located between the micro-mirror chip and the image sensor, comprising a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip,
wherein the beamsplitter unit is configured to split a light ray to a first light ray and a second light ray, wherein the first light ray reflects from a first beamsplitter of the beamsplitter unit towards the micro-mirror chip and the second light ray passes through the beamsplitter towards a sidewall of the enclosure.
20. A radiation sensing apparatus, comprising:
a micro-mirror chip comprising a plurality of light reflecting surfaces;
an image sensor comprising an imaging surface;
a beamsplitter unit located between the micro-mirror chip and the image sensor, comprising a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip,
wherein the beamsplitter unit is configured to split a light ray to a first light ray and a second light ray, wherein the first light ray reflects from a first beamsplitter of the beamsplitter unit towards the micro-mirror chip and the second light ray passes through a portion of the beamsplitter towards a second beamsplitter of the beamsplitter unit.