ECA oxide-resistant connection to a hermetic seal ferrule for an active implantable medical device
A hermetically sealed feedthrough assembly for an active implantable medical device having an oxide-resistant electrical attachment for connection to an EMI filter, an EMI filter circuit board, an AIMD circuit board, or AIMD electronics. The oxide-resistant electrical attachment, including an oxide-resistant sputter layer 165 is disposed on the device side surface of the hermetic seal ferrule over which an ECA stripe is provided. The ECA stripe may comprise one of a thermal-setting electrically conductive adhesive, an electrically conductive polymer, an electrically conductive epoxy, an electrically conductive silicone, an electrically conductive polyimide, or a thermal-setting electrically conductive polyimide, such as those manufactured by Ablestick Corporation. The oxide-free electrical attachment between the ECA stripe and the filter or AIMD circuits may comprise one of gold, platinum, palladium, silver, iridium, rhenium, rhodium, tantalum, tungsten, niobium, zirconium, vanadium, and combinations or alloys thereof.
1. A feedthrough, comprising:
a) a ferrule, comprising:
i) a ferrule opening extending to a ferrule first side opposite a ferrule second side;
ii) an oxide-resistant layer overlaying at least a portion of the ferrule second side; and
iii) an electrically conductive adhesive (ECA) overlaying and directly contacted to the oxide-resistant layer;
b) an insulator hermetically sealed to the ferrule in the ferrule opening, the insulator extending to an insulator first side at or adjacent to the ferrule first side and an insulator second side at or adjacent to the ferrule second side;
c) at least one via hole extending through the insulator to the insulator first and second sides;
d) an electrically conductive pathway disposed in and hermetically sealed to the insulator in the at least one via hole; and
e) a gold braze hermetically sealing the insulator to the ferrule.
2. The feedthrough of claim 1 , wherein the ferrule is of titanium.
3. The feedthrough of claim 1 , wherein the oxide-resistant layer is selected from gold, platinum, palladium, silver, iridium, rhenium, rhodium, tantalum, tungsten, niobium, zirconium, vanadium, nitinol, cobalt-chromium, platinum-rhodium, platinum-iridium, platinum-palladium, platinum-gold, platiniridium, iridosmium, osmiridium, gold-palladium, gold-boron, palladium-silver, and combinations thereof.
4. The feedthrough of claim 1 , wherein the electrically conductive adhesive (ECA) is selected from a thermal-setting electrically conductive adhesive, an electrically conductive polymer, an electrically conductive epoxy, an electrically conductive silicone, an electrically conductive polyimide, a thermal-setting electrically conductive polyimide, and mixtures thereof.
5. The feedthrough of claim 1 , further comprising a barrier layer selected from palladium, platinum and titanium-nitride directly contacting at least a portion of the ferrule second side, and wherein the oxide resistant layer directly contacts the barrier layer.
6. The feedthrough of claim 1 , wherein the electrically conductive pathway hermetically sealed to the insulator in the at least one via hole is selected from a lead conductor, a terminal pin, a circuit trace, and a platinum-containing sintered material.
7. A filtered feedthrough, comprising:
a) a feedthrough, comprising:
i) a ferrule, comprising:
A) a ferrule opening extending to a ferrule first side opposite a ferrule second side;
B) an oxide-resistant layer overlaying at least a portion of the ferrule second side; and
C) an electrically conductive adhesive (ECA) overlaying and directly contacted to the oxide-resistant layer;
ii) an insulator hermetically sealed to the ferrule in the ferrule opening, the insulator extending to an insulator first side at or adjacent to the ferrule first side and an insulator second side at or adjacent to the ferrule second side;
iii) at least one via hole extending through the insulator to the insulator first and second sides;
iv) a terminal pin disposed in and hermetically sealed to the insulator in the at least one via hole, wherein at least a second side portion of the terminal pin extends outwardly beyond the insulator second side; and
v) a gold braze hermetically sealing the insulator to the ferrule;
b) at least one capacitor disposed on or adjacent to the ferrule and insulator second sides, the capacitor comprising:
i) a capacitor dielectric supporting at least one active electrode plate and at least one ground electrode plate in a spaced and interleaved relationship with each other;
ii) at least one active passageway extending through the capacitor dielectric, wherein a capacitor active metallization in the active passageway is electrically connected to the at least one active electrode plate, and wherein the terminal pin second side portion extends into the capacitor active passageway; and
iii) a capacitor ground metallization attached to the capacitor dielectric and electrically connected to the at least one ground electrode plate;
c) an active electrical connection electrically connecting the terminal pin second side portion in the active passageway to the capacitor active metallization electrically connected to the at least one active electrode plate; and
d) a ground electrical connection electrically connecting the capacitor ground metallization to the ECA directly contacting the oxide-resistant layer electrically connected to the ferrule.
8. The filtered feedthrough of claim 7 , wherein the ferrule is of titanium.
9. The filtered feedthrough of claim 7 , wherein the oxide-resistant layer is selected from gold, platinum, palladium, silver, iridium, rhenium, rhodium, tantalum, tungsten, niobium, zirconium, vanadium, nitinol, cobalt-chromium, platinum-rhodium, platinum-iridium, platinum-palladium, platinum-gold, platiniridium, iridosmium, osmiridium, gold-palladium, gold-boron, palladium-silver, and combinations thereof.
10. The filtered feedthrough of claim 7 , wherein the electrically conductive adhesive (ECA) is selected from a thermal-setting electrically conductive adhesive, an electrically conductive polymer, an electrically conductive epoxy, an electrically conductive silicone, an electrically conductive polyimide, a thermal-setting electrically conductive polyimide, and mixtures thereof.
11. The filtered feedthrough of claim 7 , further comprising a nickel layer contacting at least a portion of the ferrule second side, and wherein the oxide resistant layer directly contacts the nickel layer.
12. The filtered feedthrough of claim 7 , wherein the at least one capacitor is selected from a three-terminal device feedthrough capacitor, a multilayer ceramic chip capacitor, a monolithic ceramic capacitor, a flat-thru capacitor, and an X2Y attenuator.
13. The filtered feedthrough of claim 7 , wherein the oxide resistant layer has a thickness ranging from 10 nm to 400 nm.
14. A filtered feedthrough that is configured for attachment to a housing for an active implantable medical device (AIMD), the filtered feedthrough comprising:
a) a feedthrough, comprising:
i) a ferrule, comprising:
A) a ferrule opening extending to a ferrule body fluid side opposite a ferrule device side;
B) an oxide-resistant layer overlaying at least a portion of the ferrule device side; and
C) an electrically conductive adhesive (ECA) overlaying and directly contacting the oxide-resistant layer; and
ii) an insulator hermetically sealed to the ferrule in the ferrule opening, the insulator extending to an insulator body fluid side at or adjacent to the ferrule body fluid side and an insulator device side at or adjacent to the ferrule device side, wherein, when the ferrule hermetically sealed to the insulator is attached to an opening in a housing of an AIMD, the ferrule and insulator body fluid sides, and the ferrule and insulator device sides reside outside and inside the AIMD, respectively;
iii) at least one via hole extending through the insulator to the insulator body fluid and device sides;
iv) a terminal pin disposed in and hermetically sealed to the insulator in the at least one via hole, wherein at least a device side portion of the terminal pin extends outwardly beyond the insulator device side; and
v) a gold braze hermetically sealing the insulator to the ferrule;
b) at least one capacitor disposed on or adjacent to the ferrule and insulator device sides, the capacitor comprising:
i) a capacitor dielectric supporting at least one active electrode plate and at least one ground electrode plate in a spaced and interleaved relationship with each other;
ii) at least one active passageway extending through the capacitor dielectric, wherein a capacitor active metallization in the active passageway is electrically connected to the at least one active electrode plate, and wherein the terminal pin device side portion extends into the capacitor active passageway; and
iii) a capacitor ground metallization attached to the capacitor dielectric and electrically connected to the at least one ground electrode plate;
c) an active electrical connection electrically connecting the terminal pin device side portion in the active passageway to the capacitor active metallization electrically connected to the at least one active electrode plate; and
d) a ground electrical connection electrically connecting the capacitor ground metallization to the ECA directly contacting the oxide-resistant layer electrically connected to the ferrule.
15. The filtered feedthrough of claim 14 , wherein the ferrule is of titanium.
16. The filtered feedthrough of claim 14 , wherein the oxide-resistant layer is selected from gold, platinum, palladium, silver, iridium, rhenium, rhodium, tantalum, tungsten, niobium, zirconium, vanadium, nitinol, cobalt-chromium, platinum-rhodium, platinum-iridium, platinum-palladium, platinum-gold, platiniridium, iridosmium, osmiridium, gold-palladium, gold-boron, palladium-silver, and combinations thereof.
17. The filtered feedthrough of claim 14 , wherein the electrically conductive adhesive (ECA) is selected from a thermal-setting electrically conductive adhesive, an electrically conductive polymer, an electrically conductive epoxy, an electrically conductive silicone, an electrically conductive polyimide, a thermal-setting electrically conductive polyimide, and mixtures thereof.
18. The filtered feedthrough of claim 14 , further comprising a nickel layer directly contacting at least a portion of the ferrule device side, and wherein the oxide resistant layer directly contacts the nickel layer.
19. The filtered feedthrough of claim 14 , wherein the at least one capacitor is selected from a three-terminal device feedthrough capacitor, a multilayer ceramic chip capacitor, a monolithic ceramic capacitor, a flat-thru capacitor, and an X2Y attenuator.
20. The filtered feedthrough of claim 14 , further comprising an insulative washer disposed between the insulator hermetically sealed to the ferrule and the at least one capacitor.