Substrate processing apparatus, method of manufacturing semiconductor device, and plasma generator
There is provided a technique that includes: a process chamber in which a substrate is processed; a gas supply system configured to supply a processing gas into the process chamber; a first plasma generator installed to be wound around an outer periphery of the process chamber and configured to generate plasma from the processing gas in the process chamber; and a second plasma generator installed at an upper portion of the process chamber to protrude toward an inside of the process chamber and configured to generate plasma from the processing gas in the process chamber.
1. A substrate processing apparatus, comprising:
a process chamber in which a substrate is processed;
a gas supply system configured to supply a processing gas into the process chamber;
a first plasma generator installed to be wound around an outer periphery of the process chamber and configured to generate plasma from the processing gas in the process chamber; and
a second plasma generator installed at an upper portion of the process chamber, formed to protrude toward an inside of the process chamber to directly face the substrate, and configured to generate plasma from the processing gas in the process chamber,
wherein the substrate processing apparatus is configured to supply the plasma generated by the second plasma generator directly to the substrate in the process chamber.
2. The substrate processing apparatus according to claim 1 , wherein the second plasma generator includes an insulator installed at the upper portion of the process chamber to protrude toward the inside of the process chamber, and a coil installed along the insulator.
3. The substrate processing apparatus according to claim 2 , wherein the second plasma generator is shielded by a cylindrical or rectangular parallelepiped electromagnetic wave shield formed of a conductive metal plate.
4. The substrate processing apparatus according to claim 2 , wherein the coil installed at the second plasma generator is a conductive U-shape coil protected by the insulator.
5. The substrate processing apparatus according to claim 3 , wherein high-frequency power supplied from a high-frequency power source to the second plasma generator is supplied to the coil via a matching apparatus connected to one end of the coil and a ground to which the other end of the coil and the electromagnetic wave shield are connected.
6. The substrate processing apparatus according to claim 1 , wherein the first plasma generator includes a conductive spiral-shaped coil and a conductive cylindrical electromagnetic wave shield.
7. The substrate processing apparatus according to claim 6 , wherein the conductive spiral-shaped coil is formed such that a coil winding diameter at a predetermined position is different from a coil winding diameter at another position between one end and the other end of the conductive spiral-shaped coil.
8. The substrate processing apparatus according to claim 6 , wherein high-frequency power supplied from a high-frequency power source to the first plasma generator is supplied to the conductive spiral-shaped coil via a matching apparatus connected to both ends of the conductive spiral-shaped coil and a ground to which a vicinity of a middle of the conductive spiral-shaped coil and the electromagnetic wave shield are connected.
9. The substrate processing apparatus according to claim 6 , wherein permanent magnets are installed at the first plasma generator.
10. The substrate processing apparatus according to claim 9 , wherein the permanent magnets are above and below the conductive spiral-shaped coil installed in the first plasma generator.
11. A method of manufacturing a semiconductor device, comprising:
loading a substrate into a process chamber of a substrate processing apparatus, the substrate processing apparatus comprising:
the process chamber in which the substrate is processed;
a gas supply system configured to supply a processing gas into the process chamber;
a first plasma generator installed to be wound around an outer periphery of the process chamber and configured to generate plasma from the processing gas in the process chamber; and
a second plasma generator installed at an upper portion of the process chamber, formed to protrude toward an inside of the process chamber to directly face the substrate, and configured to generate plasma from the processing gas in the process chamber, wherein the substrate processing apparatus is configured to supply the plasma generated by the second plasma generator directly to the substrate in the process chamber;
supplying the processing gas into the process chamber;
generating plasma from the processing gas on the substrate in the process chamber by the first plasma generator and the second plasma generator; and
unloading the substrate from the process chamber.