IP Library Granted Patent US 11,629,276
Granted Patent B2
US 11,629,276 · App. 17/198,504 · Granted Apr 18, 2023

Structural adhesive compositions

Inventors: Umesh C. Desai (Wailuku, HI); Tien-Chieh Chao (Mars, PA); Masayuki Nakajima (Wexford, PA); Kaliappa G. Ragunathan (Waxhaw, NC)
Assignee: PPG Industries Ohio, Inc.
C09J163/00B82Y30/00C08G59/066C08G59/182C08G59/184C08G59/4276C08G59/5006C08L63/00C09J5/00C09J5/06C08K3/04C08L2205/02C09J2463/00
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Quick Facts
Patent No.
US 11,629,276
App. No.
17/198,504
Granted
Apr 18, 2023
Kind
B2
Abstract

Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.

Claims (25)

1. A one-component composition comprising:

(a) 2% by weight to 40% by of an epoxy-capped flexibilizer, based on total weight of the one-component composition;

(b) 3% by weight to 25% by weight of a heat-activated latent curing agent, based on total weight of the one-component composition, wherein the heat-activated latent curing agent comprises dicyandiamide having a D98 maximum of 6 μm and a reaction product of reactants comprising a polyepoxide compound and an imidazole;

(c) optionally an epoxy/CTBN adduct;

(d) 1% by weight to 15% by weight of an epoxy-dimer acid adduct, based on total weight of the one-component composition;

(e) 5% by weight to 60% by weight of rubber particles having a core/shell structure, based on total weight of the one-component composition;

(f) optionally graphenic carbon particles; and

an epoxy compound or an epoxy resin not incorporated into or reacted as a part of any of the components (a)-(f) and/or an epoxy carrier resin incorporated into the component (e).

2. The one-component composition of claim 1 , wherein the epoxy-capped flexibilizer (a) comprises a reaction product of reactants comprising (i) an epoxy compound, (ii) a polyol comprising a polytetrahydrofuran, and (iii) an anhydride and/or a diacid.

3. The one-component composition of claim 2 , wherein the epoxy compound reactant (i) of the epoxy-capped flexibilizer (a) comprises Bisphenol A diglycidyl ether, phenyl diglycidyl ether, or combinations thereof.

4. The one-component composition of claim 1 , wherein the epoxy-capped flexibilizer (a) comprises a reaction product of reactants comprising (i) an epoxy compound and (ii) a primary or a secondary polyether amine.

5. The one-component composition of claim 4 , wherein the epoxy compound reactant (i) of the epoxy-capped flexibilizer (a) comprises Bisphenol A diglycidyl ether, phenyl diglycidyl ether, or combinations thereof.

6. The one-component composition of claim 1 , wherein the heat activated latent curing agent (b) further comprises a reaction product of reactants comprising a polyepoxide compound and an amine.

7. The one-component composition of claim 6 , wherein the amine reactant comprises a secondary amine.

8. The one-component composition of claim 1 , wherein the heat activated latent curing agent (b) further comprises 3,4-dichlorophenyl-N,N-dimethyl urea.

9. The one-component composition of claim 1 , wherein at least one of the epoxy/CTBN adduct (c) and the graphenic carbon particles (f) is present in the composition.

10. The one-component composition of claim 1 , wherein the composition is curable at a temperature of 140° C. or less and/or is heat-curable within 15 minutes or less.

11. A method of treating a substrate, comprising: applying the composition of claim 1 to a surface of the substrate; and heating the composition at a temperature of 140° C. or less.

12. The method of claim 11 , wherein the temperature is less than 140° C.

13. An article comprising: a coating formed on a surface of a substrate from the composition of claim 1 following heating the composition at a temperature of 140° C. or less.

14. The article of claim 13 , wherein the temperature is less than 140° C.

15. The article of claim 13 , further comprising a second substrate, wherein the composition is positioned between the surface and the second substrate.

16. The article of claim 13 , wherein the coating has a measured lap shear strength of at least 15 MPa when tested at room temperature.

17. An automotive component comprising the article of claim 13 .

18. A wind turbine comprising the article of claim 13 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 12, 2021
From: DESAI, UMESH C.; CHAO, TIEN-CHIEH; NAKAJIMA, MASAYUKI; RAGUNATHAN, KALIAPPA G.
To: PPG INDUSTRIES OHIO, INC.
Reel/Frame 055570/0236 →
Continuity (5)
Division 14961513 · Dec 7, 2015
Continuation 13918021 · Jun 14, 2013
Continuation In Part 13315518 · Dec 9, 2011
Continuation In Part 12949878 · Nov 19, 2010
Related Publication 20210198538A1 · Jul 1, 2021
Cited By (2)
US 12,291,633 US 12,291,634