Barriers for grooves in photonics dies
Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package includes a photonics die and a plurality of v-grooves on the photonics die. A barrier structure proximate the plurality of v-grooves.
1. A photonics package, comprising:
a photonics die;
a plurality of v-grooves on the photonics die;
a barrier structure proximate the plurality of v-grooves; and
an underfill material, wherein the barrier structure is between the underfill material and the plurality of v-grooves, and wherein the barrier structure inhibits the underfill material from filling the plurality of v-grooves.
2. The photonics package of claim 1 , further comprising:
a lens array optically coupled to a spot size converter on the photonics die, wherein the lens array comprises:
a main body; and
a plurality of lenses extending out from the main body.
3. The photonics package of claim 2 , wherein individual ones of the plurality of lenses are disposed in different ones of the plurality of v-grooves.
4. The photonics package of claim 2 , wherein the lens array further comprises:
a pair of alignment posts extending out from the main body.
5. The photonics package of claim 4 , wherein the alignment posts and the plurality of lenses extend out from a first surface of the main body.
6. The photonics package of claim 4 , wherein the alignment posts extend out from a first surface of the main body, and wherein the plurality of lenses extend out from a second surface of the main body.
7. The photonics package of claim 4 , wherein the alignment posts are disposed in the v-grooves.
8. The photonics package of claim 2 , further comprising:
a plurality of waveguides extending through the main body, wherein each waveguide is optically coupled to one of the plurality of lenses; and
a saw-tooth pattern on a bottom surface of the main body.
9. The photonics package of claim 8 , wherein the saw-tooth pattern sits into the plurality of v-grooves on the photonics die.
10. The photonics package of claim 2 , wherein the main body is L-shaped.
11. The photonics package of claim 10 , wherein a plurality of cylindrical pillars extend out from a surface of the main body, and wherein the plurality of lenses are at ends of the plurality of cylindrical pillars.
12. The photonics package of claim 11 , wherein the cylindrical pillars are set into the plurality of v-grooves on the photonics die.
13. The photonics package of claim 2 , further comprising:
cylindrical ridges on a first surface of the main body; and
a recessed surface on a second surface of the main body, wherein the lenses are on the recessed surface.
14. The photonics package of claim 13 , wherein the cylindrical ridges are set into the plurality of v-grooves on the photonics die.
15. A photonics package, comprising:
a photonics die;
a plurality of v-grooves in the photonics die;
a barrier structure proximate the plurality of v-grooves;
an underfill material, wherein the barrier structure is between the underfill material and the plurality of v-grooves, and wherein the barrier structure inhibits the underfill material from filling the plurality of v-grooves; and
a lens array optically coupled to a spot size converter on the photonics die, wherein the lens array comprises:
a fiber housing;
a plurality of optical fibers in the fiber housing; and
a plurality of lenses at an end of the optical fibers.
16. The photonics package of claim 15 , wherein the plurality of optical fibers are set into the plurality of v-grooves on the photonics die.
17. The photonics package of claim 15 , wherein the plurality of lenses are discrete bodies from the plurality of optical fibers.
18. The photonics package of claim 15 , wherein the plurality of lenses are fabricated as part of the plurality of optical fibers.
19. A photonics system, comprising:
a board;
a package substrate coupled to the board;
a processor on the package substrate;
a photonics die on the package substrate and communicatively coupled to the processor, the photonics die comprising a barrier structure proximate a plurality of v-grooves;
an underfill material, wherein the barrier structure is between the underfill material and the plurality of v-grooves, and wherein the barrier structure inhibits the underfill material from filling the plurality of v-grooves; and
a lens array coupled to an edge of the photonics die.
20. The photonics system of claim 19 , wherein the lens array comprises:
a main body; and
a plurality of lenses extending out from the main body.
21. The photonics system of claim 20 , wherein individual ones of the plurality of lenses are disposed in different ones of the plurality of v-grooves.
22. The photonics system of claim 20 , wherein the lens array further comprises:
a pair of alignment posts extending out from the main body.