Granted Patent B2

US 12,275,086 · App. 17/219,924 · Granted Apr 15, 2025

Inventors: Manuel Kiefer (Sinsheim, DE); Christoph Bloemker (Stuttgart, DE); Uwe Mienhardt (Korntal-Muenchingen, DE); Jens Ottnad (Karlsruhe, DE); Leonie Felica Tatzel (Korntal, DE); Korbinian Weiss (Korntal, DE)

Assignee: TRUMPF WERKZEUGMASCHINEN SE + CO. KG

B23K26/0892B23K26/38G05B19/182G05B2219/45041

Abstract

Claims (25)

1. A method for processing a workpiece with a laser cutting machine, the method comprising:

A) reading out at least one machine parameter, at least one material parameter, and at least one prioritized cut edge quality feature;

B) executing a process parameter algorithm which outputs a process parameter recommendation, the process parameter algorithm having at least one data aggregation routine, and the process parameter algorithm being configured to determine the process parameter recommendation based on a plurality of cut edge quality features and the at least one prioritized cut edge quality feature using the at least one data aggregation routine so that one edge quality feature is emphasized to a disadvantage of other cut edge quality features of the plurality of cut edge quality features; and

C) operating a laser cutting machine to perform laser processing of the workpiece based on the process parameter recommendation.

2. The method according to claim 1 , wherein the cut edge quality features include roughness thickness, roughness shape, burr height, burr shape, cut edge bevel, and/or discoloration.

3. The method according to claim 1 , further comprising:

D) determining a plurality of cut edge quality features of the machined workpiece;

E) reading out these cut edge quality features in order to change the process parameter algorithm.

4. The method according to claim 3 , wherein at least one cut edge quality feature is objectively determined by a measuring device.

5. The method according to claim 4 , wherein the at least one cut edge quality feature is determined by an image recording device.

6. The method according to claim 1 , wherein the process parameter algorithm and/or a database are stored in cloud-based storage, wherein the machine parameters, the material parameters, the cut edge quality features and/or the desired cut edge quality features are stored in the database.

7. The method according to claim 1 , wherein the output of the process parameter recommendation in B) takes place on a display and/or the output of the process parameter recommendation in B) is used directly for laser processing of the workpiece in C).

8. A device for processing a workpiece, the device comprising:

a) an input unit configured to input at least one machine parameter, at least one material parameter, and at least one prioritized cut edge quality feature;

b) a computing unit configured to execute a process parameter algorithm configured to output a process parameter recommendation, the process parameter algorithm having at least one data aggregation routine, and the process parameter algorithm being configured to determine the process parameter recommendation based on a plurality of cut edge quality features and the at least one prioritized cut edge quality feature using the at least one data aggregation routine so that one edge quality feature is emphasized to a disadvantage of other cut edge quality features of the plurality of cut edge quality features; and

c) a laser cutting machine configured to perform laser processing of the workpiece based on the process parameter recommendation.

9. The device according to claim 8 , wherein the device comprises:

d) a measuring device configured to objectively determine at least one cut edge quality feature.

10. The device according to claim 9 , wherein the measuring device is an image recording device.

11. The device according to claim 8 , wherein the at least one prioritized cut edge quality feature comprises a low-priority cut edge quality feature.

12. The device according to claim 8 , wherein the computing unit further includes a database for storing the machine parameters, the material parameters, the cut edge quality features, the process parameters, and/or the at least one prioritized cut edge quality feature, wherein the database is cloud-based.

13. The device according to claim 8 , the device further comprising a display configured to output the process parameter recommendation, and/or

wherein the laser cutting machine is configured to be controlled directly by the computing unit.

14. The device according to claim 8 , wherein the at least one prioritized cut edge quality feature comprises a prioritization sequence of cut edge quality features.

15. The device according to claim 8 , wherein the at least one prioritized cut edge quality feature is associated with a superordinate value or a subordinate value.

Assignments (2)

Priority Claims (1)

Continuity (2)

References Cited (37)