Semiconductor device
A semiconductor device includes a gate electrode, a gate insulating film which includes oxidized material containing silicon and covers the gate electrode, an oxide semiconductor film provided to be in contact with the gate insulating film and overlap with at least the gate electrode, and a source electrode and a drain electrode electrically connected to the oxide semiconductor film. In the oxide semiconductor film, a first region which is provided to be in contact with the gate insulating film and have a thickness less than or equal to 5 nm has a silicon concentration lower than or equal to 1.0 at. %, and a region in the oxide semiconductor film other than the first region has lower silicon concentration than the first region. At least the first region includes a crystal portion.
1. A semiconductor device comprising:
an oxide semiconductor film over a substrate;
a source electrode and a drain electrode electrically connected to the oxide semiconductor film;
a gate electrode; and
a gate insulating film between the gate electrode and the oxide semiconductor film,
wherein the gate insulating film includes silicon and oxygen,
wherein a concentration of silicon in the oxide semiconductor film is lower than or equal to 1.0 at. %,
wherein the oxide semiconductor film includes a region where a concentration of silicon is decreased from an interface with the gate insulating film toward an inside of the oxide semiconductor film, and
wherein the oxide semiconductor film includes a crystal portion.
2. The semiconductor device according to claim 1 , wherein the gate insulating film comprises an oxide containing silicon.
3. The semiconductor device according to claim 1 , wherein an end portion of the oxide semiconductor film is tapered at an angle of 20° to 50°.
4. The semiconductor device according to claim 1 , further comprising an insulating film over the gate insulating film and the gate electrode.
5. The semiconductor device according to claim 1 , wherein a c-axis of the crystal portion is aligned in a direction perpendicular to a surface of the oxide semiconductor film.
6. A semiconductor device comprising:
an oxide semiconductor film over a substrate;
a source electrode and a drain electrode electrically connected to the oxide semiconductor film;
a gate electrode; and
a gate insulating film located over the oxide semiconductor film,
wherein the gate insulating film includes silicon and oxygen,
wherein a concentration of silicon in the oxide semiconductor film is lower than or equal to 1.0 at. %,
wherein the oxide semiconductor film includes a region where a concentration of silicon is decreased from an interface with the gate insulating film toward an inside of the oxide semiconductor film, and
wherein the oxide semiconductor film includes a crystal portion.
7. The semiconductor device according to claim 6 , wherein the gate insulating film comprises an oxide containing silicon.
8. The semiconductor device according to claim 6 , wherein an end portion of the oxide semiconductor film is tapered at an angle of 20° to 50°.
9. The semiconductor device according to claim 6 , further comprising an insulating film over the gate insulating film and the gate electrode.
10. The semiconductor device according to claim 6 , wherein a c-axis of the crystal portion is aligned in a direction perpendicular to a surface of the oxide semiconductor film.