Architecture for computing system package
A method includes forming a reconstructed wafer, which includes forming a redistribution structure over a carrier, bonding a first plurality of memory dies over the redistribution structure, bonding a plurality of bridge dies over the redistribution structure, and bonding a plurality of logic dies over the first plurality of memory dies and the plurality of bridge dies. Each of the plurality of bridge dies interconnects, and is overlapped by corner regions of, four of the plurality of logic dies. A second plurality of memory dies are bonded over the plurality of logic dies. The plurality of logic dies form a first array, and the second plurality of memory dies form a second array.
1. A method comprising:
forming a reconstructed wafer comprising:
forming a redistribution structure over a carrier;
bonding a first plurality of memory dies over the redistribution structure;
bonding a plurality of bridge dies over the redistribution structure;
bonding a plurality of logic dies over the first plurality of memory dies and the plurality of bridge dies, wherein each of the plurality of bridge dies interconnects, and is overlapped by corner regions of, four of the plurality of logic dies; and
bonding a second plurality of memory dies over the plurality of logic dies, wherein the plurality of logic dies form a first array, and the second plurality of memory dies form a second array.
2. The method of claim 1 further comprising:
bonding a package component to the reconstructed wafer to form an additional package.
3. The method of claim 2 , wherein at a time of the package component is bonded to the reconstructed wafer, the reconstructed wafer comprises the first array and the second array.
4. The method of claim 3 further comprising attaching a socket to the additional package, wherein at a time after the socket is attached, the reconstructed wafer comprises both of the first array and the second array.
5. The method of claim 1 further comprising:
encapsulating the first plurality of memory dies and the plurality of bridge dies in a first encapsulant;
encapsulating the plurality of logic dies in a second encapsulant; and
encapsulating the second plurality of memory dies in a third encapsulant.
6. The method of claim 5 , wherein the reconstructed wafer is free from logic dies in the first encapsulant and the third encapsulant, and free from memory dies in the second encapsulant.
7. The method of claim 5 , wherein the plurality of logic dies have bottom surfaces in physical contact with a top surface of the first encapsulant.
8. The method of claim 5 , wherein the second encapsulant is encapsulated over, and is in physical contact with, the first encapsulant.
9. The method of claim 1 , wherein the first plurality of memory dies are identical to each other, the plurality of logic dies are identical to each other, and the second plurality of memory dies are identical to each other.
10. The method of claim 1 , wherein the plurality of logic dies are bonded to the first plurality of memory dies through hybrid bonding.
11. The method of claim 1 , wherein the bonding the plurality of logic dies over the first plurality of memory dies and the plurality of bridge dies is performed through die-to-wafer bonding.
12. The method of claim 1 , wherein the bonding the plurality of logic dies over the first plurality of memory dies and the plurality of bridge dies is performed through a wafer-to-wafer bonding process comprising:
encapsulating the first plurality of memory dies and the plurality of bridge dies to form a first reconstructed wafer;
encapsulating the plurality of logic dies to form a second reconstructed wafer; and
bonding the second reconstructed wafer to the first reconstructed wafer through wafer-to-wafer bonding.
13. A package comprising:
a redistribution structure;
a first plurality of memory dies over the redistribution structure;
a plurality of bridge dies over the redistribution structure;
a plurality of logic dies over the first plurality of memory dies and the plurality of bridge dies, wherein each of the plurality of bridge dies interconnects, and is overlapped by corner regions of, at least two of the plurality of logic dies; and
a second plurality of memory dies over and bonded to the plurality of logic dies, wherein the plurality of logic dies form a first array, and the second plurality of memory dies form a second array.
14. The package of claim 13 , wherein the first plurality of memory dies are identical to each other, the second plurality of memory dies are identical to each other, the plurality of logic dies are identical to each other, and the plurality of bridge dies are identical to each other.
15. The package of claim 13 , wherein the plurality of bridge dies further comprise capacitors therein.
16. The package of claim 13 further comprising:
a first encapsulant encapsulating the first plurality of memory dies therein;
a second encapsulant encapsulating the plurality of logic dies therein, wherein the plurality of logic dies have bottom surfaces contacting a top surface of the first encapsulant; and
a third encapsulant encapsulating the second plurality of memory dies therein.
17. The package of claim 16 , wherein the third encapsulant is in physical contact with the second encapsulant.
18. A package comprising:
a reconstructed wafer comprising:
a redistribution structure comprising a plurality of redistribution lines;
a plurality of bridge dies over and bonded to the redistribution structure;
a plurality of logic dies over and bonded to the plurality of bridge dies, wherein at least one of the plurality of bridge dies is bonded to corner regions of four of the plurality of logic dies; and
a plurality of memory dies, wherein the plurality of memory dies are bonded to the plurality of logic dies.
19. The package of claim 18 further comprising a package component bonding to the reconstructed wafer.
20. The package of claim 19 further comprising a socket bonding to the package component.