Stack package including core die stacked over a controller die
A stack package includes a core die disposed over a package substrate, and a controller die disposed between the core die and the package substrate to control the core die. The core die includes banks each including memory cell arrays, an interbank region in which row decoders and column decoders are arranged, and a pad region in which first connection pads electrically connected to the row decoders and column decoders through first wirings are disposed. The controller die includes a through via region in which controller die through vias penetrating the controller die to be connected to the first connection pads are disposed, and a circuit region in which controlling circuitry electrically connected to the controller die through vias through second wirings is disposed.
1. A stack package comprising:
a first core die disposed over a package substrate;
a second core die disposed over the first core die;
a controller die disposed between the first core die and the package substrate, and controlling the first and second core dies; and
a bridge die spaced apart from the controller die,
wherein the first core die comprises:
first banks each including first memory cell arrays;
a first pad region in which first connection pads and first core die through vias are arranged; and
a first interbank region in which first row decoders and first column decoders electrically connected to the first connection pads through first wirings, second connection pads electrically connected to the first row decoders and first column decoders, and second core die through vias are arranged, and
wherein the controller die comprises:
a through via region in which controller die through vias penetrating the controller die to be connected to the first connection pads are disposed; and
a circuit region in which controlling circuitry electrically connected to the controller die through vias through second wirings are disposed, and
wherein the bridge die electrically connects the package substrate to the first row decoders and first column decoders through the second connection pads.
2. The stack package of claim 1 , wherein the first core die through vias are connected to the first connection pads and penetrate the first core die to be connected to the second core die, and
wherein the second core die through vias are connected to the second connection pads and penetrate the first core die to be connected to the second core die.
3. The stack package of claim 2 , wherein the first core die through vias are disposed to overlap the first connection pads, and the second core die through vias are disposed to overlap the second connection pads.
4. The stack package of claim 1 , wherein the second core die comprises:
second banks each including second memory cell arrays;
a second pad region in which third connection pads connected to the first core die through vias are disposed; and
a second interbank region in which second row decoders and second column decoders electrically connected to the third connection pads through third wirings, fourth connection pads electrically connected to the second row decoders and second column decoders are arranged.
5. The stack package of claim 1 , wherein the bridge die is disposed between the first core die and the package substrate,
wherein the bridge die comprises:
a bridge die body; and
bridge die through vias substantially penetrating the bridge die body to electrically connect the second connection pads to the package substrate.
6. The stack package of claim 5 , wherein the bridge die through vias are disposed at positions vertically overlapped with the second connection pads.
7. The stack package of claim 5 , wherein the bridge die through vias are disposed at positions substantially offset in the horizontal direction from the second connection pads,
wherein the bridge die further comprises redistribution layer patterns electrically connected to the offset bridge die through vias and extending to positions vertically overlapped with the second connection pads.
8. The stack package of claim 7 , wherein each of the redistribution layer patterns extends to the plurality of bridge die through vias so that the plurality of bridge die through vias are electrically connected to one of the second connection pads.
9. The stack package of claim 8 , further comprising inner connectors that electrically connect the redistribution layer patterns to each other, overlap substantially vertically the second connection pads, and are positioned at positions offset from the bridge die through vias in a substantially horizontal direction.
10. The stack package of claim 1 , wherein the controller circuitry comprises:
at least one command circuit configured for receiving and decoding an external command signal;
at least on address circuit configured for receiving an external address signal; and
at least one input and output circuit.