Vibration removal apparatus and method for dual-microphone earphones

Inventors: Lei Zhang (Shenzhen, CN); Fengyun Liao (Shenzhen, CN); Xin Qi (Shenzhen, CN); Yueqiang Wang (Shenzhen, CN); Haofeng Zhang (Shenzhen, CN)

Assignee: SHENZHEN SHOKZ CO., LTD.

H04R1/1083 G10K11/178 G10K2210/1081 G10K2210/129 H04R2410/05

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Quick Facts

Patent No.: US 11,509,994
App. No.: 17/244,985
Granted: Nov 22, 2022
Kind: B2

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Abstract

The present disclosure provides a microphone apparatus. The microphone apparatus may include a microphone and a vibration sensor. The microphone may be configured to receive a first signal including a voice signal and a first vibration signal. The vibration sensor may be configured to receive a second vibration signal. And the microphone and the vibration sensor are configured such that the first vibration signal may be offset with the second vibration signal.

Claims (48)

1. An earphone system, comprising:

a first microphone configured to receive a first signal including a first valid signal originating from a sound source and a first noise signal; and

a second microphone configured to receive a second signal including a second valid signal originating from the sound source and a second noise signal, wherein:

a proportion of the second noise signal in the second signal is greater than a proportion of the first noise signal in the first signal,

the first microphone and the second microphone are configured such that the first noise signal in the first signal can be offset with the second noise signal in the second signal,

each of the first microphone and the second microphone is connected to a flexible circuit board,

the flexible circuit board includes a main circuit board, a first branch circuit board, and a second branch circuit board,

each of the first branch circuit board and the second branch circuit board is connected to the main circuit board,

the first microphone is disposed on an end of the first branch circuit board away from the main circuit board, and

the second microphone is disposed on an end of the second branch circuit board away from the main circuit board.

2. The earphone system of claim 1 , wherein

the earphone system further includes a housing for accommodating the first microphone and the second microphone,

the housing includes a peripheral side wall and a bottom end wall,

the first microphone is mounted on the bottom end wall, and

the second microphone is mounted on the peripheral side wall.

3. The earphone system of claim 1 , wherein

the first noise signal includes a first vibration signal originating from a vibration of a vibration source, and

the second noise signal includes a second vibration signal originating from the vibration.

4. The earphone system of claim 3 , wherein

an amplitude-frequency response of the second microphone to the second vibration signal is same as an amplitude-frequency response of the first microphone to the first vibration signal and/or a phase-frequency response of the second microphone to the second vibration signal is same as a phase-frequency response of the first microphone to the first vibration signal.

5. The earphone system of claim 3 , wherein a cavity volume of the second microphone is larger than a cavity volume of the first microphone such that the first microphone and the second microphone have an approximately same frequency response to the vibration of the vibration source.

6. The earphone system of claim 1 , wherein the cavity volume of the second microphone is proportional to the cavity volume of the first microphone.

7. The earphone system of claim 6 , wherein a ratio of the cavity volume of the second microphone to the cavity volume of the first microphone is in a range of 3:1 to 6.5:1.

8. The earphone system of claim 1 , wherein the earphone system further includes a signal processing unit configured to make the first noise signal offset with the second noise signal and output the first valid signal.

9. The earphone system of claim 1 , wherein the first microphone is a front cavity opening earphone or a back cavity opening earphone, the front cavity opening earphone including at least one opening on a top or a side wall of a front cavity.

10. The earphone system of claim 9 , wherein the second microphone include at least one of a closed microphone or a dual-link microphone, the closed microphone having a closed front cavity and a closed back cavity, the dual-link microphone having an open front cavity and an open back cavity.

11. The earphone system of claim 1 , wherein the first microphone is an air conduction microphone and the second microphone is a bone conduction microphone.

12. The earphone system of claim 1 , wherein the first microphone and the second microphone are both micro-electromechanical system microphones.

13. The earphone system of claim 1 , wherein

a pad is disposed at the end of the second branch circuit board away from the main circuit board, and

the pad has a same orientation as the second microphone.

14. The earphone system of claim 1 , wherein the second branch circuit board extends perpendicular to the main circuit board.

15. The earphone system of claim 1 , wherein

the first microphone and the second microphone are disposed on a first side of the flexible circuit board, and

a microphone rigid support plate for supporting the first microphone and the second microphone is disposed on a second side of the flexible circuit board.

16. The earphone system of claim 15 , wherein the microphone rigid support plate includes a first rigid support plate for supporting the microphone and a second rigid support plate for supporting the second microphone.

17. The earphone system of claim 1 , wherein the earphone system includes a waterproof membrane component having functions of waterproofing and transmitting sound.

18. A microphone apparatus, comprising: