Gas enclosure assembly and system
The present teachings relate to various embodiments of a hermetically-sealed gas enclosure assembly and system that can be readily transportable and assemblable and provide for maintaining a minimum inert gas volume and maximal access to various devices and apparatuses enclosed therein. Various embodiments of a hermetically-sealed gas enclosure assembly and system of the present teachings can have a gas enclosure assembly constructed in a fashion that minimizes the internal volume of a gas enclosure assembly, and at the same time optimizes the working space to accommodate a variety of footprints of various OLED printing systems. Various embodiments of a gas enclosure assembly so constructed additionally provide ready access to the interior of a gas enclosure assembly from the exterior during processing and readily access to the interior for maintenance, while minimizing downtime.
1. A method comprising:
depositing a material on a surface of a substrate supported above a floatation support of an inkjet printing system located in an interior of a gas enclosure assembly comprising an interior ceiling and a bottom interior periphery, the surface facing away from the floatation support;
while depositing the material:
circulating inert gas in the interior of the gas enclosure assembly from a top of the interior to a bottom of the interior,
maintaining a positive pressure within the gas enclosure assembly, and
filtering particulate matter from the inert gas circulated in the interior.
2. The method of claim 1 , further comprising flowing at least a portion of the inert gas from the interior through a gas purification system and back into the interior of the gas enclosure assembly.
3. The method of claim 1 , further comprising flowing the inert gas through a gas purification system to remove one or more reactive species entrained by the inert gas during circulating of the inert gas through the interior.
4. The method of claim 3 , wherein the gas purification system is exterior to the gas enclosure assembly.
5. The method of claim 3 , wherein the inert gas is used to support the substrate above the floatation support.
6. The method of claim 3 , wherein the one or more reactive species cause contamination, oxidation, and damage of material deposited on the substrate and/or the substrate.
7. The method of claim 3 , wherein the one or more reactive species are water vapor, oxygen, organic solvent vapor, or a combination thereof.
8. The method of claim 1 , wherein circulating the inert gas in the interior of the gas enclosure assembly comprises circulating the inert gas in a substantially laminar flow.
9. The method of claim 1 , wherein the inert gas is selected from nitrogen, a noble gas, and a combination thereof.
10. A method comprising:
depositing a material on a surface of a substrate supported above a floatation support of an inkjet printing system located in an interior of a gas enclosure assembly comprising an interior ceiling and a bottom interior periphery, the surface facing away from the floatation support;
while depositing the material:
circulating inert gas in the interior of the gas enclosure assembly from a top of the interior across the gas enclosure assembly to a bottom of the interior,
circulating inert gas through a duct housing a service bundle in the interior of the gas enclosure assembly,
maintaining a positive pressure within the gas enclosure assembly, and
filtering particulate matter from the inert gas circulated in the interior.
11. The method of claim 10 , further comprising flowing at least a portion of the inert gas from the interior through a gas purification system and back into the interior of the gas enclosure assembly.
12. The method of claim 11 , wherein the inert gas is used to support the substrate above the floatation support.
13. The method of claim 10 , wherein depositing the material on the substrate comprises depositing a material forming part of an organic light-emitting device on the substrate.
14. The method of claim 13 , wherein circulating the inert gas in the interior of the gas enclosure assembly comprises circulating the inert gas in a substantially laminar flow.
15. The method of claim 13 , wherein the substrate has a size of about 60 cm×72 cm to about 220 cm×250 cm.
16. The method of claim 10 , further comprising supplying inert gas to at least one pneumatic device in the interior of the gas enclosure assembly while depositing the material on the substrate.
17. The method of claim 10 , further comprising removing one or more reactive species from the inert gas using a gas purification system located outside the gas enclosure assembly.
18. A method comprising:
depositing a material on a surface of a substrate supported above a floatation support of an inkjet printing system located in an interior of a gas enclosure assembly, the surface facing away from the floatation support;
while depositing the material:
circulating inert gas in the interior of the gas enclosure assembly from a ceiling of the interior to a bottom periphery of the interior,
circulating inert gas through a duct housing a service bundle in the interior of the gas enclosure assembly,
maintaining a positive pressure within the gas enclosure assembly,
filtering particulate matter from the inert gas circulated in the interior, and removing reactive gas species from the inert gas.
19. The method of claim 18 , wherein depositing the material on the substrate comprises depositing a material forming part of an organic light-emitting device on the substrate.
20. The method of claim 18 , wherein circulating the inert gas in the interior of the gas enclosure assembly comprises circulating the inert gas in a substantially laminar flow.