Method for manufacturing silicon carbide epitaxial substrate and method for manufacturing silicon carbide semiconductor device
A first main surface is a (000-1) plane or a plane inclined by an angle of less than or equal to 8° relative to the (000-1) plane. A substrate placement surface has an area of more than or equal to 697 cm 2 and less than or equal to 1161 cm 2 . When an X axis indicates a first value and a Y axis indicates a second value, the first value and the second value fall within a hexagonal region surrounded by first coordinates, second coordinates, third coordinates, fourth coordinates, fifth coordinates and sixth coordinates in XY plane coordinates, where the first coordinates are (0.038, 0.0019), the second coordinates are (0.069, 0.0028), the third coordinates are (0.177, 0.0032), the fourth coordinates are (0.038, 0.0573), the fifth coordinates are (0.069, 0.0849), and the sixth coordinates are (0.177, 0.0964).
1. A method for manufacturing a silicon carbide epitaxial substrate, the method comprising:
preparing
a susceptor having a substrate placement surface,
a silicon carbide single-crystal substrate having a first main surface and a second main surface opposite to the first main surface, and
a reaction chamber in which the susceptor is disposed;
placing the silicon carbide single-crystal substrate on the substrate placement surface such that the second main surface faces the substrate placement surface; and
forming a silicon carbide layer on the first main surface by supplying a mixed gas including carbon atoms, silane, ammonia and hydrogen to the reaction chamber, wherein
the first main surface is a (000-1) plane or a plane inclined by an angle of less than or equal to 8° relative to the (000-1) plane,
the substrate placement surface has an area of more than or equal to 697 cm 2 and less than or equal to 1161 cm 2 ,
in the forming of the silicon carbide layer, when an X axis indicates a first value representing, in percentage, a value obtained by dividing a flow rate of the silane by a flow rate of the hydrogen, and a Y axis indicates a second value representing a flow rate of the ammonia in sccm, the first value and the second value fall within a hexagonal region surrounded by first coordinates, second coordinates, third coordinates, fourth coordinates, fifth coordinates and sixth coordinates in XY plane coordinates,
the first coordinates are (0.038, 0.0019),
the second coordinates are (0.069, 0.0028),
the third coordinates are (0.177, 0.0032),
the fourth coordinates are (0.038, 0.0573),
the fifth coordinates are (0.069, 0.0849),
the sixth coordinates are (0.177, 0.0964), and
after the forming of the silicon carbide layer, an average value of carrier concentration in the silicon carbide layer is more than or equal to 1×10 15 cm −3 and less than or equal to 3×10 16 cm −3 .
2. A method for manufacturing a silicon carbide epitaxial substrate, the method comprising:
preparing
a susceptor having a substrate placement surface,
a silicon carbide single-crystal substrate having a first main surface and a second main surface opposite to the first main surface, and
a reaction chamber in which the susceptor is disposed;
placing the silicon carbide single-crystal substrate on the substrate placement surface such that the second main surface faces the substrate placement surface; and
forming a silicon carbide layer on the first main surface by supplying a mixed gas including carbon atoms, silane, ammonia and hydrogen to the reaction chamber, wherein
the first main surface is a (000-1) plane or a plane inclined by an angle of less than or equal to 8° relative to the (000-1) plane,
the substrate placement surface has an area of more than or equal to 697 cm 2 and less than or equal to 1161 cm 2 ,
in the forming of the silicon carbide layer, when an X axis indicates a first value representing, in cm −2 , a value obtained by dividing a value, which is obtained by dividing a flow rate of the silane by a flow rate of the hydrogen, by the area, and a Y axis indicates a second value representing a flow rate of the ammonia in sccm, the first value and the second value fall within a hexagonal region surrounded by first coordinates, second coordinates, third coordinates, fourth coordinates, fifth coordinates and sixth coordinates in XY plane coordinates,
the first coordinates are (4.10×10 −7 , 0.0019),
the second coordinates are (7.44×10 −7 , 0.0028),
the third coordinates are (1.91×10 −6 , 0.0032),
the fourth coordinates are (4.10×10 −7 , 0.0573),
the fifth coordinates are (7.44×10 −7 , 0.0849),
the sixth coordinates are (1.91×10 −6 , 0.0964), and
after the forming of the silicon carbide layer, an average value of carrier concentration in the silicon carbide layer is more than or equal to 1×10 15 cm −3 and less than or equal to 3×10 16 cm −3 .
3. A method for manufacturing a silicon carbide semiconductor device, the method comprising:
preparing the silicon carbide epitaxial substrate manufactured with the method according to claim 1 ; and
processing the silicon carbide epitaxial substrate.
4. A method for manufacturing a silicon carbide semiconductor device, the method comprising:
preparing the silicon carbide epitaxial substrate manufactured with the method according to claim 2 ; and
processing the silicon carbide epitaxial substrate.