IP Library › Granted Patent US 12,214,644
Granted Patent B2
US 12,214,644 · App. 17/269,288 · Granted Feb 4, 2025

Thermal management arrangement for vehicles and method for operating a thermal management arrangement

Inventor: Peter Heyl (Cologne, DE)
Assignee: HANON SYSTEMS
B60H1/00899B60H1/00021B60H1/00278B60H1/00492B60H1/00907B60H1/06B60H1/143B60H1/26B60H1/3213B60H1/3228B60H1/32284F25B9/008F25B25/005F25B30/02B60H2001/00307B60H2001/00928B60H2001/00949F25B40/00F25B2339/047F25B2400/121
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Quick Facts
Patent No.
US 12,214,644
App. No.
17/269,288
Filed
Feb 18, 2021
Granted
Feb 4, 2025
Kind
B2
Art Unit
3763
USPC
62/79
Abstract

A thermal management arrangement for vehicles includes a refrigerant circuit having a chiller function and/or heat pump function and a heat carrier network for cooling and/or heating components of the vehicle. The heat carrier network has a heat carrier reservoir and a plurality of heat carrier supply segments fed from the heat carrier reservoir. A separately controlled and regulated ambient heat exchanger supply segment implements a circuit having a central low-temperature ambient heat exchanger and least one heat carrier reservoir.

Claims (19)

1. A thermal management arrangement for a vehicle comprising:

a refrigerant circuit; and

a heat carrier network controlling a temperature of components of the vehicle, wherein the heat carrier network further comprises:

a heat carrier reservoir; and

a plurality of heat carrier supply segments fed from the heat carrier reservoir, wherein a separately controlled and regulated ambient heat carrier supply segment provides a circuit having a central low-temperature ambient heat exchanger and the heat carrier reservoir, and wherein a heat carrier fluid is supplied with heat from a surrounding area by means of the ambient heat carrier supply segment, or heat from the heat carrier fluid is emitted to the surrounding area from the heat carrier reservoir by means of the low-temperature ambient heat exchanger.

2. The thermal management arrangement according to claim 1 , wherein the heat carrier reservoir and a heat carrier pump are disposed in series.

3. The thermal management arrangement according to claim 1 , wherein a storage medium is disposed in the heat carrier reservoir, or in series or parallel to the heat carrier network.

4. The thermal management arrangement according to claim 1 ,

wherein a separately controlled and regulated evaporator heat carrier supply segment provides a circuit having at least one of the heat carrier reservoir, component heat exchangers, a battery heat exchanger, and an evaporator of the refrigerant circuit.

5. The thermal management arrangement according to claim 1 , wherein a separately controlled and regulated evaporator heat carrier supply segment provides a circuit having a battery heat exchanger and an evaporator of the refrigerant circuit, and wherein a heat carrier pump is disposed downstream of the evaporator in the evaporator heat carrier supply segment.

6. The thermal management arrangement according to claim 1 , wherein a separately controlled and regulated condenser heater heat carrier supply segment provides a circuit having a condenser of the refrigerant circuit and a heater heat exchanger, and

wherein a heat carrier pump is disposed in the condenser heater heat carrier supply segment.

7. The thermal management arrangement according to claim 1 , wherein a separately controlled and regulated component cooler heat carrier supply segment provides a circuit having the heat carrier reservoir and component heat exchangers.

8. The thermal management arrangement according to claim 1 , wherein a separately controlled and regulated condenser cooler heat carrier supply segment provides a circuit having the heat carrier reservoir, a condenser of the refrigerant circuit, and a heater heat exchanger.

9. The thermal management arrangement according to claim 1 ,

wherein a separately controlled and regulated cooler heat carrier supply segment provides a circuit having at least one of an evaporator of the refrigerant circuit, of a battery heat exchanger, and or a cooler.

10. The thermal management arrangement according to claim 1 ,

wherein a separately controlled and regulated component heater heat carrier supply segment provides a circuit having at least one of the heat carrier reservoir, component heat exchangers, or a battery heat exchanger, a cooler, and an evaporator of the refrigerant circuit.

11. The thermal management arrangement according to claim 1 , wherein the refrigerant used in the refrigerant circuit is selected from the group consisting of R290, R1270, R134a, R152a, R1234yf, R744, and R600a.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 18, 2021
From: HEYL, PETER
To: HANON SYSTEMS
Reel/Frame 055310/0921 →
Priority Claims (1)
DE 10 2018 121 390.5 · Sep 3, 2018 · national
Continuity (1)
Related Publication 20210252940A1 · Aug 19, 2021
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