Adhesive agent composition, layered product and production method for layered product, and method for reducing thickness of semiconductor forming substrate

1. An adhesive composition for forming an adhesive layer that can bond a first substrate formed of a semiconductor-forming substrate to a second substrate formed of a support substrate in a peelable manner,

the composition comprising

a component (A) which is cured through hydrosilylation and

a peeling component (B) which contains a component containing an epoxy-modified polyorganosiloxane having an epoxy value of 0.1 to 5, wherein

the component (A) comprises

a polysiloxane (A1) having one or more units selected from the group consisting of a siloxane unit represented by SiO 2 (unit Q), a siloxane unit represented by R 1 R 2 R 3 SiO 1/2 (unit M), a siloxane unit represented by R 4 R 5 SiO 2/2 (unit D), and a siloxane unit represented by R 6 SiO 3/2 (unit T) (wherein each of R 1 to R 6 is a group or an atom bonded to a silicon atom and represents an alkyl group, an alkenyl group, or a hydrogen atom) and

a platinum group metal catalyst (A2); and

the polysiloxane (A1) comprises:

a polyorganosiloxane (a1) having one or more units selected from the group consisting of a siloxane unit represented by SiO 2 (unit Q′), a siloxane unit represented by R 1′ R 2′ R 3′ SiO 1/2 (unit M′), a siloxane unit represented by R 4′ R 5′ SiO 2/2 (unit D′), and a siloxane unit represented by R 6′ SiO 3/2 (unit T′), and at least one unit selected from the group consisting of unit M′, unit D′, and unit T′ (wherein each of R′ to R 6′ is a group bonded to a silicon atom and represents an alkyl group or an alkenyl group, and at least one of R′ to R 6′ is an alkenyl group), and

a polyorganosiloxane (a2) having one or more units selected from the group consisting of a siloxane unit represented by SiO 2 (unit Q″), a siloxane unit represented by R 1″ R 2″ R 3″ SiO 1/2 (unit M″), a siloxane unit represented by R 4″ R 5″ SiO 2/2 (unit D″), and a siloxane unit represented by R 6″ SiO 3/2 (unit T″), and at least one unit selected from the group consisting of unit M″, unit D″, and unit T″, and having a functional group (Si—H) content of 5.0 mol/kg or greater (wherein each of R 1″ to R 6″ is a group or an atom bonded to a silicon atom and represents an alkyl group or a hydrogen atom, and at least one of R 1″ to R 6″ is a hydrogen atom).

2. A laminate comprising

a first substrate formed of a semiconductor-forming substrate,

a second substrate formed of a support substrate, and

an adhesive layer which is provided between the first substrate and the second substrate and which bonds the two substrates in a peelable manner,

wherein the adhesive layer is a cured film formed by use of the adhesive composition as recited in claim 1 .

3. A method for producing a laminate, the method comprising:

applying the adhesive composition as recited in claim 1 onto a first substrate formed of a semiconductor-forming substrate or a second substrate formed of a support substrate, to thereby form an adhesive coating layer, and

adhering the first substrate to the second substrate by the mediation of the adhesive coating layer;

applying a load to the first substrate and the second substrate in a thickness direction, to thereby closely bind the first substrate, the adhesive layer, and the second substrate, while at least one of a heat treatment and a reduced pressure treatment is performed; and then

performing a post-heat treatment.

4. A method for thinning a semiconductor-forming substrate, the method comprising:

applying the adhesive composition as recited in claim 1 onto a first substrate formed of a semiconductor-forming substrate or a second substrate formed of a support substrate, to thereby form an adhesive coating layer,

adhering the first substrate to the second substrate by the mediation of the adhesive coating layer;

applying a load to the first substrate and the second substrate in a thickness direction, to thereby closely bind the first substrate, the adhesive layer, and the second substrate, while at least one of a heat treatment and a reduced pressure treatment is performed; and then

performing a post-heat treatment, to thereby form a laminate, and

performing a thinning treatment on the first substrate of the laminate.