Method of manufacturing laminate and kit of adhesive compositions
A method of manufacturing a laminate includes forming a first adhesive coating layer on a surface of a support substrate; forming a second adhesive coating layer on a surface of a semiconductor substrate; and bonding the first and second adhesive coating layer, followed by heating, to form an adhesive layer from the first adhesive coating layer and the second adhesive coating layer, wherein the first adhesive coating layer is formed from a first adhesive composition, the second adhesive coating layer is formed from a second adhesive composition, and one of the first adhesive composition and the second adhesive composition contains a first thermosetting component and a second thermosetting component that reacts with the first thermosetting component in the presence of a catalyst, and the other contains the catalyst, and at least one of the first adhesive composition and the second adhesive composition contains a release agent component.
1 . A method of manufacturing a laminate, the method comprising:
forming a first adhesive coating layer on a surface of a support substrate;
forming a second adhesive coating layer on a surface of a semiconductor substrate; and
bonding the first adhesive coating layer and the second adhesive coating layer, followed by heating, to form an adhesive layer from the first adhesive coating layer and the second adhesive coating layer, wherein
the first adhesive coating layer is formed from a first adhesive composition,
the second adhesive coating layer is formed from a second adhesive composition,
the first adhesive composition and the second adhesive composition satisfy the following (1) or (2):
(1): the first adhesive composition contains a first thermosetting component, and a second thermosetting component that reacts with the first thermosetting component in the presence of a catalyst, the second adhesive composition contains the catalyst, and at least one of the first adhesive composition and the second adhesive composition contains a release agent component, the release agent component being a non-curable polyorganosiloxane having a kinematic viscosity of 1,000 to 2,000,000 mm 2 /s; and
(2): the second adhesive composition contains a first thermosetting component, and a second thermosetting component that reacts with the first thermosetting component in the presence of a catalyst, the first adhesive composition contains the catalyst, and at least one of the first adhesive composition and the second adhesive composition contains a release agent component, the release agent component being a non-curable polyorganosiloxane having a kinematic viscosity of 1,000 to 2,000,000 mm 2 /s.
2 . The method of manufacturing a laminate according to claim 1 , wherein the first thermosetting component has an alkenyl group having 2 to 40 carbon atoms bonded to a silicon atom,
the second thermosetting component has a Si—H group, and
the catalyst includes a platinum group metal-based catalyst (A2).
3 . The method of manufacturing a laminate according to claim 2 , wherein the first thermosetting component includes a polyorganosiloxane (a1) having an alkenyl group having 2 to 40 carbon atoms bonded to a silicon atom, and
the second thermosetting component includes a polyorganosiloxane (a2) having a Si—H group.
4 . A method of manufacturing a processed semiconductor substrate, the method comprising:
processing the semiconductor substrate of the laminate manufactured by the method of manufacturing a laminate according to claim 1 ; and
separating the processed semiconductor substrate and the support substrate from each other.