Etching isolation features and dense features within a substrate
Systems and methods for etching different features in a substantially equal manner are described. One of the methods includes applying a low frequency bias signal during a low TCP state and applying a high frequency bias signal during a high TCP state. The application of the low frequency bias signal during the low TCP state facilitates generation of hot neutrals, which are used to increase an etch rate of etching dense features compared to an etch rate for etching isolation features. The application of the high frequency bias signal during the high TCP state facilitates generation of ions to increase an etch rate of etching the isolation features compared to an etch rate of etching the dense features. After applying the low frequency bias signal during the low TCP state and the high frequency bias signal during the high TCP state, the isolation and dense features are etched similarly.
1. A system for etching isolation and dense features within a substrate, comprising:
a low frequency radio frequency (RF) generator configured to supply a low frequency bias RF signal to a first impedance matching circuit;
a high frequency RF generator configured to supply a high frequency bias RF signal to the first impedance matching circuit; and
a transformer coupled plasma (TCP) RF generator configured to pulse a TCP RF signal between a low TCP state and a high TCP state to provide the TCP RF signal to a second impedance matching circuit, wherein the low frequency bias RF signal is supplied during the low TCP state to etch the dense features and the high frequency bias RF signal is supplied during the high TCP state to etch the isolation features.
2. The system of claim 1 , wherein low frequency RF generator is configured to maintain the low frequency bias RF signal in an off state during the high TCP state, and wherein the high frequency RF generator is configured to maintain the high frequency bias RF signal in an off state during the low TCP state.
3. The system of claim 1 ,
wherein the first impedance matching circuit is configured to output a modified bias RF signal to a plasma chamber upon receiving the low and high frequency bias RF signals, and
wherein the second impedance matching circuit is configured to output a modified TCP RF signal to the plasma chamber upon receiving the TCP RF signal.
4. The system of claim 1 , wherein the low frequency RF generator is configured to pulse the low frequency bias RF signal during the low TCP state, and wherein the high frequency RF generator is configured to pulse the high frequency bias RF signal during the high TCP state.
5. The system of claim 1 , wherein the low frequency RF generator is configured to pulse the low frequency bias RF signal during the low TCP state from a low state to a medium state and from the medium state to a high state, and wherein the high frequency RF generator is configured to pulse the high frequency bias RF signal during the high TCP state from a low state to a high state.
6. The system of claim 5 , wherein the low frequency RF generator is configured to pulse the low frequency bias RF signal from the high state to an off state, and wherein the high frequency RF generator is configured to pulse the high frequency bias RF signal from the high state to an off state.
7. The system of claim 1 , wherein the low frequency RF generator is configured to pulse the low frequency bias RF signal during the low TCP state from a low state to a high state, and wherein the high frequency RF generator is configured to maintain the high frequency bias RF signal in an on state during the high TCP state.
8. The system of claim 7 , wherein the low frequency RF generator is configured to pulse the low frequency bias RF signal from the high state to an off state, and wherein the high frequency RF generator is configured to pulse the high frequency bias RF signal from the on state to an off state.
9. The system of claim 1 , wherein the low frequency RF generator is configured to maintain the low frequency bias RF signal in an on state during the low TCP state, and wherein the high frequency RF generator is configured to maintain the high frequency bias RF signal in an on state during the high TCP state.
10. The system of claim 9 , wherein the low frequency RF generator is configured to pulse the low frequency bias RF signal from the on state to an off state, and wherein the high frequency RF generator is configured to pulse the high frequency bias RF signal from the on state to an off state.
11. A controller for etching isolation and dense features within a substrate, comprising:
one or more processors configured to:
control a low frequency radio frequency (RF) generator to supply a low frequency bias RF signal to a first impedance matching circuit,
control a high frequency RF generator to supply a high frequency bias RF signal to the first impedance matching circuit, and
control a transformer coupled plasma (TCP) RF generator to pulse a TCP RF signal between a low TCP state and a high TCP state and to provide the TCP RF signal to a second impedance matching circuit,
wherein the one or more processors are further configured to:
control the low frequency RF generator to supply the low frequency bias RF signal during the low TCP state to etch the dense features; and
control the high frequency RF generator to supply the high frequency bias RF signal during the high TCP state to etch the isolation features; and
a memory device coupled to the one or more processors, wherein the memory device is configured to store a parameter level for the low TCP state and a parameter level for the high TCP state.
12. The controller of claim 11 , wherein the one or more processors are further configured to:
control the low frequency RF generator to maintain the low frequency bias RF signal in an off state during the high TCP state; and
control the high frequency RF generator to maintain the high frequency bias RF signal in an off state during the low TCP state.
13. The controller of claim 11 , wherein the one or more processors are configured to:
control the low frequency RF generator to pulse the low frequency bias RF signal during the low TCP state to decrease an angular spread of high energy neutrals; and
control the high frequency RF generator to pulse the high frequency bias RF signal during the high TCP state to decrease an angular spread of ions.
14. The controller of claim 11 , wherein the one or more processors are configured to:
control the low frequency RF generator to pulse the low frequency bias RF signal during the low TCP state from a low state to a medium state and from the medium state to a high state; and
control the high frequency RF generator to pulse the high frequency bias RF signal during the high TCP state from a low state to a high state.
15. The controller of claim 14 , wherein the one or more processors are configured to:
control the low frequency RF generator to pulse the low frequency bias RF signal from the high state to an off state; and
control the high frequency RF generator to pulse the high frequency bias RF signal from the high state to an off state.
16. The controller of claim 11 , wherein the one or more processors are configured to:
control the low frequency RF generator to pulse the low frequency bias RF signal during the low TCP state from a low state to a high state; and
control the high frequency RF generator to maintain the high frequency bias RF signal in an on state during the high TCP state.
17. The controller of claim 16 , wherein the one or more processors are configured to:
control the low frequency RF generator to pulse the low frequency bias RF signal from the high state to an off state; and
control the high frequency RF generator to pulse the high frequency bias RF signal from the on state to an off state.
18. The controller of claim 11 , wherein the one or more processors are configured to:
control the low frequency RF generator to maintain the low frequency bias RF signal in an on state during the low TCP state; and
control the high frequency RF generator to maintain the high frequency bias RF signal in an on state during the high TCP state.
19. The controller of claim 18 , wherein the one or more processors are configured to:
control the low frequency RF generator to pulse the low frequency bias RF signal from the on state to an off state; and
control the high frequency RF generator to pulse the high frequency bias RF signal from the on state to an off state.