IP Library Granted Patent US 11,837,634
Granted Patent B2
US 11,837,634 · App. 17/305,098 · Granted Dec 5, 2023

Semiconductor device including superlattice with oxygen and carbon monolayers

Inventors: Keith Doran Weeks (Chandler, AZ); Nyles Wynn Cody (Tempe, AZ); Marek Hytha (Brookline, MA); Robert J. Mears (Wellesley, MA); Robert John Stephenson (Duxford, GB); Hideki Takeuchi (San Jose, CA)
Assignee: ATOMERA INCORPORATED
H01L29/152H01L29/66477H01L29/7849
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Quick Facts
Patent No.
US 11,837,634
App. No.
17/305,098
Granted
Dec 5, 2023
Kind
B2
Abstract

A semiconductor device may include a semiconductor layer and a superlattice adjacent the semiconductor layer. The superlattice may include a plurality of stacked groups of layers, with each group of layers comprising a plurality of stacked base semiconductor monolayers defining a base semiconductor portion, and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions. The at least one non-semiconductor monolayer in a first group of layers of the superlattice may comprise oxygen and be devoid of carbon, and the at least one non-semiconductor monolayer in a second group of layers of the superlattice may comprise carbon.

Claims (30)

1. A semiconductor device comprising:

a semiconductor layer; and

a superlattice adjacent the semiconductor layer and comprising a plurality of stacked groups of layers, each group of layers comprising a plurality of stacked base semiconductor monolayers defining a base semiconductor portion, and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions;

the at least one non-semiconductor monolayer in a first group of layers of the superlattice comprising oxygen and devoid of carbon, and the at least one non-semiconductor monolayer in a second group of layers of the superlattice comprising carbon, the second group of layers being above the first group of layers in the superlattice.

2. The semiconductor device of claim 1 wherein the semiconductor layer comprises a substrate below the superlattice; and further comprising a strained semiconductor layer above the superlattice.

3. The semiconductor device of claim 1 wherein the second group of layers of the superlattice comprises carbon and is devoid of oxygen.

4. The semiconductor device of claim 1 wherein the second group of layers of the superlattice comprises carbon and oxygen.

5. The semiconductor device of claim 1 further comprising source and drain regions on the semiconductor layer and defining a channel in the superlattice, and a gate above the superlattice.

6. The semiconductor device of claim 1 wherein the superlattice divides the semiconductor layer into a first region and a second region, with the first region having a same conductivity type and a different dopant concentration than the second region.

7. The semiconductor device of claim 1 further comprising a metal layer above the superlattice.

8. The semiconductor device of claim 1 wherein the superlattice divides the semiconductor layer into a first region and a second region, with the first region having a different conductivity type than the second region.

9. The semiconductor device of claim 1 wherein the base semiconductor portion comprises silicon.

10. A semiconductor device comprising:

a semiconductor layer; and

a superlattice adjacent the semiconductor layer and comprising a plurality of stacked groups of layers, each group of layers comprising a plurality of stacked base silicon monolayers defining a base silicon portion, and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base silicon portions;

the at least one non-semiconductor monolayer in a first group of layers of the superlattice comprising oxygen and devoid of carbon, and the at least one non-semiconductor monolayer in a second group of layers of the superlattice comprising carbon and devoid of oxygen, the second group of layers being above the first group of layers in the superlattice.

11. The semiconductor device of claim 10 wherein the semiconductor layer comprises a substrate below the superlattice; and further comprising a strained semiconductor layer above the superlattice.

12. The semiconductor device of claim 10 further comprising source and drain regions on the semiconductor layer and defining a channel in the superlattice, and a gate above the superlattice.

13. The semiconductor device of claim 10 wherein the superlattice divides the semiconductor layer into a first region and a second region, with the first region having a same conductivity type and a different dopant concentration than the second region.

14. The semiconductor device of claim 10 further comprising a metal layer above the superlattice.

15. The semiconductor device of claim 10 wherein the superlattice divides the semiconductor layer into a first region and a second region, with the first region having a different conductivity type than the second region.

16. A semiconductor device comprising:

a semiconductor layer; and

a superlattice adjacent the semiconductor layer and comprising a plurality of stacked groups of layers, each group of layers comprising a plurality of stacked base silicon monolayers defining a base silicon portion, and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base silicon portions;

the at least one non-semiconductor monolayer in a first group of layers of the superlattice comprising oxygen and devoid of carbon, and the at least one non-semiconductor monolayer in a second group of layers of the superlattice comprising carbon and oxygen, the second group of layers being above the first group of layers in the superlattice.

17. The semiconductor device of claim 16 wherein the semiconductor layer comprises a substrate below the superlattice; and further comprising a strained semiconductor layer above the superlattice.

18. The semiconductor device of claim 16 further comprising source and drain regions on the semiconductor layer and defining a channel in the superlattice, and a gate above the superlattice.

19. The semiconductor device of claim 16 wherein the superlattice divides the semiconductor layer into a first region and a second region, with the first region having a same conductivity type and a different dopant concentration than the second region.

20. The semiconductor device of claim 16 further comprising a metal layer above the superlattice.

21. The semiconductor device of claim 16 wherein the superlattice divides the semiconductor layer into a first region and a second region, with the first region having a different conductivity type than the second region.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 11, 2021
From: WEEKS, KEITH DORAN; CODY, NYLES WYNN; HYTHA, MAREK; MEARS, ROBERT J.; STEPHENSON, ROBERT JOHN; TAKEUCHI, HIDEKI
To: ATOMERA INCORPORATED
Reel/Frame 057147/0396 →
Continuity (2)
Provisional Application 63047356 · Jul 2, 2020
Related Publication 20220005926A1 · Jan 6, 2022
Cited By (4)
US 12,230,694 US 12,308,229 US 12,315,722 US 12,382,689