Apparatuses and packages including a semiconductor substrate with a plurality of photoelectronic conversion regions and a transparent substrate
Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan.
1. A package, comprising:
a semiconductor substrate;
a color filter layer at a light-incident side of the semiconductor substrate;
a transparent substrate disposed above a light incident side of the color filter layer;
a plurality of photoelectric conversion regions located in the semiconductor substrate;
a microlens layer, wherein the microlens layer is between the color filter layer and the transparent substrate, and wherein the microlens layer includes a plurality of microlenses; and
a resin layer between at least some of the microlenses of the microlens layer and the transparent substrate,
wherein the photoelectric conversion regions are included in an effective photosensitive region of the package,
wherein each of the photoelectric conversion regions is associated with one of the microlenses of the microlens layer,
wherein at least some of the microlenses of the microlens layer are in an effective photosensitive region-surrounding region that is outside of the effective photosensitive region of the package, and
wherein at least one of the microlenses in the effective photosensitive region-surrounding region has a same size and a same shape as at least one of the microlenses in the effective photosensitive region.
2. The package according to claim 1 , wherein the transparent substrate extends across the effective photosensitive region and the effective photosensitive region-surrounding region.
3. The package according to claim 1 , wherein the resin layer is between at least the microlenses of the microlens layer that are outside of the effective photosensitive region of the package and the transparent substrate.
4. The package according to claim 3 , further comprising a first material layer, wherein the first material layer extends between the microlens layer and the color filter layer.
5. The package according to claim 4 , wherein the first material layer extends across the effective photosensitive region of the package.
6. The package according to claim 5 , wherein the first material layer extends across the effective photosensitive region-surrounding region.
7. The package according to claim 6 , wherein the first material layer extends across an end portion outside of the effective photosensitive region-surrounding region.
8. The package according to claim 7 , wherein the first material layer is an organic material layer.
9. The package according to claim 1 , wherein the transparent substrate is a light transmitting plate.
10. The package according to claim 1 , further comprising a protective film between the transparent substrate and the microlens layer.
11. The package according to claim 1 , further comprising an interconnection layer, wherein the plurality of photoelectric conversion regions are in a layer that is between the interconnection layer and the color filter layer.
12. The package according to claim 1 , further comprising:
a silicon oxide film located at a light-incident side of the semiconductor substrate.
13. The package according to claim 12 , further comprising:
a light-shielding film located above the silicon oxide film.
14. The package according to claim 1 , further comprising:
a support substrate at a side of the semiconductor substrate that is opposite to the light-incident side of the semiconductor substrate.
15. The package according to claim 14 , further comprising:
a wiring layer between the semiconductor substrate and the support substrate.
16. The package according to claim 1 , wherein the package is a chip-size package.
17. An electronic apparatus, comprising:
a lens;
a signal processing circuit; and
a package including:
a semiconductor substrate;
a color filter layer at a light-incident side of the semiconductor substrate;
a transparent substrate disposed above a light incident side of the color filter layer;
a plurality of photoelectric conversion regions located in the semiconductor substrate;
a microlens layer, wherein the microlens layer is between the color filter layer and the transparent substrate, and wherein the microlens layer includes a plurality of microlenses; and
a resin layer between at least some of the microlenses of the microlens layer and the transparent substrate,
wherein the photoelectric conversion regions are included in an effective photosensitive region of the package,
wherein each of the photoelectric conversion regions is associated with one of the microlenses of the microlens layer,
wherein at least some of the microlenses of the microlens layer are in an effective photosensitive region-surrounding region that is outside of the effective photosensitive region of the package, and
wherein at least one of the microlenses in the effective photosensitive region-surrounding region has a same size and a same shape as at least one of the microlenses in the effective photosensitive region.
18. The electronic apparatus according to claim 17 , wherein the resin layer is between at least the microlenses of the microlens layer that are outside of the effective photosensitive region of the package and the transparent substrate.
19. The electronic apparatus according to claim 18 , further comprising a first material layer, wherein the first material layer extends between the microlens layer and the color filter layer.
20. The electronic apparatus according to claim 19 , wherein the first material layer extends across the effective photosensitive region of the package.