Laterally unconfined structure
View Patent ↗Techniques are employed to mitigate the anchoring effects of cavity sidewall adhesion on an embedded conductive interconnect structure, and to allow a lower annealing temperature to be used to join opposing conductive interconnect structures. A vertical gap may be disposed between the conductive material of an embedded interconnect structure and the sidewall of the cavity to laterally unpin the conductive structure and allow uniaxial expansion of the conductive material. Additionally or alternatively, one or more vertical gaps may be disposed within the bonding layer, near the embedded interconnect structure to laterally unpin the conductive structure and allow uniaxial expansion of the conductive material.
1. A microelectronic assembly, comprising:
a first substrate having a bonding surface, the bonding surface of the first substrate having a planarized topography;
a conductive seed layer disposed within a cavity of the first substrate and lining at least a portion of one or more sidewalls of the cavity;
one or more first conductive interconnect structures embedded within the cavity of the first substrate and exposed at the bonding surface of the first substrate;
a first vertical isolation gap disposed in the bonding surface of the first substrate, at least partially surrounding a perimeter of the one or more first conductive interconnect structures, and disposed between the conductive seed layer at the portion of the one or more sidewalls of the cavity and the one or more first conductive interconnect structures; and
a diffusion barrier layer disposed on one or more sides of the one or more first conductive interconnect structures.
2. The microelectronic assembly of claim 1 , wherein the vertical isolation gap is disposed between the diffusion barrier layer and the conductive seed layer at the portion of the one or more sidewalls of the cavity.
3. The microelectronic assembly of claim 2 , wherein the diffusion barrier layer comprises an electrically conductive material.
4. The microelectronic assembly of claim 2 , wherein the diffusion barrier layer comprises an electrically insulating material.
5. The microelectronic assembly of claim 1 , wherein the diffusion barrier layer is disposed on one or more sides of the one or more first conductive interconnect structures and disposed on the conductive seed layer at the portion of the one or more sidewalls of the cavity, and wherein the vertical isolation gap is disposed between the diffusion barrier layer at the one or more sides of the one or more first conductive interconnect structures and the diffusion barrier layer at the conductive seed layer at the portion of the one or more sidewalls of the cavity.
6. The microelectronic assembly of claim 1 , further comprising a second substrate having a bonding surface, the bonding surface of the second substrate having a planarized topography and directly bonded to the bonding surface of the first substrate without an adhesive; and
one or more second conductive interconnect structures embedded within a cavity of the second substrate and exposed at the bonding surface of the second substrate, the one or more second conductive interconnect structures directly bonded to the one or more first conductive interconnect structures.
7. The microelectronic assembly of claim 6 , further comprising a second vertical isolation gap disposed in the bonding surface of the second substrate, at least partially surrounding a perimeter of the one or more second conductive interconnect structures, and disposed between a portion of one or more sidewalls of the cavity of the second substrate and the one or more second conductive interconnect structures.
8. The microelectronic assembly of claim 6 , wherein the one or more second conductive interconnect structures and the one or more first conductive interconnect structures form one or more conductive interconnects, and wherein the first vertical isolation gap and the second vertical isolation gap form a continuous gap from within the first substrate to within the second substrate.
9. The microelectronic assembly of claim 8 , wherein the cavity of the second substrate is partly or fully lined with a conductive seed layer, and wherein the second vertical isolation gap is disposed between the conductive seed layer of the second substrate and the one or more second conductive interconnect structures.
10. A microelectronic assembly, comprising:
a first substrate having a bonding surface, the bonding surface of the first substrate having a planarized topography;
one or more first conductive interconnect structures embedded within a cavity of the first substrate and exposed at the bonding surface of the first substrate;
a first predetermined material layer disposed at one or more sides of the one or more first conductive interconnect structures, the first predetermined material layer comprising a diffusion barrier layer; and
a first vertical isolation gap disposed in the bonding surface of the first substrate, at least partially surrounding a perimeter of the one or more first conductive interconnect structures, and disposed between one or more sidewalls of the cavity and the first predetermined material layer on the one or more first conductive interconnect structures.
11. The microelectronic assembly of claim 10 , wherein the diffusion barrier layer is disposed on one or more sides of the one or more first conductive interconnect structures, and wherein the vertical isolation gap is disposed between the diffusion barrier layer and the one or more sidewalls of the cavity.
12. The microelectronic assembly of claim 11 , further comprising a diffusion barrier layer disposed on the one or more sidewalls of the cavity, and wherein the vertical isolation gap is disposed between the diffusion barrier layer at the one or more first conductive interconnect structures and the diffusion barrier layer at the one or more sidewalls of the cavity.
13. The microelectronic assembly of claim 11 , wherein the vertical isolation gap is filled with a compressible material, and wherein the compressible material is disposed between the diffusion barrier layer at the one or more first conductive interconnect structures and the one or more sidewalls of the cavity.
14. The microelectronic assembly of claim 13 , wherein the compressible material comprises a porous polymeric material.
15. The microelectronic assembly of claim 11 , wherein the vertical isolation gap is filled with an inert material, and wherein the inert material is disposed between the diffusion barrier layer at the one or more first conductive interconnect structures and the one or more sidewalls of the cavity, the inert material comprising one or more of epoxy, silicon nitride, diamond, aluminum oxide, or silicon oxide.
16. A microelectronic assembly, comprising:
a first substrate comprising a cavity in a bonding surface, the bonding surface of the first substrate having a planarized topography;
a barrier layer disposed within the cavity of the first substrate and lining at least a portion of one or more sidewalls of the cavity;
one or more first conductive interconnect structures embedded within the cavity of the first substrate and exposed at the bonding surface of the first substrate; and
a first vertical isolation gap disposed in the bonding surface of the first substrate, at least partially surrounding a perimeter of the one or more first conductive interconnect structures, and disposed between the barrier layer at the portion of the one or more sidewalls of the cavity and the one or more first conductive interconnect structures.