IP Library Granted Patent US 11,837,492
Granted Patent B2
US 11,837,492 · App. 17/317,585 · Granted Dec 5, 2023

Electrostatic chuck having a gas flow feature, and related methods

Inventors: Yan Liu (Lexington, MA); Jakub Rybczynski (Arlington, MA); Steven Donnell (Burlington, MA); Caleb Minsky (Medfield, MA); Chun Wang Chan (Somerville, MA)
Assignee: ENTEGRIS, INC.
H01L21/6833H01L21/67017H01L21/67109H01L21/67248
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Quick Facts
Patent No.
US 11,837,492
App. No.
17/317,585
Granted
Dec 5, 2023
Kind
B2
Abstract

Described are electrostatic chucks designed for use in supporting a workpiece during a workpiece processing step, the electrostatic chuck including a gas flow system.

Claims (54)

1. An electrostatic chuck assembly comprising:

a base layer that includes:

an upper base layer surface and a lower base layer surface;

a base layer device opening that extends through the base layer and that is adapted to contain a portion of a device that performs an operation of the electrostatic chuck assembly;

a gas flow conduit extending horizontally over an area of the base layer, the gas flow conduit comprising a conduit segment that connects with the base layer device opening; and

a gas flow inlet passing into the base layer and connected to the gas flow conduit,

further comprising embossments on the upper ceramic layer surface adapted to support a workpiece above the upper ceramic layer surface and form a gas flow layer between a lower surface of the workpiece and the upper ceramic layer surface.

2. The electrostatic chuck assembly of claim 1 , wherein the gas flow conduit comprises a channel at an upper surface of the base layer.

3. The electrostatic chuck assembly of claim 1 , further comprising a ceramic layer disposed above the base layer, the ceramic layer comprising:

an upper ceramic layer surface;

a lower ceramic layer surface;

multiple gas flow vents extending between the lower ceramic layer surface and the upper ceramic layer surface, the gas flow vents being in fluid communication with the gas flow conduit; and

a ceramic layer device opening extending through the ceramic layer, connected to the base layer device opening, and adapted to contain a portion of the device.

4. The electrostatic chuck assembly of claim 1 , wherein the gas flow conduit comprises a circular conduit segment and multiple radial conduit segments connected to the circular conduit segment.

5. The electrostatic chuck assembly of claim 1 , wherein the device is adapted to perform a movement, affect a condition, or perform a measurement.

6. The electrostatic chuck assembly of claim 1 , wherein the device is a measurement device.

7. The electrostatic chuck assembly of claim 1 , wherein the device is a moveable probe.

8. The electrostatic chuck assembly of claim 1 , wherein:

the gas flow conduit comprises a circular conduit segment and multiple radial conduit segments connected to the circular conduit segment,

the base layer includes at least two base layer device openings through the base layer and each base layer device opening contains a moveable probe, and

each of the at least two radial conduit segments connects to one of the base layer device openings.

9. The electrostatic chuck assembly of claim 1 , wherein the gas flow conduit comprises a gas flow conduit segment that extends around a perimeter of the base layer device opening.

10. A method of processing a workpiece, the method comprising:

supporting a workpiece on an electrostatic chuck assembly comprising:

a base layer that includes:

an upper base layer surface and a lower base layer surface,

a base layer device opening that extends through the base layer and is adapted to contain a portion of a device that performs an operation of the electrostatic chuck assembly,

a gas flow conduit extending horizontally over an area of the base, the gas flow conduit comprising a conduit segment that connects with the base layer device opening,

a gas flow inlet passing into the base and connected to the gas flow conduit; and

a ceramic layer disposed above the base layer, the ceramic layer comprising:

an upper ceramic layer surface,

a lower ceramic layer surface, and

multiple gas flow vents extending between the lower ceramic layer surface and the upper ceramic layer surface, the vents being in fluid communication with the gas flow conduit, and

a ceramic layer device opening extending through the ceramic layer, connected to the base layer device opening, and adapted to contain a portion of the device,

wherein the workpiece is supported on the upper ceramic layer surface; and

causing gas to flow into the gas flow inlet and through the gas flow conduit, and

further comprising maintaining a temperature of the workpiece in a range from −30 to 100 degrees Celsius.

11. The method of claim 10 , wherein the electrostatic chuck comprises an electrode and the method comprises producing an electrical charge on the workpiece, and an opposite electrical charge on the electrode, to cause the workpiece to be electrostatically attracted to the electrostatic chuck assembly.

12. The method of claim 10 , further comprising accelerating ions toward the workpiece to cause implantation of the ions at a surface of the workpiece.

13. The method of claim 10 , further comprising

stopping the flow of gas into the gas flow inlet,

allowing residual gas within the gas flow conduit to vent from the gas flow conduit for a venting period, and

after the venting period, removing the workpiece from the upper ceramic layer surface.

14. The method of claim 13 , wherein the venting period is less than 2 seconds.

15. An electrostatic chuck assembly comprising:

a base layer that includes:

an upper base layer surface and a lower base layer surface;

a base layer device opening that extends through the base layer and that is adapted to contain a portion of a device that performs an operation of the electrostatic chuck assembly;

a gas flow conduit extending horizontally over an area of the base layer, the gas flow conduit comprising a conduit segment that connects with the base layer device opening; and a gas flow inlet passing into the base layer and connected to the gas flow conduit,

wherein the gas flow conduit comprises a gas flow conduit segment that extends around a perimeter of the base layer device opening.

16. The electrostatic chuck assembly of claim 15 , wherein the gas flow conduit comprises a circular conduit segment and multiple radial conduit segments connected to the circular conduit segment.

17. The electrostatic chuck assembly of claim 15 , wherein the device is adapted to perform a movement, affect a condition, or perform a measurement.

18. The electrostatic chuck assembly of claim 15 , wherein the device is a measurement device.

19. The electrostatic chuck assembly of claim 15 , wherein the device is a moveable probe.

Assignments (3)
SECURITY INTEREST Recorded Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
SECURITY INTEREST Recorded Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060614/0980 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 11, 2021
From: CHAN, CHUN WANG; LIU, YAN; RYBCZYNSKI, JAKUB; DONNELL, STEVEN; MINSKY, CALEB
To: ENTEGRIS, INC.
Reel/Frame 056205/0509 →
Continuity (2)
Provisional Application 63022836 · May 11, 2020
Related Publication 20210351061A1 · Nov 11, 2021
Cited By (1)
US 12,322,634