Etching method and etching apparatus
An etching method for selectively etching a material containing Si and O is provided. The etching method includes providing a substrate containing the material containing Si and O in a chamber, repeating a first period for supplying a basic gas, which is started first, and a second period for supplying a fluorine-containing gas, which is started next, with at least a part of the second period not overlapping with the first period, and heating and removing a reaction product generated by the supply of the basic gas and the supply of the fluorine-containing gas.
1. An etching method for selectively etching a material containing Si and O, comprising:
providing a substrate containing the material containing Si and O in a chamber;
repeating a first period for supplying a basic gas, which is started first, and a second period for supplying a fluorine-containing gas subsequent to the first period with at least a part of the second period not overlapping with the first period; and
heating and removing a reaction product generated by supplying of the basic gas and supplying of the fluorine-containing gas.
2. The etching method of claim 1 , wherein in said repeating the first period and the second period, the second period for supplying the fluorine-containing gas is consecutively started after an end of the first period for supplying the basic gas.
3. The etching method of claim 1 , wherein said repeating the first period and the second period and said heating and removing the reaction product are repeated multiple times.
4. The etching method of claim 1 , wherein in said repeating the first period and the second period, the chamber is purged after the second period is ended and before a next first period is started.
5. The etching method of claim 1 , wherein the fluorine-containing gas is at least one selected from a group of HF gas, F 2 gas, ClF 3 gas, and NF 3 gas, and the basic gas is at least one selected from a group of NH 3 gas and amine gas.
6. The etching method of claim 5 , wherein the fluorine-containing gas is the HF gas, the basic gas is the NH 3 gas, and the reaction product is (NH 4 ) 2 SiF 6 .
7. The etching method of claim 6 , wherein said repeating the first period and the second period is performed at a temperature of 80° C. or lower.
8. The etching method of claim 7 , wherein said repeating the first period and the second period is performed at a temperature within a range from 60° C. to 80° C.
9. The etching method of claim 1 , wherein the substrate further contains a material containing Si and N and/or C, and the material containing Si and O is selectively etched with respect to the material containing Si and N and/or C.
10. The etching method of claim 9 , wherein the material containing Si and O is selected from a group of SiO 2 , SiON, SiOCN and SiOC, and the material containing Si and N and/or C is selected from a group of SiN, SiON, SiOCN, SiOC, SiCN, and SiC.
11. The etching method of claim 10 , wherein the material containing Si and O is an SiO 2 film, and the material containing Si and N and/or C is an SiN film or an SiOCN film.
12. The etching method of claim 1 , wherein said heating and removing the reaction product is performed by evacuating the chamber while heating the substrate in the chamber.
13. The etching method of claim 1 , wherein said heating and removing the reaction product is performed in a chamber different from the chamber.