Manufacturing method of carrier for semiconductor chip mounting thereon
A manufacturing method of a carrier for a semiconductor chip mounting thereon is provided. The method includes at least the following steps. A plurality of conductive connectors is formed on a fine redistribution structure to form a first portion, where the semiconductor chip is adapted to be mounted on the fine redistribution structure opposite to the conductive connectors. Each of the conductive connectors includes a bump and a solder cap formed on the bump, and the bump is directly connected to the fine redistribution structure. The first portion is disposed on a second portion, where the second portion includes a top redistribution structure directly connected to the solder cap and a second redistribution structure connected to the top redistribution structure, the first portion is disposed on the top redistribution structure, and a contact density of the top redistribution structure is denser than a contact density of the bottom redistribution structure.
1. A manufacturing method of a carrier for a semiconductor chip mounting thereon, comprising:
forming a plurality of conductive connectors on a fine redistribution structure to form a first portion, wherein the semiconductor chip is adapted to be mounted on the fine redistribution structure opposite to the conductive connectors, and each of the conductive connectors comprises a bump and a solder cap formed on the bump, and the bump is directly connected to the fine redistribution structure; and
disposing the first portion on a second portion, wherein the second portion comprises a top redistribution structure and a second redistribution structure connected to the top redistribution structure, the top redistribution structure is directly connected to the solder cap of the conductive connectors, the first portion is disposed on the top redistribution structure, and a contact density of the top redistribution structure is denser than a contact density of the bottom redistribution structure.
2. The manufacturing method according to claim 1 , wherein forming the first portion comprises:
disposing the conductive connectors over a temporary carrier through a release layer after forming the conductive connectors on the fine redistribution structure, wherein the release layer is disposed between the fine redistribution structure and temporary carrier to bury the conductive connectors therein.
3. The manufacturing method according to claim 2 , wherein a surface finishing layer is formed on the fine redistribution structure opposite to the conductive connectors after disposing the conductive connectors over the temporary carrier, and the semiconductor chip is adapted to be mounted on the fine redistribution structure through the surface finishing layer.
4. The manufacturing method according to claim 2 , wherein an underfill material is formed on the second portion to cover the conductive connectors after disposing the first portion on the second portion.
5. The manufacturing method according to claim 1 , wherein forming the first portion comprises:
forming the bumps of the conductive connectors on the fine redistribution structure;
forming an insulting layer on the fine redistribution structure to partially cover the bumps of the conductive connectors, wherein each of the bumps of the conductive connectors comprises a section protruding from the insulting layer; and
forming each of the solder caps on one of the sections of the bumps to form the conductive connectors.
6. The manufacturing method according to claim 5 , wherein the insulting layer is formed by a molding process.