Patent Assignment
Reel/Frame 075543/0265
Assignment of Assignor's Interest
Recorded: 2026-08-06
Pages: 7
Assignor
HU, DYI-CHUNG
Executed: 2026-01-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Properties
(19)
Integrated Substrate and Manufacturing Method Thereof
Patent:
11,125,781 →
Application:
16/891,078 →
Package Substrate and Package Structure
Integrated Substrate Structure, Redistribution Structure, and Manufacturing Method Thereof
Semiconductor Device and Manufacturing Method Thereof
Manufacturing Method of Carrier for Semiconductor Chip Mounting Thereon
Integrated Substrate Structure, Electronic Assembly, and Manufacturing Method Thereof
Manufacturing Method of Integrated Substrate
Package Substrate and Package Structure
Manufacturing Method of Circuit Carrier with Chip Mounted Thereon
Semiconductor Substrate Structure and Manufacturing Method Thereof
Millimeter-Wave Antenna Module Package Structure and Manufacturing Method Thereof
Semiconductor Substrate Structure and Manufacturing Method Thereof
Semiconductor Device
Glass Core Substrate and Manufacturing Method Thereof
Semiconductor Substrate and Manufacturing Method Thereof
Manufacturing Method of Integrated Substrate Structure
Semiconductor Substrate Structure, Semiconductor Structure and Manufacturing Method Thereof
Substrate and Manufacturing Method Thereof
Semiconductor Substrate and Manufacturing Method Thereof
Patent:
12,315,788 →
Application:
18/824,948 →