IP Library › Granted Patent US 11,962,282
Granted Patent B2
US 11,962,282 · App. 17/323,598 · Granted Apr 16, 2024

Acoustic wave device, filter, and multiplexer

Inventors: Shinji Yamamoto (Tokyo, JP); Toshio Nishizawa (Tokyo, JP); Naoki Kakita (Tokyo, JP)
Assignee: TAIYO YUDEN CO., LTD.
H03H9/02102H03H9/0504H03H9/132H03H9/17H03H9/54
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Quick Facts
Patent No.
US 11,962,282
App. No.
17/323,598
Granted
Apr 16, 2024
Kind
B2
Abstract

An acoustic wave device including a support substrate, a piezoelectric layer provided over the support substrate, at least one pair of comb-shaped electrodes disposed on the piezoelectric layer, each of the at least one pair of comb-shaped electrodes including electrode fingers, a temperature compensation film interposed between the support substrate and the piezoelectric layer, the temperature compensation film having a temperature coefficient of elastic constant opposite in sign to a temperature coefficient of elastic constant of the piezoelectric layer; and an insulating layer interposed between the support substrate and the temperature compensation film, a first surface of the insulating layer having first protruding portions and/or first recessed portions, a second surface of the insulating layer having second protruding portions and/or second recessed portions, the first surface being closer to the support substrate, the second surface being closer to the temperature compensation film.

Claims (46)

1. An acoustic wave device comprising:

a support substrate;

a piezoelectric layer provided over the support substrate;

at least one pair of comb-shaped electrodes disposed on the piezoelectric layer, each of the at least one pair of comb-shaped electrodes including electrode fingers;

a temperature compensation film interposed between the support substrate and the piezoelectric layer, the temperature compensation film having a temperature coefficient of elastic constant opposite in sign to a temperature coefficient of elastic constant of the piezoelectric layer; and

an insulating layer interposed between the support substrate and the temperature compensation film, a first surface of the insulating layer having a plurality of first protruding portions and/or a plurality of first recessed portions, a second surface of the insulating layer having a plurality of second protruding portions and/or a plurality of second recessed portions, the first surface being closer to the support substrate, the second surface being closer to the temperature compensation film,

wherein |D1−D2|/(D1+D2) is equal to or less than 0.05 where D1 represents a regular interval between the plurality of first protruding portions and/or the plurality of first recessed portions and D2 represents a regular interval between the plurality of second protruding portions and/or the plurality of second recessed portions.

2. The acoustic wave device according to claim 1 , wherein an acoustic velocity of a bulk wave propagating through the insulating layer is different from an acoustic velocity of a bulk wave propagating through the temperature compensation film, and an acoustic velocity of a bulk wave propagating through the support substrate is different from the acoustic velocity of the bulk wave propagating through the insulating layer.

3. The acoustic wave device according to claim 2 , wherein the acoustic velocity of the bulk wave propagating through the insulating layer is greater than the acoustic velocity of the bulk wave propagating through the temperature compensation film.

4. The acoustic wave device according to claim 1 , wherein the acoustic velocity of the bulk wave propagating through the temperature compensation film is less than an acoustic velocity of a bulk wave propagating through the piezoelectric layer.

5. The acoustic wave device according to claim 1 , wherein a distance between the second surface and a surface closer to the at least one pair of comb-shaped electrodes of the piezoelectric layer is equal to or less than 4 times an average pitch of the plurality of electrode fingers.

6. The acoustic wave device according to claim 1 , wherein the plurality of first protruding portions and/or the plurality of first recessed portions are arranged at regular intervals, and the plurality of second protruding portions and/or the plurality of second recessed portions are arranged at regular intervals.

7. The acoustic wave device according to claim 6 , wherein the regular intervals at which the plurality of first protruding portions and/or the plurality of first recessed portions are arranged are substantially equal to the regular intervals at which the plurality of second protruding portions and/or the plurality of second recessed portions are arranged.

8. The acoustic wave device according to claim 6 , wherein the plurality of first protruding portions and/or the plurality of first recessed portions and the plurality of second protruding portions and/or the plurality of second recessed portions satisfy at least one of following conditions:

a phase of the plurality of first protruding portions and/or the plurality of first recessed portions is different from a phase of the plurality of second protruding portions and/or the plurality of second recessed portions;

heights of the plurality of first protrusions and/or the plurality of first recessed portions are different from heights of the plurality of second protruding portions and/or the plurality of second recessed portions;

a direction in which a regular interval between the plurality of first protruding portions and/or the plurality of first recessed portions is smallest is different from a direction in which a regular interval between the plurality of second protruding portions and/or the plurality of second recessed portions is smallest; and

the plurality of first protruding portions and/or the plurality of first recessed portions have three-dimensional shapes different from three-dimensional shapes of the plurality of second protruding portions and/or the plurality of second recessed portions.

9. The acoustic wave device according to claim 6 , wherein the regular intervals at which the plurality of first protruding portions and/or the plurality of first recessed portions are arranged are different from the regular intervals at which the plurality of second protruding portions and/or the plurality of second recessed portions are arranged.

10. The acoustic wave device according to claim 1 , wherein the plurality of first protruding portions and/or the plurality of first recessed portions are irregularly arranged, the plurality of second protruding portions and/or the plurality of second recessed portions are irregularly arranged, or the plurality of first protruding portions and/or the plurality of first recessed portions and the plurality of second protruding portions and/or the plurality of second recessed portions are irregularly arranged.

11. The acoustic wave device according to claim 1 , wherein the temperature compensation film contains 80 atomic % or greater of silicon oxide.

12. The acoustic wave device according to claim 1 , wherein |D1−D2|/(D1+D2) is equal to or less than 0.005.

13. A filter comprising:

the acoustic wave device according to claim 1 .

14. A multiplexer comprising:

the filter according to claim 13 .

15. An acoustic wave device comprising:

a support substrate;

a piezoelectric layer provided over the support substrate;

at least one pair of comb-shaped electrodes disposed on the piezoelectric layer, each of the at least one pair of comb-shaped electrodes including electrode fingers;

a temperature compensation film interposed between the support substrate and the piezoelectric layer, the temperature compensation film having a temperature coefficient of elastic constant opposite in sign to a temperature coefficient of elastic constant of the piezoelectric layer; and

an insulating layer interposed between the support substrate and the temperature compensation film, a first surface of the insulating layer having a plurality of first protruding portions and/or a plurality of first recessed portions, a second surface of the insulating layer having a plurality of second protruding portions and/or a plurality of second recessed portions, the first surface being closer to the support substrate, the second surface being closer to the temperature compensation film,

wherein the plurality of first protruding portions and/or the plurality of first recessed portions are arranged at regular intervals, and the plurality of second protruding portions and/or the plurality of second recessed portions are arranged at regular intervals,

wherein the regular intervals at which the plurality of first protruding portions and/or the plurality of first recessed portions are arranged are substantially equal to the regular intervals at which the plurality of second protruding portions and/or the plurality of second recessed portions are arranged, and

wherein the regular intervals at which the plurality of first protruding portions and/or the plurality of first recessed portions are arranged and the regular intervals at which the plurality of second protruding portions and/or the plurality of second recessed portions are arranged are equal to or greater than 1.6 times an average pitch of the electrode fingers.

16. An acoustic wave device comprising:

a support substrate;

a piezoelectric layer provided over the support substrate;

at least one pair of comb-shaped electrodes disposed on the piezoelectric layer, each of the at least one pair of comb-shaped electrodes including electrode fingers;

a temperature compensation film interposed between the support substrate and the piezoelectric layer, the temperature compensation film having a temperature coefficient of elastic constant opposite in sign to a temperature coefficient of elastic constant of the piezoelectric layer; and

an insulating layer interposed between the support substrate and the temperature compensation film, a first surface of the insulating layer having a plurality of first protruding portions and/or a plurality of first recessed portions, a second surface of the insulating layer having a plurality of second protruding portions and/or a plurality of second recessed portions, the first surface being closer to the support substrate, the second surface being closer to the temperature compensation film,

wherein an arithmetic average roughness Ra of the second surface is 1 nm or less.

17. The acoustic wave device according to claim 16 , wherein an acoustic velocity of a bulk wave propagating through the insulating layer is different from an acoustic velocity of a bulk wave propagating through the temperature compensation film, and an acoustic velocity of a bulk wave propagating through the support substrate is different from the acoustic velocity of the bulk wave propagating through the insulating layer.

18. The acoustic wave device according to claim 17 , wherein the acoustic velocity of the bulk wave propagating through the insulating layer is greater than the acoustic velocity of the bulk wave propagating through the temperature compensation film.

19. The acoustic wave device according to claim 16 , wherein the acoustic velocity of the bulk wave propagating through the temperature compensation film is less than an acoustic velocity of a bulk wave propagating through the piezoelectric layer.

20. The acoustic wave device according to claim 16 , wherein a distance between the second surface and a surface closer to the at least one pair of comb-shaped electrodes of the piezoelectric layer is equal to or less than 4 times an average pitch of the plurality of electrode fingers.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 18, 2021
From: YAMAMOTO, SHINJI; NISHIZAWA, TOSHIO; KAKITA, NAOKI
To: TAIYO YUDEN CO., LTD.
Reel/Frame 056277/0263 →
Priority Claims (1)
JP 2020-104639 · Jun 17, 2020 · national
Continuity (1)
Related Publication 20210399709A1 · Dec 23, 2021
Cited By (1)
US 12,512,810