IP Library › Granted Patent US 12,512,810
Granted Patent B2
US 12,512,810 · App. 17/961,604 · Granted Dec 30, 2025

Piezoelectric device

Inventors: Munehisa Watanabe (Nagaokakyo, JP); Yasumasa Taniguchi (Nagaokakyo, JP); Katsuya Daimon (Nagaokakyo, JP); Takuro Okada (Nagaokakyo, JP)
Assignee: MURATA MANUFACTURING CO., LTD.
H03H9/02574H03H9/02015H03H9/25H03H9/1035
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Quick Facts
Patent No.
US 12,512,810
App. No.
17/961,604
Granted
Dec 30, 2025
Kind
B2
Abstract

A piezoelectric device includes a support substrate, an intermediate layer on the support substrate in a first region, a piezoelectric layer on the intermediate layer, a functional element on the piezoelectric layer, and an insulating layer. The insulating layer is located on the support substrate in a second region adjacent to the first region. A surface roughness of the support substrate in the second region is greater than a surface roughness of the support substrate in the first region.

Claims (28)

1 . A piezoelectric device comprising:

a support substrate;

an intermediate layer on the support substrate in a first region;

a piezoelectric layer on the intermediate layer;

a functional element on the piezoelectric layer; and

an insulating layer on the support substrate in a second region adjacent to the first region; wherein

a surface roughness of the support substrate in the second region is greater than a surface roughness of the support substrate in the first region.

2 . The piezoelectric device according to claim 1 , wherein

the second region includes a first portion adjacent to the first region and a second portion farther away from the first region than the first portion; and

a surface roughness of the support substrate in the first portion is greater than a surface roughness of the support substrate in the second portion.

3 . The piezoelectric device according to claim 2 , wherein

a thickness of the support substrate in the second region is smaller than a thickness of the support substrate in the first region; and

the support substrate includes an inclined region between the first region and the second region.

4 . The piezoelectric device according to claim 2 , wherein

the intermediate layer includes:

a high-acoustic-velocity layer on the support substrate and through which a bulk acoustic wave with a velocity higher than a velocity of a bulk acoustic wave that propagates to the piezoelectric layer propagates; and

a low-acoustic-velocity layer between the high-acoustic-velocity layer and the piezoelectric layer and through which a bulk acoustic wave with a velocity lower than a velocity of an acoustic wave that propagates to the piezoelectric layer propagates.

5 . The piezoelectric device according to claim 1 , wherein

a thickness of the support substrate in the second region is smaller than a thickness of the support substrate in the first region; and

the support substrate includes an inclined region between the first region and the second region.

6 . The piezoelectric device according to claim 5 , wherein

the intermediate layer includes:

a high-acoustic-velocity layer on the support substrate and through which a bulk acoustic wave with a velocity higher than a velocity of a bulk acoustic wave that propagates to the piezoelectric layer propagates; and

a low-acoustic-velocity layer between the high-acoustic-velocity layer and the piezoelectric layer and through which a bulk acoustic wave with a velocity lower than a velocity of an acoustic wave that propagates to the piezoelectric layer propagates.

7 . The piezoelectric device according to claim 1 , wherein

the intermediate layer includes:

a high-acoustic-velocity layer on the support substrate and through which a bulk acoustic wave with a velocity higher than a velocity of a bulk acoustic wave that propagates to the piezoelectric layer propagates; and

a low-acoustic-velocity layer between the high-acoustic-velocity layer and the piezoelectric layer and through which a bulk acoustic wave with a velocity lower than a velocity of an acoustic wave that propagates to the piezoelectric layer propagates.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 7, 2022
From: WATANABE, MUNEHISA; TANIGUCHI, YASUMASA; DAIMON, KATSUYA; OKADA, TAKURO
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 061342/0875 →
Priority Claims (1)
JP 2020-076004 · Apr 22, 2020 · national
Continuity (2)
Continuation PCTJP2021015373 · Apr 14, 2021
Related Publication 20230032680A1 · Feb 2, 2023
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