Semiconductor structure with conductive structure and method for manufacturing the same
Semiconductor structures and methods for manufacturing the same are provided. The method for manufacturing the semiconductor structure includes forming a gate structure over a substrate and forming a mask layer covering the gate structure. The method also includes forming a source/drain structure adjacent to the gate structure over the substrate and forming a contact over the source/drain structure. The method also includes forming a dielectric layer over the contact and the mask layer and forming a first trench through the dielectric layer and the mask layer over the gate structure. The method also includes forming a first conductive structure in the first trench and removing an upper portion of the first conductive structure. The method also includes forming a second conductive structure through the dielectric layer and covering the contact and the first conductive structure.
1. A method for manufacturing a semiconductor structure, comprising:
forming a gate structure over a substrate;
forming a mask layer covering the gate structure;
forming a source/drain structure adjacent to the gate structure over the substrate;
forming a contact over the source/drain structure;
forming a dielectric layer over the contact and the mask layer;
forming a first trench through the dielectric layer and the mask layer over the gate structure;
forming a first conductive structure in the first trench;
removing an upper portion of the first conductive structure; and
forming a second conductive structure through the dielectric layer and covering the contact and the first conductive structure.
2. The method for manufacturing the semiconductor structure as claimed in claim 1 , wherein a top surface of the first conductive structure is lower than a top surface of the dielectric layer after removing the upper portion of the first conductive structure.
3. The method for manufacturing the semiconductor structure as claimed in claim 1 , further comprising:
forming a second trench through the dielectric layer, wherein the contact and the first conductive structure are exposed by the second trench.
4. The method for manufacturing the semiconductor structure as claimed in claim 3 , further comprising:
partially removing the mask layer, so that the second trench extends into the mask layer.
5. The method for manufacturing the semiconductor structure as claimed in claim 4 , wherein the second conductive structure is formed in the second trench.
6. The method for manufacturing the semiconductor structure as claimed in claim 1 , further comprising:
forming a third conductive structure in an upper portion of the first trench over the first conductive structure; and
removing the third conductive structure before forming the second conductive structure.
7. The method for manufacturing the semiconductor structure as claimed in claim 1 , wherein the bottommost portion of the second conductive structure is lower than a top surface of the mask layer.
8. A method for manufacturing a semiconductor structure, comprising:
forming nanostructures over a substrate;
forming a gate structure wrapping around the nanostructures;
forming a source/drain structure attached to the nanostructures adjacent to the gate structure;
forming a contact landing on the source/drain structure;
forming a dielectric layer over the contact and the gate structure;
forming a first conductive structure through the dielectric layer and covering the gate structure;
etching an upper portion of the first conductive structure so that a top surface of the first conductive structure is lower than a top surface of the dielectric layer; and
forming a second conductive structure through the dielectric layer to cover both the contact and the first conductive structure.
9. The method for manufacturing the semiconductor structure as claimed in claim 8 , wherein a void is formed in the second conductive structure.
10. The method for manufacturing the semiconductor structure as claimed in claim 8 , further comprising:
forming a mask layer over the gate structure, wherein a top surface of the mask layer is substantially level with a top surface of the contact.
11. The method for manufacturing the semiconductor structure as claimed in claim 10 , further comprising:
forming an etch stop layer covering the top surface of the contact and the top surface of the mask layer; and
forming a first trench through the dielectric layer, the etch stop layer, and the mask layer,
wherein the first conductive structure is formed in the first trench.
12. The method for manufacturing the semiconductor structure as claimed in claim 11 , further comprising:
etching the dielectric layer and the etch stop layer to form a second trench exposing the contact after etching the upper portion of the first conductive structure;
forming a conductive material in the second trench; and
polishing the conductive material to form the second conductive structure in the second trench.
13. The method for manufacturing the semiconductor structure as claimed in claim 12 , further comprising:
removing a corner portion of the first conductive structure before forming the conductive material in the second trench.
14. The method for manufacturing the semiconductor structure as claimed in claim 11 , wherein the top surface of the first conductive structure is lower than a top surface of the etch stop layer after etching the upper portion of the first conductive structure.
15. A semiconductor structure, comprising:
a substrate;
a gate structure formed over the substrate;
a mask layer formed over the gate structure;
a source/drain structure formed adjacent to the gate structure over the substrate;
a contact formed over the source/drain structure;
a first conductive structure formed through the mask layer and landing on the gate structure; and
a second conductive structure covering the first conductive structure and the contact, wherein the second conductive structure comprises an extending portion sandwiched between an upper portion of the first conductive structure and an upper portion of the contact.
16. The semiconductor structure as claimed in claim 15 , wherein a bottommost portion of the second conductive structure is lower than a top surface of the first conductive structure.
17. The semiconductor structure as claimed in claim 15 , wherein a void is embedded in the second conductive structure.
18. The semiconductor structure as claimed in claim 17 , wherein the void is sandwiched between the upper portion of the first conductive structure and the upper portion of the contact.
19. The semiconductor structure as claimed in claim 15 , further comprising:
a dielectric layer formed over the mask layer and the contact,
wherein the second conductive structure penetrates the dielectric layer, and the extending portion of the second conductive structure extends into the mask layer.
20. The semiconductor structure as claimed in claim 15 , further comprising:
a barrier layer surrounding the extending portion of the second conductive structure, wherein the barrier layer is in direct contact with the first conductive structure, the contact, and the mask layer.