IP Library Granted Patent US 12,436,458
Granted Patent B2
US 12,436,458 · App. 17/326,977 · Granted Oct 7, 2025

Photoresist composition and method of forming photoresist pattern

Inventors: An-Ren Zi (Hsinchu, TW); Chin-Hsiang Lin (Hsinchu, TW); Ching-Yu Chang (Yuansun Village, TW)
Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
G03F7/0044G03F7/038G03F7/039G03F7/11G03F7/162G03F7/168G03F7/30G03F7/38G03F7/42H01L21/0274G03F7/2004
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Quick Facts
Patent No.
US 12,436,458
App. No.
17/326,977
Filed
May 21, 2021
Granted
Oct 7, 2025
Kind
B2
Art Unit
1737
USPC
430/270.1
Abstract

A method of forming a photoresist pattern includes forming a protective layer over a photoresist layer formed on a substrate, and selectively exposing the protective layer and the photoresist layer to actinic radiation. The protective layer and the photoresist layer are developed to form a pattern in the photoresist layer, and the protective layer is removed. The protective layer includes a polymer having pendant fluorocarbon groups and pendant acid leaving groups.

Claims (37)

1. A photoresist composition, comprising:

a photoresist material; and

a polymer having pendant fluorocarbon groups and pendant acid leaving groups,

wherein the polymer having the pendant fluorocarbon groups and the pendant acid leaving groups comprises from 0.1 wt. % to 10 wt. % of one or more polar functional groups selected from the group consisting of —NH 3 and —NH 2 based on a total weight of the polymer having the pendant fluorocarbon and the pendant acid leaving groups, and

the pendant fluorocarbon groups are attached to a polymer main chain via a linking unit including at least one selected from the group consisting of —P—; —P(O 2 )—; —C(═O)S—; —SO 2 S—; and —SO—.

2. The photoresist composition of claim 1 , wherein the photoresist material comprises metal oxide nanoparticles.

3. The photoresist composition of claim 1 , wherein the polymer having the pendant fluorocarbon and the pendant acid leaving groups comprises from 30 wt. % to 70 wt. % of the pendant fluorocarbon groups and from 30 wt. % to 70 wt. % of the pendant acid leaving groups based on the total weight of the polymer having the pendant fluorocarbon and the pendant acid leaving groups.

4. The photoresist composition of claim 1 , wherein the pendant fluorocarbon groups are selected from the group consisting of C x F y , where 1≤x≤9 and 3≤y≤12.

5. The photoresist composition of claim 1 , wherein the pendant acid leaving groups are selected from the group consisting of

6. The photoresist composition of claim 1 , further comprising a photoacid generator.

7. A photoresist composition, comprising:

a protective polymer having pendant fluorocarbon groups and pendant acid leaving groups;

a polymer resin having pendant acid leaving groups;

a photoactive compound; and

a photo decomposable base,

wherein the protective polymer having the pendant fluorocarbon groups and the pendant acid leaving groups comprises from 0.1 wt. % to 10 wt. % of one or more polar functional groups selected from the group consisting of —NH 3 , —NH 2 , and —SO 3 based on a total weight of the polymer having the pendant fluorocarbon and the pendant acid leaving groups, and

the pendant fluorocarbon groups are attached to a polymer main chain via a linking unit including at least one selected from the group consisting of —P—; —P(O 2 )—; —C(═O)S—; —SO 2 S—; and —SO—.

8. The photoresist composition of claim 7 , wherein the protective polymer having the pendant fluorocarbon and the pendant acid leaving groups comprises from 30 wt. % to 70 wt. % of the pendant fluorocarbon groups and from 30 wt. % to 70 wt. % of the pendant acid leaving groups based on the total weight of the polymer having the pendant fluorocarbon and the pendant acid leaving groups.

9. The photoresist composition of claim 7 , wherein the pendant fluorocarbon groups are selected from the group consisting of C x F y , where 1≤x≤9 and 3≤y≤12.

10. The photoresist composition of claim 7 , wherein the pendant acid leaving groups are selected from the group consisting of

11. A photoresist composition, comprising:

a first polymer having pendant fluorocarbon groups and first pendant acid labile groups, wherein the pendant fluorocarbon groups are attached to a polymer main chain via a linking unit including at least one selected from the group consisting of —P—; —P(O 2 )—; —C(═O)S—; —SO 2 S—; and —SO—;

a second polymer having second pendant acid labile groups;

metal oxide nanoparticles complexed with a sulfonic acid ligand;

a photoacid generator; and

a solvent.

12. The photoresist composition of claim 11 , wherein the pendant fluorocarbon groups are selected from the group consisting of C x F y , where 1≤x≤9 and 3≤y≤12; and —(C(CF 3 ) 2 OH)—.

13. The photoresist composition of claim 11 , wherein the first pendant acid labile groups are selected from the group consisting of

14. The photoresist composition of claim 11 , wherein the second polymer includes a repeating unit that forms a skeletal backbone of the second polymer, and the repeating unit is one or more of an acrylic ester, a methacrylic ester, a crotonic ester, a vinyl ester, a maleic diester, a fumaric diester, an itaconic diester, a (meth)acrylonitrile, a (meth)acrylamide, a styrene, and a vinyl ether.

15. The photoresist composition of claim 11 , wherein the polymer having the pendant fluorocarbon groups and the first pendant acid labile groups comprises from 30 wt. % to 70 wt. % of the pendant fluorocarbon groups and from 30 wt. % to 70 wt. % of the first pendant acid labile groups based on a total weight of the polymer having the pendant fluorocarbon groups and the first pendant acid labile groups.

16. The photoresist composition of claim 1 , further comprising a photo decomposable base.

17. The photoresist composition of claim 11 , wherein an amount of the metal oxide nanoparticles in the photoresist composition ranges from 0.1 wt. % to 20 wt. % based on a total weight of the photoresist composition.

18. The photoresist composition of claim 7 , wherein the photo decomposable base has a structure according to the following formula:

wherein R is an alicyclic group of 5 or more carbon atoms which may have a substituent, X is a divalent linking group, Y is a linear, branched, or cyclic alkylene group or an arylene group; Rf is a hydrocarbon group containing a fluorine atom, and M ⊕ is an organic cation or a metal cation.

19. The photoresist composition of claim 11 , further comprising a photo decomposable base.

20. The photoresist composition of claim 19 , wherein the photo decomposable base has a structure according to the following formula:

wherein R is an alicyclic group of 5 or more carbon atoms which may have a substituent, X is a divalent linking group, Y is a linear, branched, or cyclic alkylene group or an arylene group; Rf is a hydrocarbon group containing a fluorine atom, and M ⊕ is an organic cation or a metal cation.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2021
From: ZI, AN-REN; LIN, CHIN-HSIANG; CHANG, CHING-YU
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 056315/0037 →
Continuity (3)
Division 16163425 · Oct 17, 2018
Provisional Application 62685721 · Jun 15, 2018
Related Publication 20210278762A1 · Sep 9, 2021
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