Direct-bonded LED arrays including optical elements configured to transmit optical signals from LED elements
Direct-bonded LED arrays and applications are provided. An example process fabricates a LED structure that includes coplanar electrical contacts for p-type and n-type semiconductors of the LED structure on a flat bonding interface surface of the LED structure. The coplanar electrical contacts of the flat bonding interface surface are direct-bonded to electrical contacts of a driver circuit for the LED structure. In a wafer-level process, micro-LED structures are fabricated on a first wafer, including coplanar electrical contacts for p-type and n-type semiconductors of the LED structures on the flat bonding interface surfaces of the wafer. At least the coplanar electrical contacts of the flat bonding interface are direct-bonded to electrical contacts of CMOS driver circuits on a second wafer. The process provides a transparent and flexible micro-LED array display, with each micro-LED structure having an illumination area approximately the size of a pixel or a smallest controllable element of an image represented on a high-resolution video display.
1. An apparatus comprising:
a substrate;
a light emitting diode (LED) array comprising a plurality of LED elements, wherein the LED array is located on a first side of the substrate;
one or more first optical elements integrated on a second side of the substrate, wherein the one or more first optical elements are configured to transmit optical signals from the plurality of LED elements, and wherein the second side is opposite the first side; and
a complementary metal-oxide-semiconductor (CMOS) based device direct bonded to the LED array.
2. The apparatus of claim 1 , wherein the one or more first optical elements comprise a waveguide.
3. The apparatus of claim 1 , wherein the one or more first optical elements comprise a diffractive optical element.
4. The apparatus of claim 1 , wherein the one or more first optical elements comprise a beam splitter.
5. The apparatus of claim 1 , wherein the one or more first optical elements comprise at least one of a beam steering element or a beam shaping element.
6. The apparatus of claim 1 , wherein the substrate is direct bonded to the LED array.
7. The apparatus of claim 1 , further comprising one or more second optical elements integrated on one or more sides of the LED array and the CMOS based device, wherein the one or more sides are orthogonal to both the first side and the second side.
8. The apparatus of claim 7 , wherein the one or more second optical elements comprise a waveguide.
9. The apparatus of claim 7 , wherein the one or more second optical elements comprise a diffractive optical element.
10. The apparatus of claim 7 , wherein the one or more second optical elements comprise a beam splitter.
11. The apparatus of claim 7 , wherein the one or more second optical elements comprise at least one of a beam steering element or a beam shaping element.
12. The apparatus of claim 1 , further comprising a first cooling structure on a third side of the LED array and the CMOS based device and a second cooling structure on a fourth side of the LED array and the CMOS based device, wherein the third side and the fourth side are orthogonal to both the first side and the second side.
13. An apparatus comprising:
a light emitting diode (LED) array comprising a plurality of LED elements;
one or more optical elements integrated on a first side of the LED array, wherein the one or more optical elements are configured to transmit optical signals from the plurality of LED elements; and
a complementary metal-oxide-semiconductor (CMOS) based device direct bonded to the LED array on a second side of the LED array, wherein the second side is opposite the first side.
14. The apparatus of claim 13 , wherein the one or more optical elements comprise a waveguide.
15. The apparatus of claim 13 , wherein the one or more optical elements comprise a diffractive optical element.
16. The apparatus of claim 13 , wherein the one or more optical elements comprise a beam splitter.
17. The apparatus of claim 13 , wherein the one or more optical elements comprise at least one of a beam steering element or a beam shaping element.
18. The apparatus of claim 13 , further comprising a first cooling structure on a third side of the LED array and the CMOS based device and a second cooling structure on a fourth side of the LED array and the CMOS based device, wherein the third side and fourth side are orthogonal to both the first side and the second side.
19. The apparatus of claim 13 , further comprising one or more second optical elements integrated on one or more sides of the LED array and the CMOS based device, wherein the one or more sides are orthogonal to both the first side and the second side.