Patent Assignment
Reel/Frame 061357/0485
Change of Name
Recorded: 2022-08-30
Pages: 6
Assignor
INVENSAS CORPORATION
Executed: 2021-10-01
Assignee
INVENSAS LLC
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(31)
Structures And Methods For Low Temperature Bonding Using Nanoparticles
Flat Metal Features for Microelectronics Applications
Direct-Bonded Led Arrays Including Optical Elements Configured to Transmit Optical Signals from Led Elements
Dielets on Flexible and Stretchable Packaging for Microelectronics
Diffused Bitline Replacement in Stacked Wafer Memory
Non-Volatile Dynamic Random Access Memory
Scalable Architecture for Reduced Cycles Across SoC
Apparatus For Non-Volatile Random Access Memory Stacks
Mixed Exposure for Large Die
Reduced Parasitic Capacitance in Bonded Structures
Application:
63/257,035 →
Radio Frequency Device Packages
Application:
63/271,042 →
Structures and Methods for Reliable Packages
Structures And Methods For Low Temperature Bonding Using Nanoparticles
Structures and Methods for Low Temperature Bonding Using Nanoparticles
Structures and Methods for Low Temperature Bonding Using Nanoparticles
Flat Metal Features for Microelectronics Applications
Flat Metal Features for Microelectronics Applications
Flat Metal Features for Microelectronics Applications
Application:
62/515,410 →
Direct-Bonded Led Structure Contacts and Substrate Contacts
Direct-Bonded Led Arrays and Applications
Direct Bonded Led Arrays and Applications
Application:
62/472,363 →
Dielets on Flexible and Stretchable Packaging for Microelectronics
Dielets on Flexible and Stretchable Packaging for Microelectronics
Patent:
10,403,577 →
Application:
15/970,055 →
Diffused Bitline Replacement in Stacked Wafer Memory
Non-Volatile Random Access Memory Stacks
Application:
62/923,839 →
Apparatus For Non-Volatile Random Access Memory Stacks
Application:
62/951,668 →
Mixed Exposure for Large Die
Patent:
11,264,357 →
Application:
17/075,489 →
Multi-Chip Modules Formed Using Wafer-Level Processing of a Reconstituted Wafer
Multi-Chip Modules Formed Using Wafer-Level Processing of a Reconstitute Wafer
Structures and Methods for Reliable Packages
Structures and Methods for Reliable Packages
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 1, 2016
From: UZOH, CYPRIAN EMEKA
To: INVENSAS CORPORATION
Reel/Frame 040189/0212 →
Assignment of Assignor's Interest
Jun 6, 2017
From: UZOH, CYPRIAN EMEKA
To: INVENSAS CORPORATION
Reel/Frame 042616/0780 →
Assignment of Assignor's Interest
Mar 28, 2018
From: UZOH, CYPRIAN EMEKA
To: INVENSAS CORPORATION
Reel/Frame 045369/0550 →
Assignment of Assignor's Interest
May 31, 2018
From: UZOH, CYPRIAN EMEKA
To: INVENSAS CORPORATION
Reel/Frame 045953/0862 →
Assignment of Assignor's Interest
Sep 6, 2019
From: UZOH, CYPRIAN EMEKA
To: INVENSAS CORPORATION
Reel/Frame 050298/0204 →
Assignment of Assignor's Interest
Nov 7, 2019
From: DELACRUZ, JAVIER A.; PEREGO, RICHARD E.
To: INVENSAS CORPORATION
Reel/Frame 050952/0463 →
Assignment of Assignor's Interest
Dec 23, 2019
From: UZOH, CYPRIAN EMEKA; GAO, GUILIAN; WANG, LIANG; SHEN, HONG
To: INVENSAS CORPORATION
Reel/Frame 051355/0007 →
Assignment of Assignor's Interest
Jan 14, 2020
From: UZOH, CYPRIAN EMEKA
To: INVENSAS CORPORATION
Reel/Frame 051508/0318 →
Assignment of Assignor's Interest
Apr 3, 2020
From: TAO, MIN; WANG, LIANG; KATKAR, RAJESH; UZOH, CYPRIAN EMEKA
To: INVENSAS CORPORATION
Reel/Frame 052311/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Assignment of Assignor's Interest
Oct 15, 2020
From: DELACRUZ, JAVIER A.; CHENG, PEARL PO-YEE; FISCH, DAVID EDWARD
To: INVENSAS CORPORATION
Reel/Frame 054062/0983 →
Assignment of Assignor's Interest
Nov 13, 2020
From: UZOH, CYPRIAN EMEKA
To: INVENSAS CORPORATION
Reel/Frame 054366/0747 →
Assignment of Assignor's Interest
Dec 15, 2020
From: DELACRUZ, JAVIER A.; HABA, BELGACEM; KATKAR, RAJESH; CHENG, PEARL PO-YEE
To: INVENSAS CORPORATION
Reel/Frame 054655/0768 →
Assignment of Assignor's Interest
Dec 30, 2020
From: MOREIN, STEPHEN
To: INVENSAS CORPORATION
Reel/Frame 054780/0266 →
Assignment of Assignor's Interest
Jan 5, 2021
From: UZOH, CYPRIAN EMEKA
To: INVENSAS CORPORATION
Reel/Frame 054813/0178 →
Assignment of Assignor's Interest
May 21, 2021
From: TAO, MIN; WANG, LIANG; KATKAR, RAJESH; UZOH, CYPRIAN EMEKA
To: INVENSAS CORPORATION
Reel/Frame 056316/0695 →
Assignment of Assignor's Interest
Nov 9, 2021
From: HABA, BELGACEM; SHEN, HONG; VARIOT, PATRICK; KATKAR, RAJESH
To: INVENSAS CORPORATION
Reel/Frame 058063/0643 →
Assignment of Assignor's Interest
Nov 10, 2021
From: UZOH, CYPRIAN EMEKA
To: INVENSAS CORPORATION
Reel/Frame 058073/0368 →
Assignment of Assignor's Interest
Mar 16, 2022
From: DELACRUZ, JAVIER A.; HABA, BELGACEM
To: INVENSAS CORPORATION
Reel/Frame 059285/0549 →
Assignment of Assignor's Interest
May 20, 2022
From: HUANG, SHAOWU; DELACRUZ, JAVIER A.
To: INVENSAS CORPORATION
Reel/Frame 059970/0780 →
Change of Name
Oct 19, 2022
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 061727/0033 →
Change of Name
Dec 13, 2022
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 062118/0343 →
Change of Name
Dec 16, 2022
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 062150/0900 →
Change of Name
Jan 27, 2023
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 062539/0282 →
Change of Name
Feb 10, 2023
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 062703/0694 →