Patent Assignment
Reel/Frame 062118/0343
Change of Name
Recorded: 2022-12-13
Pages: 5
Assignor
INVENSAS LLC
Executed: 2022-08-15
Assignee
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(4)
Structures and Methods for Low Temperature Bonding Using Nanoparticles
Structures and Methods for Low Temperature Bonding Using Nanoparticles
Structures And Methods For Low Temperature Bonding Using Nanoparticles
Structures And Methods For Low Temperature Bonding Using Nanoparticles
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 1, 2016
From: UZOH, CYPRIAN EMEKA
To: INVENSAS CORPORATION
Reel/Frame 040189/0212 →
Assignment of Assignor's Interest
Mar 28, 2018
From: UZOH, CYPRIAN EMEKA
To: INVENSAS CORPORATION
Reel/Frame 045369/0550 →
Assignment of Assignor's Interest
Jan 14, 2020
From: UZOH, CYPRIAN EMEKA
To: INVENSAS CORPORATION
Reel/Frame 051508/0318 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Assignment of Assignor's Interest
Jan 5, 2021
From: UZOH, CYPRIAN EMEKA
To: INVENSAS CORPORATION
Reel/Frame 054813/0178 →
Change of Name
Aug 30, 2022
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 061357/0485 →
Change of Name
Oct 19, 2022
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 061727/0033 →
Security Interest
May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →