Patent Assignment
Reel/Frame 061727/0033
Change of Name
Recorded: 2022-10-19
Pages: 6
Assignor
INVENSAS CORPORATION
Executed: 2021-10-01
Assignee
INVENSAS LLC
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(6)
Reduced Stress Tsv and Interposer Structures
Interconnect Structures and Methods for Forming Same
Integrated Circuits Protected by Substrates with Cavities, and Methods of Manufacture
Structures And Methods For Low Temperature Bonding Using Nanoparticles
Stacked Structure with Interposer
Application:
17/823,430 →
Publication:
US 2023/0069183
Radio Frequency Device Packages
Application:
63/343,325 →
Related Assignments
(14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 5, 2015
From: UZOH, CYPRIAN EMEKA; WOYCHIK, CHARLES G.; CASKEY, TERRENCE; DESAI, KISHOR V.
To: INVENSAS CORPORATION
Reel/Frame 035564/0470 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Assignment of Assignor's Interest
Sep 25, 2018
From: UZOH, CYPRIAN EMEKA; MIRKARIMI, LAURA WILLS
To: INVENSAS CORPORATION
Reel/Frame 046963/0312 →
Assignment of Assignor's Interest
Oct 23, 2019
From: SHEN, HONG; WOYCHIK, CHARLES G.; ARKALGUD, SITARAM R.
To: INVENSAS CORPORATION
Reel/Frame 050808/0016 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Assignment of Assignor's Interest
Jan 5, 2021
From: UZOH, CYPRIAN EMEKA
To: INVENSAS CORPORATION
Reel/Frame 054813/0178 →
Certificate of Conversion & Change of Name
Apr 4, 2022
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 059581/0435 →
Change of Name
Aug 30, 2022
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 061357/0485 →
Assignment of Assignor's Interest
Oct 19, 2022
From: HABA, BELGACEM; SHEN, HONG; VARIOT, PATRICK; KATKAR, RAJESH
To: INVENSAS CORPORATION
Reel/Frame 061472/0084 →
Change of Name
Dec 13, 2022
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 062118/0343 →
Security Interest
May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Security Interest
May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →
Change of Name
Oct 23, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073238/0665 →