IP Library › Granted Patent US 11,773,484
Granted Patent B2
US 11,773,484 · App. 17/327,437 · Granted Oct 3, 2023

Hard mask deposition using direct current superimposed radio frequency plasma

Inventors: Jianping Zhao (Austin, TX); Peter Lowell George Ventzek (Austin, TX); Toshihiko Iwao (Austin, TX)
Assignee: TOKYO ELECTRON LIMITED
C23C16/26C23C16/463C23C16/505C23C16/52
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Quick Facts
Patent No.
US 11,773,484
App. No.
17/327,437
Granted
Oct 3, 2023
Kind
B2
Abstract

A method of forming a carbon hard mask includes generating a radio frequency plasma including carbon-based ions by supplying continuous wave radio frequency power to a plasma processing chamber. The carbon-based ions have a first average ion energy. The method further includes adjusting the first average ion energy of the carbon-based ions to a second average ion energy by supplying continuous wave direct current power to the plasma processing chamber concurrently with the continuous wave radio frequency power and forming a carbon hard mask at a substrate within the plasma processing chamber by delivering the carbon-based ions having the second average ion energy to the substrate.

Claims (41)

1. A method of forming a carbon hard mask, the method comprising:

generating a radio frequency (RF) plasma comprising carbon-based ions at a substrate supported by a lower electrode within a plasma processing chamber by supplying continuous wave RF power to the plasma processing chamber, the carbon-based ions having a first average ion energy;

adjusting the first average ion energy of the carbon-based ions to a second average ion energy by supplying continuous wave direct current (DC) power through a low pass filter to an upper electrode of the plasma processing chamber concurrently with the continuous wave RF power, the DC power supplying a DC current matching the plasma current of the RF plasma; and

forming a carbon hard mask on the substrate within the plasma processing chamber by delivering the carbon-based ions having the second average ion energy to the substrate.

2. The method of claim 1 , wherein the carbon hard mask comprises an sp 3 fraction greater than about 0.2, the sp 3 fraction being the fraction of carbon-carbon bonds that are sp 3 bonded.

3. The method of claim 1 , wherein:

the continuous wave RF power comprises a frequency in the very high frequency (VHF) range; and

the second average ion energy is between about 20 eV and about 200 eV.

4. The method of claim 1 , further comprising:

providing a hydrocarbon precursor gas into the plasma processing chamber, wherein a portion of the carbon-based ions are formed within the RF plasma from the hydrocarbon precursor gas.

5. The method of claim 4 , wherein the hydrocarbon precursor gas comprises acetylene.

6. The method of claim 4 , wherein the hydrocarbon precursor gas comprises methane.

7. The method of claim 4 , further comprising:

vaporizing a solid target using laser ablation or arc evaporation to form gaseous carbon within the plasma processing chamber, wherein a portion of the carbon-based ions are formed within the RF plasma from the gaseous carbon.

8. The method of claim 1 , further comprising:

vaporizing a solid target using laser ablation or arc evaporation to form gaseous carbon within the plasma processing chamber, wherein a portion of the carbon-based ions are formed within the RF plasma from the gaseous carbon.

9. A method of forming a carbon hard mask, the method comprising:

providing continuous wave power to a plasma processing chamber, the continuous wave power comprising both radio frequency (RF) power to generate RF plasma comprising carbon-based ions at a substrate within the plasma processing chamber, and direct current (DC) power, wherein providing the continuous wave power comprises

supplying the RF power to a first electrode through an impedance matching circuit, the RF power comprising a frequency greater than 60 MHz to narrow the ion energy distribution (IED) of the carbon-based ions and decrease the average ion energy of the carbon-based ions, and

supplying the DC power to a second electrode through a low pass filter to increase the average ion energy of the carbon-based ions while maintaining the narrowed IED of the carbon-based ions, the DC power comprising a DC voltage between about −200 V and 200 V and supplying a DC current matching the plasma current of the RF plasma; and

forming a carbon hard mask on the substrate within the plasma processing chamber using the continuous wave power.

10. The method of claim 9 , wherein the carbon hard mask comprises an sp 3 fraction greater than about 0.6, the sp 3 fraction being the fraction of carbon-carbon bonds that are sp 3 bonded.

11. The method of claim 9 , wherein an average ion energy of carbon-based ions delivered to the substrate while forming the carbon hard mask is between about 20 eV and about 200 eV.

12. The method of claim 9 , further comprising:

vaporizing a solid target using laser ablation or arc evaporation to form gaseous carbon within the plasma processing chamber, wherein the carbon-based ions are formed from the gaseous carbon and delivered to the substrate while forming the carbon hard mask.

13. The method of claim 9 , wherein the first electrode and the second electrode are the same electrode.

14. The method of claim 9 , wherein the first electrode and the second electrode are different electrodes.

15. The method of claim 9 , further comprising:

providing a hydrocarbon precursor gas into the plasma processing chamber, wherein the carbon-based ions are formed from the hydrocarbon precursor gas and delivered to the substrate while forming the carbon hard mask; and

vaporizing a solid target using laser ablation or arc evaporation to form gaseous carbon within the plasma processing chamber, wherein a portion of the carbon-based ions are formed from the gaseous carbon and delivered to the substrate while forming the carbon hard mask.

16. The method of claim 9 , further comprising:

providing a hydrocarbon precursor gas into the plasma processing chamber, wherein the carbon-based ions are formed from the hydrocarbon precursor gas and delivered to the substrate while forming the carbon hard mask.

17. A method of forming a carbon hard mask, the method comprising:

providing a hydrocarbon precursor gas into a plasma processing chamber;

generating a radio frequency (RF) plasma comprising carbon-based ions at a substrate supported by a lower electrode within the plasma processing chamber by supplying continuous wave RF power comprising a frequency in the very high frequency (VHF) range to an upper electrode of the plasma processing chamber, the carbon-based ions having a first average ion energy, wherein a portion of the carbon-based ions are formed within the RF plasma from the hydrocarbon precursor gas;

adjusting the first average ion energy of the carbon-based ions to a second average ion energy by supplying continuous wave direct current (DC) power through a low pass filter to the upper electrode of the plasma processing chamber concurrently with the continuous wave RF power, the DC power supplying a DC current matching the plasma current of the RF plasma; and

forming a carbon hard mask on the substrate within the plasma processing chamber by delivering the carbon-based ions having the second average ion energy to the substrate.

18. The method of claim 17 , further comprising:

vaporizing a solid target using laser ablation or arc evaporation to form gaseous carbon within the plasma processing chamber, wherein a portion of the carbon-based ions are formed within the RF plasma from the gaseous carbon.

19. The method of claim 17 , wherein the carbon hard mask comprises an sp 3 fraction greater than about 0.2, the sp 3 fraction being the fraction of carbon-carbon bonds that are sp 3 bonded.

20. The method of claim 17 , wherein the hydrocarbon precursor gas comprises acetylene.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2021
From: ZHAO, JIANPING; VENTZEK, PETER LOWELL GEORGE; IWAO, TOSHIHIKO
To: TOKYO ELECTRON LIMITED
Reel/Frame 056318/0452 →
Continuity (2)
Provisional Application 63044531 · Jun 26, 2020
Related Publication 20210404055A1 · Dec 30, 2021