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App. No. 17/335,012 · Confirmation No. 8707

Interface Bus for Inter-Die Communication in a Multi-Chip Package Over High Density Interconnects

Applicant: Intel Corporation
Abandoned -- Failure to Respond to an Office Action View Publication ↗
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 Code Description Pages PDF
2023-06-08 ABN Abandonment 2 View
2022-11-30 CTFR Final Rejection 9 View
2022-11-30 SRFW Search information including classification, databases and other search related notes 1 View
2022-11-30 FWCLM Index of Claims 1 View
2022-11-30 SRNT Examiner's search strategy and results 7 View
2022-09-30 A... Amendment/Request for Reconsideration-After Non-Final Rejection 1 View
2022-09-30 CLM Claims 5 View
2022-09-30 REM Applicant Arguments/Remarks Made in an Amendment 2 View
2022-09-30 N417 Electronic Filing System Acknowledgment Receipt 2 View
2022-09-30 WFEE Fee Worksheet (SB06) 1 View
2022-07-20 OA.POSTCARD A courtesy postcard sent by USPTO to users who opt-in for e-Office Action 1 View
2022-07-12 CTNF Non-Final Rejection 8 View
2022-07-12 892 List of references cited by examiner 1 View
2022-07-12 FWCLM Index of Claims 1 View
2022-07-12 SRFW Search information including classification, databases and other search related notes 1 View
2022-07-12 SRNT Examiner's search strategy and results 5 View
2021-09-16 NTC.PUB Notice of Publication 1 View
2021-06-10 APP.FILE.REC Filing Receipt 4 View
2021-06-10 WFEE Fee Worksheet (SB06) 1 View
2021-05-31 ADS Application Data Sheet 8 View
2021-05-31 SPEC Specification 20 View
2021-05-31 CLM Claims 3 View
2021-05-31 ABST Abstract 1 View
2021-05-31 DRW Drawings-only black and white line drawings 8 View
2021-05-31 OATH Oath or Declaration filed 3 View
2021-05-31 WFEE Fee Worksheet (SB06) 2 View
2021-05-31 N417 Electronic Filing System Acknowledgment Receipt 3 View
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Quick Facts
App. No.
17/335,012
Filed
2021-05-31
Pub. No.
US20210288013A1
Art Unit
2181