IP Library › Patent Application 62577581
Patent Application Provisional
App. No. 62/577,581 · Confirmation No. 8602

Innovative Interconnect Design for Package Architecture to Improve Latency

Applicant: Intel Corporation
Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2017-11-07 APP.FILE.REC Filing Receipt 3 View
2017-10-31 ADS Application Data Sheet 9 View
2017-10-31 N417 Electronic Filing System Acknowledgment Receipt 2 View
2017-10-26 SPEC Specification 3 View
2017-10-26 DRW Drawings-only black and white line drawings 1 View
2017-10-26 SPEC Specification 1 View
2017-10-26 DRW Drawings-only black and white line drawings 1 View
2017-10-26 SPEC Specification 1 View
2017-10-26 DRW Drawings-only black and white line drawings 2 View
2017-10-26 SPEC Specification 1 View
2017-10-26 DRW Drawings-only black and white line drawings 1 View
2017-10-26 TR.PROV Provisional Cover Sheet (SB16) 3 View
2017-10-26 ADS Application Data Sheet 9 View
2017-10-26 WFEE Fee Worksheet (SB06) 2 View
2017-10-26 N417 Electronic Filing System Acknowledgment Receipt 3 View
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Quick Facts
App. No.
62/577,581
Filed
2017-10-26