Innovative interconnect design for package architecture to improve latency
An integrated circuit includes a package substrate that includes first and second electrical traces. The integrated circuit includes first, second, third, and fourth configurable dies, which are mounted on the package substrate. The first and second configurable dies are arranged in a first row. The third and fourth configurable dies are arranged in a second row, which is approximately parallel to the first row. The first and third configurable dies are arranged in a first column. The second and fourth configurable dies are arranged in a second column, which is approximately parallel to the first column. The first electrical trace couples the first and third configurable dies, and the second electrical trace couples the second and third configurable dies. The second electrical trace is oblique with respect to the first electrical trace. The oblique trace improves the latency of signals transmitted between dies and thereby increases the circuit operating speed.
1. An integrated circuit device comprising:
an interposer comprising a first electrical trace and a second electrical trace;
a first die, coupled to the interposer, comprising a first plurality of package bumps; and
a second die, coupled to the interposer, comprising a second plurality of package bumps, wherein the first plurality of package bumps has a first closest pitch between package bumps of the first plurality of package bumps and the second plurality of package bumps has a second closest pitch between package bumps of the second plurality of package bumps, the first closest pitch is shorter than the second closest pitch, the first electrical trace couples a first package bump of the first plurality of package bumps with a second package bump of the second plurality of package bumps, and the second electrical trace couples a third package bump of the first plurality of package bumps with a fourth package bump of the second plurality of package bumps.
2. The integrated circuit device of claim 1 , wherein the first die comprises a first die type, and the second die comprises a second die type.
3. The integrated circuit device of claim 1 , comprising a memory device.
4. The integrated circuit device of claim 1 , comprising a processor.
5. The integrated circuit device of claim 1 , comprising a package substrate coupled to the interposer.
6. The integrated circuit device of claim 5 , wherein the interposer is vertically above at least part of the package substrate.
7. The integrated circuit device of claim 6 , wherein at least a portion of the first and second plurality of package bumps are above the interposer.
8. The integrated circuit device of claim 7 , wherein the package substrate is coupled to a plurality of ball grid array bumps.
9. The integrated circuit device of claim 8 , wherein the plurality of ball grid array bumps are disposed on a first face of the package substrate opposite of a second face proximal to the interposer.
10. The integrated circuit device of claim 1 , wherein the first plurality of package bumps comprises input-output package bumps.
11. The integrated circuit device of claim 1 , wherein the second plurality of package bumps comprises an input-output package bumps.
12. The integrated circuit device of claim 1 , wherein the interposer comprises an interconnect bridge.
13. An integrated circuit device comprising:
a first electrical trace;
a second electrical trace;
a first die, coupled to the first electrical trace and the second electrical trace, comprising a first plurality of package bumps; and
a second die, coupled to the first electrical trace and the second electrical trace, comprising a second plurality of package bumps, wherein the first plurality of package bumps and the second plurality of package bumps have different pitches, the first electrical trace couples a first package bump of the first plurality of package bumps with a second package bump of the second plurality of package bumps, and the second electrical trace couples a third package bump of the first plurality of package bumps with a fourth package bump of the second plurality of package bumps.
14. The integrated circuit device of claim 13 , comprising an interposer comprising the first electrical trace and the second electrical trace.
15. The integrated circuit device of claim 13 , comprising a package substrate.
16. The integrated circuit device of claim 15 , wherein the first electrical trace and the second electrical trace are located between the first die and the package substrate.
17. An integrated circuit device comprising:
a first electrical trace;
a second electrical trace;
a first die, coupled to the first and second electrical traces, comprising a first plurality of package bumps; and
a second die, coupled to the first and second electrical traces, comprising a second plurality of package bumps, wherein the first plurality of package bumps in a first two-dimensional array and the second plurality of package bumps in a second two-dimensional array, the first two-dimensional array of package bumps having a first pitch in a first dimension of the first two-dimensional array being different than a second pitch of the second two-dimensional array, the first electrical trace couples a first package bump of the first plurality of package bumps with a second package bump of the second plurality of package bumps, and the second electrical trace couples a third package bump of the first plurality of package bumps with a fourth package bump of the second plurality of package bumps.
18. The integrated circuit device of claim 17 , wherein the integrated circuit device comprises an interposer comprising the first and second electrical traces.
19. The integrated circuit device of claim 18 , wherein the interposer comprises an interconnect bridge.
20. The integrated circuit device of claim 17 , comprising a package substrate, wherein the first electrical trace and the second electrical trace are located between the first die and the package substrate.