IP Library Granted Patent US 12,600,080
Granted Patent B2
US 12,600,080 · App. 17/347,008 · Granted Apr 14, 2026

Digital printed 3-D patterned emblem with graphics for soft goods

Inventors: Dave Savino (Glen Burnie, MD); Owen McGovern (Columbia, MD); Gillian Ross (Ellicott City, MD); Stephen Mynott (Towson, MD); Paul Weedlun (Fulton, MD)
Assignee: Avery Dennison Retail Information Services LLC
B29C59/026B29C59/005B29C65/48B29C66/727B29C66/7392B41M5/0047B41M5/0064B41M7/0027B29C2795/002B29K2101/12B29K2675/00B29L2031/722
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,600,080
App. No.
17/347,008
Granted
Apr 14, 2026
Kind
B2
Abstract

A multidimensional heat-seal emblem having a digitally-printed image on one side in registration to a three-dimensional relief profile. The emblem has enhanced aesthetic impact, flex, stretch, durability and is suitable for soft goods. A method of production is also disclosed that provides 0.05 mm level relief detail with high profile features up to 6 mm in height.

Claims (33)

1 . A sheet or roll-fed process to create a printed flexible and stretchable heat transfer emblem having an embossed relief pattern on one side, comprising the steps of:

coating a stretchable thermo-plastic film with an ink receptive layer;

printing on one side of the stretchable thermo-plastic film using a digital printer to define printed areas and unprinted areas, the thermo-plastic film comprising a hot melt adhesive;

using a sheet or roll-fed process, applying a polymeric protective layer over the printed side of the thermo-plastic film;

using a sheet or roll-fed process, adhering the unprinted side of said thermo-plastic film to a moldable foam substrate by an adhesive-backing on one side of said moldable foam substrate to thereby produce a multi-layer substrate, the adhesive backing comprising a thermoplastic adhesive, wherein the thermo-plastic film comprises layers having graduated melt temperatures such that a side of the thermo- plastic film facing the ink receptive layer melts at a higher temperature than a side of the thermo-plastic film facing the moldable foam substrate;

heating the multi-layer substrate to a compression temperature that allows the polymeric foam to remain compressed after molding;

embossing the multi-layer substrate by placing the printed thermo-plastic film against a mold having a lower temperature than the heated moldable substrate and a surface relief profile until the multi- layer substrate permanently retains the relief profile with profile changes of up to 6 mm and profile details of at least 0.05 mm, the molded multi-layer substrate being capable of elastic elongation in one direction within a range of 2% to 75%;

removing the embossed multi-layer substrate from the mold; and

trimming the embossed multi-layer substrate to provide said stretchable emblem having an embossed relief pattern on one side.

2 . The process of claim 1 , wherein said step of printing on one side of said thermo-plastic film comprises using an inkjet printer.

3 . The process of claim 1 , wherein said step of printing on one side of said thermo-plastic film comprises using a laser printer.

4 . The process of claim 1 , wherein said step of printing on one side of said thermo-plastic film comprises printing on said ink receptive coating.

5 . The process of claim 1 , wherein said thermo-plastic film comprises polyamide, polyurethane or polyolefin configured to bond to foam.

6 . The process of claim 1 , wherein said thermo-plastic film has a first melt point within a range of between 120 C and 180 C.

7 . The process of claim 6 , wherein said adhesive-backing on said moldable foam substrate has a second melt point within a range of between 90 C and 160 C.

8 . The process of claim 6 , wherein said adhesive-backing on said moldable foam substrate has a second melt point within a range of between 100 C and 160 C.

9 . The process of claim 8 , wherein said moldable foam substrate has a third melt point within a range of between 140 C and 200 C.

10 . The process of claim 1 , wherein said moldable foam substrate has a third melt point within a range of between 140 C and 200 C.

11 . The process of claim 1 , wherein said step of embossing the multi-layer substrate comprises placing the printed thermo-plastic film against a mold at room temperature.

12 . The process of claim 1 , wherein said moldable foam substrate comprises thermal formable polyurethane foam.

13 . The process of claim 1 , wherein said moldable foam substrate comprises any one from among a group consisting of open cell polyurethane foam, polyester foam, polyamide foam, acrylic foam, or EVA foams.

14 . The process of claim 1 , wherein said moldable foam substrate is less than or equal to 6 mm thick.

15 . A sheet or roll-fed process to create printed flexible and stretchable heat transfer emblem having a three-dimensional surface relief profile, comprising:

coating a thermo-plastic film with an ink receptive layer;

printing onto one side of the thermo-plastic film to define printed areas and unprinted areas, the thermo-plastic film comprising a hot melt adhesive;

using a sheet or roll-fed process, applying a polymeric protective layer over the printed side of the thermo-plastic film;

using a sheet or roll-fed process, adhering the thermo-plastic film to an adhesive-backed moldable substrate to form a multi-layer substrate, the adhesive backing comprising a thermoplastic adhesive, wherein the thermo-plastic film comprises layers having graduated melt temperatures such that a side of the thermo-plastic film facing the ink receptive layer melts at a higher temperature than a side of the thermo-plastic film facing the moldable foam substrate;

heating the multi-layer substrate to a compression temperature at which the moldable substrate can permanently compress;

embossing the multi-layer substrate using a mold having a lower temperature than the heated moldable substrate and a relief profile until the moldable multi-layer substrate takes on the relief profile with profile changes of up to 6 mm and profile details of at least 0.05 mm, the molded multi-layer substrate being capable of elastic elongation in one direction within a range of 2% to 75%;

removing the molded multi-layer substrate from the mold;

cutting the molded multi-layer sub in selected areas;

removing the cut/selected areas to produce a flexible and stretchable emblem having a three- dimensional relief profile on one side.

16 . The process of claim 15 , wherein said thermo-plastic film comprises TiO 2 .

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 14, 2023
From: LION BROTHERS COMPANY, INC.
To: AVERY DENNISON RETAIL INFORMATION SERVICES LLC
Reel/Frame 065871/0513 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S NAME AND STATE OF CORPORATION PREVIOUSLY RECORDED AT REEL: 062462 FRAME: 0359. ASSIGNOR(S) HEREBY CONFIRMS THE CONFIRMATORY ASSIGNMENT. Recorded Sep 28, 2023
From: SAVINO, DAVE; MCGOVERN, OWEN; ROSS, GILLIAN; MYNOTT, STEPHEN; WEEDLUN, PAUL
To: LION BROTHERS COMPANY, INC.
Reel/Frame 065051/0900 →
CONFIRMATORY ASSIGNMENT Recorded Jan 23, 2023
From: SAVINO, DAVE; MCGOVERN, OWEN; ROSS, GILLIAN; MYNOTT, STEPHEN; WEEDLUN, PAUL
To: LION BROTHERS & COMPANY, INC.
Reel/Frame 062462/0359 →
Continuity (2)
Provisional Application 63040420 · Jun 17, 2020
Related Publication 20210394430A1 · Dec 23, 2021
References Cited (27)
US 3298710A · Willetts · 1967 [cited by applicant]
US 4086379A · Brown · 1978 [cited by applicant]
US 5264279A · Imamura et al. · 1993 [cited by applicant]
US 5599416A · Kuwahara · 1997 [cited by applicant]
US 6290798B1 · Onishi et al. · 2001 [cited by applicant]
US 6309582B1 · Wu · 2001 [cited by applicant]
US 6423406B1 · Bilodeau · 2002 [cited by applicant]
US 6701652B1 · Serigraph · 2004 [cited by applicant]
US 8236122B2 · Kronzer · 2012 [cited by applicant]
US 20010025687A1 · Cross · 2001 [cited by applicant]
US 20020195005A1 · Oshima et al. · 2002 [cited by applicant]
US 20050245651A1 · Cooper · 2005 [cited by applicant]
US 20070172610A1 · Williams · 2007 [cited by applicant]
US 20070178295A1 · Haas · 2007 [cited by examiner]
US 20090160087A1 · Yang · 2009 [cited by examiner]
US 20090176039A1 · af Strom · 2009 [cited by applicant]
US 20140093707A1 · Kaufmann · 2014 [cited by applicant]
US 20150122410A1 · Tanrikulu et al. · 2015 [cited by applicant]
US 20160052256A1 · Rumsey · 2016 [cited by applicant]
US 20160089852A1 · Lindenfelzer · 2016 [cited by examiner]
US 20190118575A1 · McGovern et al. · 2019 [cited by applicant]
US 20200238601A1 · Pachaly et al. · 2020 [cited by applicant]
JP 5172598 · 2013 [cited by applicant]
WO 2016044547 · 2016 [cited by applicant]
WO 2016196267 · 2016 [cited by applicant]
WO 2017044735 · 2017 [cited by applicant]
WO 2019063094 · 2019 [cited by applicant]