Vapor phase thermal etch solutions for metal oxo photoresists
Embodiments disclosed herein include methods of developing a metal oxo photoresist. In an embodiment, the method comprises providing a substrate with the metal oxo photoresist into a vacuum chamber, where the metal oxo photoresist comprises exposed regions and unexposed regions. In an embodiment, the unexposed regions comprise a higher carbon concentration than the exposed regions. The method may further comprise vaporizing a halogenating agent into the vacuum chamber, where the halogenating agent reacts with either the unexposed regions or the exposed regions to produce a volatile byproduct. In an embodiment, the method may further comprise purging the vacuum chamber.
1. A method of developing a metal oxo photoresist, comprising:
providing a substrate with the metal oxo photoresist into a vacuum chamber, wherein the metal oxo photoresist comprises exposed regions and unexposed regions, and wherein the unexposed regions comprise a higher carbon concentration than the exposed regions;
vaporizing a halogenating agent into the vacuum chamber, wherein the halogenating agent reacts with either the unexposed regions or the exposed regions to produce a volatile byproduct; and
purging the vacuum chamber, wherein the halogenating agent comprises a metal halide.
2. The method of claim 1 , wherein the metal halide has the chemical formula MX a or MX a L b , wherein M is a metal, X is a halogen, L is a volatile ligand, a is 1-6, and b is 1-5.
3. The method of claim 2 , wherein the metal halide comprises MoCl 5 , TaCl 5 , NbCl 5 , or WCl 5 .
4. The method of claim 1 , wherein the halogenating agent is diluted with an inert gas.
5. A method of developing a metal oxo photoresist, comprising:
providing a substrate with the metal oxo photoresist into a vacuum chamber, wherein the metal oxo photoresist comprises exposed regions and unexposed regions, and wherein the unexposed regions comprise a higher carbon concentration than the exposed regions;
vaporizing a halogenating agent into the vacuum chamber, wherein the halogenating agent reacts with either the unexposed regions or the exposed regions to produce a volatile byproduct; and
purging the vacuum chamber, wherein the halogenating agent comprises a metal oxy halide.
6. The method of claim 5 , wherein the metal oxy halide has the chemical formula MO a X b or MO a X b L c , wherein M is a metal, X is a halogen, L is volatile ligand, a is 1-5, b is 1-5, and c is 1-5.
7. The method of claim 6 , wherein the metal oxy halide comprises MoOCl 4 , MoO 2 Cl 2 , WO 2 Cl 2 .
8. The method of claim 5 , wherein the halogenating agent is diluted with an inert gas.
9. A method of developing a metal oxo photoresist, comprising:
providing a substrate with the metal oxo photoresist into a vacuum chamber, wherein the metal oxo photoresist comprises exposed regions and unexposed regions, and wherein the unexposed regions comprise a higher carbon concentration than the exposed regions;
vaporizing a halogenating agent into the vacuum chamber, wherein the halogenating agent reacts with either the unexposed regions or the exposed regions to produce a non-volatile product;
vaporizing a ligand into the vacuum chamber, wherein the ligand reacts with the non-volatile product to produce a volatile byproduct; and
purging the vacuum chamber.
10. The method of claim 9 , wherein the halogenating agent comprises a metal halide.
11. The method of claim 9 , wherein the halogenating agent comprises a metal oxy halide.
12. The method of claim 9 , wherein the halogenating agent is an organic halogenating agent.
13. The method of claim 9 , wherein the ligand is a protonated ligand.
14. The method of claim 13 , wherein the protonated ligand is an amine.