Structures and methods for electrically connecting printed components
A printed structure includes a destination substrate comprising two or more contact pads disposed on or in a surface of the destination substrate, a component disposed on the surface, and two or more electrically conductive connection posts. Each of the connection posts extends from a common side of the component. Each of the connection posts is in electrical and physical contact with one of the contact pads. The component is tilted with respect to the surface of the destination substrate. Each of the connection posts has a flat distal surface.
1. A method of electrically connecting a component by printing, the method comprising:
providing a component comprising two or more electrically conductive connection posts formed on and extending from a common side of the component, wherein the component is disposed on a transfer device and each of the connection posts has a flat distal surface, wherein ones of the connection posts extend from different surfaces on the common side, the different surfaces being disposed in different planes with respect to the component;
providing a destination substrate comprising two or more contact pads disposed on or in a surface of the destination substrate; and
printing the component from the transfer device to the destination substrate such that the component is tilted relative to the destination substrate after the printing and each of the connection posts is in direct electrical and physical contact with one of the contact pads.
2. The method of claim 1 , wherein:
(i) the distal end of each of the connection posts is substantially parallel to the destination substrate as the transfer device brings the component into contact with the destination substrate, and
(ii) the component is tilted with respect to the destination substrate after the transfer device is separated from the component.
3. The method of claim 1 , wherein the transfer device is an elastomeric stamp.
4. The method of claim 1 , wherein the component is printed by micro-transfer printing.
5. The method of claim 1 , wherein the component comprises a broken or separated tether.
6. The method of claim 1 , wherein the component is a completed semiconductor device.
7. The method of claim 1 , wherein the connection posts have different heights.
8. The method of claim 1 , wherein the connection posts have a common height and ones of the connection posts extend from different surfaces on the common side, the different surfaces being disposed in different planes with respect to the component.
9. The method of claim 1 , comprising piercing the one of the contact pads with the connection post.
10. The method of claim 1 , comprising embedding the connection post in the one of the contact pads.
11. The method of claim 1 , wherein each of the connection posts has a post length to post width aspect ratio of at least 2:1.
12. The method of claim 1 , wherein each of the connection posts has an inverted trapezoidal vertical cross section.