Method to construct 3D devices and systems

1. A method to construct a 3D system, the method comprising:

providing a base wafer;

transferring a first memory wafer on top of said base wafer;

thinning said first memory wafer, thus forming a thin first memory wafer;

transferring a second memory wafer on top of said thin first memory wafer;

thinning said second memory wafer, thus forming a thin second memory wafer; and

transferring a memory control wafer on top of said thin second memory wafer;

wherein said transferring a memory control wafer comprises bonding of said memory control wafer to said thin second memory wafer, and

wherein said bonding comprises oxide to oxide and conductor to conductor bonding.

2. The method according to claim 1 ,

wherein said first memory wafer comprises a cut-layer, and

wherein said thinning of said first memory wafer comprises a final thickness of said thin first memory wafer of less than 20 microns and greater than 0.1 microns.

3. The method according to claim 1 , further comprising:

forming a logic stratum disposed either above or below said thin first memory wafer; and

forming a thermal isolation layer disposed between said logic stratum and said thin first memory wafer,

wherein said thermal isolation layer is designed so during said 3D system operation a first temperature of memory cells of said thin first memory wafer is at least 20° C. lower than a second temperature of said logic stratum.

4. The method according to claim 1 , further comprising:

thinning said memory control wafer.

5. The method according to claim 1 ,

wherein said transferring a second memory wafer comprises bonding of said second memory wafer to said thin first memory wafer, and

wherein said bonding comprises oxide to oxide and conductor to conductor bonding.

6. The method according to claim 1 , further comprising:

performing a step of memory test,

wherein said thin first memory wafer comprises a first memory, and

wherein said thin second memory wafer comprises a second memory; and then

performing a step using a first portion of said first memory as an alternative for a portion of said second memory or a portion of said second memory as an alternative for a second portion of said first memory.

7. The method according to claim 1 , further comprising:

performing a step of dicing said base wafer, said thin first memory wafer, said thin second memory wafer, and said memory control wafer,

wherein said dicing results in at least one die having a planner size greater than 40×40 mm 2 .

8. A method to construct a 3D system, the method comprising:

providing a base wafer;

processing a memory control circuit on top of said base wafer;

transferring a first memory wafer on top of said memory control circuit;

thinning said first memory wafer, thus forming a thin first memory wafer;

transferring a second memory wafer on top of said thin first memory wafer; and

thinning said second memory wafer, thus forming a thin second memory wafer;

wherein said transferring said second memory wafer comprises bonding of said second memory wafer to said thin first memory wafer, and

wherein said bonding comprises oxide to oxide and conductor to conductor bonding.

9. The method according to claim 8 ,

wherein said first memory wafer comprises a cut-layer, and

wherein said thinning of said first memory wafer comprises a final thickness of said thin first memory wafer of less than 20 microns and greater than 0.8 microns.

10. The method according to claim 8 , further comprising:

forming a logic stratum disposed either above or below said thin first memory wafer; and

forming a thermal isolation layer disposed between said logic stratum and said thin first memory wafer,

wherein said thermal isolation layer is designed so during said 3D system operation a first temperature of memory cells of said thin first memory wafer is at least 20° C. lower than a second temperature of said logic stratum.

11. The method according to claim 8 , further comprising:

transferring a memory control wafer on top of said base wafer.

12. The method according to claim 8 ,

wherein said transferring said first memory wafer comprises bonding of said first memory wafer to said memory control circuit, and

wherein said bonding comprise oxide to oxide and conductor to conductor bonding.

13. The method according to claim 8 , further comprising:

performing a step of memory test,

wherein said thin first memory wafer comprises a first memory, and

wherein said thin second memory wafer comprises a second memory; and then

performing a step using a first portion of said first memory as an alternative for a portion of said second memory or a portion of said second memory as an alternative for a second portion of said first memory.

14. The method according to claim 8 , further comprising:

performing a step of dicing said base wafer, said thin first memory wafer, and said thin second memory wafer, wherein said dicing results in at least one die having a planner size greater than 40×40 mm 2 .

15. A method to construct a 3D system, the method comprising:

providing a base wafer;

processing a memory control circuit on top of said base wafer;

transferring a first memory level on top of said memory control circuit;

thinning said first memory level, thus forming a thin first memory level;

transferring a second memory level on top of said thin first memory level;

thinning said second memory level, thus forming a thin second memory level;

wherein said transferring said second memory level comprises bonding of said second memory level to said thin first memory level, and

wherein said bonding comprises oxide to oxide and conductor to conductor bonding.

16. The method according to claim 15 ,

wherein said first memory level comprises a cut-layer, and

wherein said thinning of said first memory level comprises a final thickness of said thin first memory level of less than 20 microns and greater than 0.8 microns.

17. The method according to claim 15 , further comprising:

forming a logic stratum disposed either above or below said thin first memory level; and

forming a thermal isolation layer disposed between said logic stratum and said thin first memory level,

wherein said thermal isolation layer is designed so during said 3D system operation a first temperature of memory cells of said first memory level is at least 20° C. lower than a second temperature of said logic stratum.

18. The method according to claim 15 ,

wherein transferring a first memory level comprises bonding of said first thin memory level to said memory control circuit; and

wherein said bonding comprises oxide to oxide and conductor to conductor bonding.

19. The method according to claim 15 , further comprising:

performing a step of memory test,

wherein said thin first memory level comprises a first memory, and

wherein said second thin memory level comprises a second memory; and then

performing a step using a first portion of said first memory as an alternative for a portion of said second memory or a portion of said second memory as an alternative for a second portion of said first memory.

20. The method according to claim 15 , further comprising:

performing a step of dicing said base wafer,

wherein said dicing results in at least one die having a planner size greater than 40×40 mm 2 .