Methods and apparatus for processing a substrate
Methods and apparatus for processing a substrate are provided. For example, a method includes sputtering a material from a target in a PVD chamber to form a material layer on a layer comprising a feature of the substrate, the feature having an opening width defined by a first sidewall and a second sidewall, the material layer having a greater lateral thickness at the top surface of the layer than a thickness on the first sidewall or the second sidewall within the feature, depositing additional material on the layer by biasing the layer with an RF bias at a low power, etching the material layer from the layer by biasing the layer with an RF bias at a high-power, and repeatedly alternating between the low power and the high-power at a predetermined frequency.
1 . A method of physical vapor deposition on a substrate comprising:
I) sputtering a material from a target in a physical vapor deposition (PVD) chamber to form a sputtered material layer on a first layer comprising a feature extending a depth from a top surface of the first layer to a top surface of a base layer on which the first layer is deposited, prior to forming the sputtered material layer, the feature having an initial top opening width defined by a first sidewall and a second sidewall at the top surface of the first layer, and an initial internal width between the first sidewall and the second sidewall within the feature, after forming the sputtered material layer the feature having a sputtered top opening width which is less than the initial top opening width, the sputtered material layer forming an overhang of sputtered material extending away from the first sidewall and the second sidewall such that the sputtered material layer has a greater lateral thickness at the top surface of the first layer than a lateral thickness of sputtered material present on the first sidewall or the second sidewall within the feature;
II) repeating a deposition-etch cycle comprising:
i) depositing additional material on the sputtered material layer by biasing the first layer with an RF bias at a first power; followed by
ii) etching the sputtered material from the sputtered material layer by biasing the sputtered material layer with an RF bias at a second power that is higher than the first power forming a cycled top opening width of the feature;
wherein the deposition-etch cycle further comprises alternating between the first power and the second power at a frequency of about 10 kHz to about 100 kHz,
wherein the deposition-etch cycle is repeated until the cycled top opening width is greater than the sputtered top opening width; and
III) depositing a conductive fill material within the feature.
2 . The method of claim 1 , wherein repeatedly alternating between the first power and the second power at the frequency results in a reduction of arcing between the substrate and the physical vapor deposition (PVD) chamber.
3 . The method of claim 1 , wherein a duty cycle of the RF bias is about 1% to about 99%, and wherein the duty cycle is a time percentage of a cycle spent applying the RF bias at the second power to the top surface of the first layer.
4 . The method of claim 1 , wherein the target comprises at least one of aluminum (Al), cobalt (Co), copper (Cu), indium (In), molybdenum (Mo), nickel (Ni), rhodium (Rh), ruthenium (Ru), tantalum (Ta), titanium (Ti), tungsten (W).
5 . The method of claim 1 , wherein the first power is about 5 W to about 100 W.
6 . The method of claim 1 , wherein the second power is at least one of about 1400 W, about 2000W, or about 3000 W.
7 . The method of claim 1 , wherein sputtering the material forms the material layer with a thickness of about 3 nm to 40 nm on the top surface of the first layer.
8 . The method of claim 1 , wherein repeatedly alternating between the first power and the second power forms the material layer with a thickness of about 3 nm to 20 nm on the top surface of the first layer.
9 . The method of claim 1 , wherein the initial top opening width of the feature is about 3 nm to about 40 nm before sputtering the material.
10 . The method of claim 1 , wherein the initial top opening width of the feature is about 3 nm to about 20 nm before sputtering the material, wherein sputtering the material forms the material layer with a thickness of about 3 nm to 40 nm on the top surface of the first layer, wherein repeatedly alternating between the RF bias at the first power and the RF bias at the second power forms the material layer with a thickness of about 3 nm to 40 nm on the top surface of the first layer, and
wherein the cycled top opening width of the feature is greater than or equal to about 7 nm.
11 . A method of physical vapor deposition on a substrate comprising:
I) sputtering a material from a target in a physical vapor deposition (PVD) chamber to form a sputtered material layer on a first layer comprising a feature extending a depth from a top surface of the first layer to a top surface of a base layer on which the first layer is deposited, prior to forming the sputtered material layer, the feature having an initial top opening width defined by a first sidewall and a second sidewall at the top surface of the first layer, and an initial internal width between the first sidewall and the second sidewall within the feature, after forming the sputtered material layer the feature having a sputtered top opening width which is less than the initial top opening width, the sputtered material layer forming an overhang of sputtered material extending away from the first sidewall and the second sidewall such that the sputtered material layer has a greater lateral thickness at the top surface of the first layer than a lateral thickness of sputtered material present on the first sidewall or the second sidewall within the feature;
II) repeating a deposition-etch cycle comprising:
i) depositing additional material on the sputtered material layer by biasing the first layer with an RF bias at a first power and at a dual frequency from about 2 MHz to about 60 MHz; followed by
ii) etching the sputtered material from the sputtered material layer by biasing the sputtered material layer with an RF bias at a second power that is higher than the first power and at the dual frequency from about 2 MHz to about 60 MHz forming a cycled top opening width of the feature;
wherein the deposition-etch cycle further comprises alternating between the first power and the second power at a frequency of about 10 KHz to about 100 kHz,
wherein the deposition-etch cycle is repeated until the cycled top opening width is greater than the sputtered top opening width; and
III) depositing a conductive fill material within the feature.
12 . A non-transitory computer readable storage medium having stored thereon instructions that when executed by a processor perform a method of physical vapor deposition on a substrate comprising:
I) sputtering a material from a target in a physical vapor deposition (PVD) chamber to form a sputtered material layer on a first layer comprising a feature extending a depth from a top surface of the first layer to a top surface of a base layer on which the first layer is deposited, prior to forming the sputtered material layer, the feature having an initial top opening width defined by a first sidewall and a second sidewall at the top surface of the first layer, and an initial internal width between the first sidewall and the second sidewall within the feature, after forming the sputtered material layer the feature having a sputtered top opening width which is less than the initial top opening width, the sputtered material layer forming an overhang of sputtered material extending away from the first sidewall and the second sidewall such that the sputtered material layer has a greater lateral thickness at the top surface of the first layer than a lateral thickness of sputtered material present on the first sidewall or the second sidewall within the feature;
II) repeating a deposition-etch cycle comprising:
i) depositing additional material on the sputtered material layer by biasing the first layer with an RF bias at a first power; followed by p 1 ii) etching the sputtered material from the sputtered material layer by biasing the sputtered material layer with an RF bias at a second power that is higher than the first power forming a cycled top opening width of the feature;
wherein the deposition-etch cycle further comprises alternating between the first power and the second power at a frequency of about 10 KHz to about 100 kHz,
wherein the deposition-etch cycle is repeated until the cycled top opening width is greater than the sputtered top opening width; and
III) depositing a conductive fill material within the feature.
13 . The non-transitory computer readable storage medium of claim 12 , wherein the substrate is substantially undamaged.
14 . The non-transitory computer readable storage medium of claim 12 , wherein a duty cycle of the RF bias at the second power is about 1% to about 99%, and wherein the duty cycle is a time percentage of a cycle spent applying the RF bias at the second power to the top surface of the first layer.
15 . The non-transitory computer readable storage medium of claim 12 , wherein the target comprises at least one of aluminum (Al), cobalt (Co), copper (Cu), indium (In), molybdenum (Mo), nickel (Ni), rhodium (Rh), ruthenium (Ru), tantalum (Ta), titanium (Ti), tungsten (W).
16 . The non-transitory computer readable storage medium of claim 12 , wherein the RF bias at the first power is about 5 W to about 300 W.
17 . The non-transitory computer readable storage medium of claim 12 , wherein the second power is at least one of about 1400 W, about 2000W, or about 3000 W.