Inductor
An inductor includes a wire and a magnetic layer which has a via, having an inner peripheral surface. On a cross-section across the via, a first point and a second point are located at one side and the other side in a direction in which the first principal surface extends and are kept 50 μm away from a first edge on one side of the inner peripheral surface in the thickness direction, and a third point and a fourth point are located at one side and the other side in the extending direction and are kept 50 μm away from a second edge on the other side of the inner peripheral surface in the thickness direction. An area of a quadrangle having all four points as vertices and an area of the molten solid inside the quadrangle are obtained, along with a percent (S 1 /S 0 ×100) of the area.
1. An inductor comprising:
a wire, and
a magnetic layer embedding the wire and containing magnetic particles,
wherein the magnetic layer has
a first principal surface disposed at one side relative to the wire in a thickness direction with a space between the first principal surface and the wire,
a second principal surface disposed at an opposite side of the first principal surface relative to the wire with a space between the first principal surface and the second principal surface in the thickness direction, and
a via penetrating from the first principal surface toward the wire,
wherein the via has an inner peripheral surface when viewed in the thickness direction, and
wherein a percent of molten solid obtained from the magnetic particles by a following method is 10% or less:
on a cross-section across the via, a first point and a second point are located at one side and the other side in a direction in which the first principal surface extends and are kept 50 μm away from an edge on one side of the inner peripheral surface in the thickness direction, and a third point and a fourth point are located at one side and the other side in the extending direction and are kept 50 μm away from an edge on the other side of the inner peripheral surface in the thickness direction,
an area S 0 of a quadrangle having the first point, the second point, the third point, and the fourth point as vertices is obtained,
an area S 1 of the molten solid located inside the quadrangle is obtained, and
a percent (S 1 /S 0 ×100) of the area S 1 of the molten solid to the area S 0 of the quadrangle is obtained.
2. The inductor according to claim 1 , wherein the number of steps on the inner peripheral surface in the via is 1 or less.
3. The inductor according to claim 1 , wherein the inner peripheral surface has a tapered surface where a cross-sectional area of an opening of the via gradually increases toward the first principal surface.
4. The inductor according to claim 1 , wherein a one-side surface of the wire in the thickness direction exposed from the via has a flat shape on a cross section on which the wire extends.
5. The inductor according to claim 1 , wherein
the wire includes a conductive wire and an insulating film disposed on a peripheral surface of the conductive wire, and
the insulating film is exposed from the via.
6. The inductor according to claim 1 , further comprising:
a process stabilization layer filling the via.
7. The inductor according to claim 6 , wherein the inner peripheral surface has a second tapered surface where a cross-sectional area of an opening of the via gradually decreases toward the first principal surface.
8. The inductor according to claim 1 , wherein
the wire includes a conductive wire and an insulating film disposed on a peripheral surface of the conductive wire,
the insulating film having a protruding edge protruding inwardly from the other edge of the inner peripheral surface in the via,
the inductor further includes a process stabilization layer disposed on a one-side surface of the protruding edge in the thickness direction and on the inner peripheral surface, and
the protruding edge and the process stabilization layer expose a one-side surface of the conductive wire in the thickness direction.
9. The inductor according to claim 6 , wherein
the process stabilization layer is further disposed on the first principal surface.
10. The inductor according to claim 1 , wherein
the magnetic particles are soft magnetic particles.
11. The inductor according to claim 1 , wherein
the via has a maximum length D 1 and a minimum length D 2 in a surface direction orthogonal to the thickness direction, and
a ratio (D 1 /D 2 ) of the maximum length D 1 to the minimum length D 2 is 10 or less.