IP Library › Granted Patent US 11,006,515
Granted Patent B2
US 11,006,515 · App. 17/044,448 · Granted May 11, 2021

Magnetic wiring circuit board

Inventors: Yoshihiro Furukawa (Osaka, JP); Keisuke Okumura (Osaka, JP)
Assignee: NITTO DENKO CORPORATION
H05K1/0224H05K1/03H05K2201/08
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,006,515
App. No.
17/044,448
Granted
May 11, 2021
Kind
B2
Abstract

A magnetic wiring circuit board includes an insulating layer, a plurality of wiring portions spaced from each other, a magnetic layer disposed so as to embed the plurality of wiring portions on the insulating layer, and a suppressing portion for suppressing magnetic coupling of at least the two wiring portions.

Claims (11)

1. A magnetic wiring circuit board comprising:

an insulating layer,

a plurality of wiring portions spaced from each other in a direction perpendicular to a thickness direction on one surface in the thickness direction of the insulating layer,

a magnetic layer disposed so as to embed the plurality of wiring portions on the one surface in the thickness direction of the insulating layer and having one surface in the thickness direction spaced at one side in the thickness direction with respect to one surfaces in the thickness direction of the plurality of wiring portions, and

a suppressing portion for suppressing magnetic coupling of at least the two wiring portions formed so as to extend from the one surface in the thickness direction of the magnetic layer toward the other side in the thickness direction relative to a phantom line connecting the one surfaces in the thickness direction of at least the two wiring portions in the magnetic layer between at least the two wiring portions adjacent to each other.

2. The magnetic wiring circuit board according to claim 1 , wherein

the suppressing portion reaches the one surface in the thickness direction of the insulating layer.

3. The magnetic wiring circuit board according to claim 1 , wherein

the suppressing portion is a slit formed in the magnetic layer.

4. The magnetic wiring circuit board according to claim 1 , wherein

a ratio (W/S) of a length W in the direction perpendicular to the thickness direction in the suppressing portion to a length S in the direction perpendicular to the thickness direction between at least the two wiring portions is 0.4 or less.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 4, 2020
From: FURUKAWA, YOSHIHIRO; OKUMURA, KEISUKE
To: NITTO DENKO CORPORATION
Reel/Frame 054544/0562 →
Priority Claims (1)
JP JP2018-074801 · Apr 9, 2018 · national
Continuity (1)
Related Publication 20210037640A1 · Feb 4, 2021