Light-emitting device, integrated light-emitting device, and light-emitting module
A light-emitting device includes a base including a conductive wiring; a light-emitting element mounted on the base and configured to emit light; a light reflective film provided on an upper surface of the light-emitting element; and a encapsulant covering the light-emitting element and the light reflective film. A ratio (H/W) of a height (H) of the encapsulant to a width (W) of a bottom surface of the encapsulant is less than 0.5.
1. A integrated light-emitting device comprising:
a base including a conductive wiring;
a plurality of light-emitting devices mounted on the base and configured to emit a first light, each of the light-emitting devices comprising a light-emitting element and a encapsulant covering the light-emitting element; and
a plurality of light reflective films, each provided on an upper surface of a respective one of the light-emitting elements; wherein:
a ratio (H/W) of a height (H) of each of the encapsulants to a width (W) of a bottom surface of that encapsulant is less than 0.5; and
each of the light-emitting devices has a batwing light distribution characteristics.
2. The integrated light-emitting device according to claim 1 , wherein 30% or more of total light emitted from each of the light-emitting devices is emitted in a direction at an elevation angle of less than 20° relative to an upper surface of the base.
3. The integrated light-emitting device according to claim 1 , wherein 40% or more of total light emitted from each of the light-emitting devices is emitted in a direction at an elevation angle of less than 20° relative to an upper surface of the base.
4. The integrated light-emitting device according to claim 1 , further comprising a light diffusion plate disposed above the light-emitting devices,
wherein a ratio (OD/Pitch) of a distance (OD) between the base and the light diffusion plate to a distance (pitch) between the adjacent light-emitting elements is 0.2 or less.
5. The integrated light-emitting device according to claim 1 , wherein each of the encapsulants contain a light diffusion material.
6. The integrated light-emitting device according to claim 1 , further comprising a plurality of light reflective members, each disposed between adjacent ones of the light-emitting devices.
7. The integrated light-emitting device according to claim 6 , wherein each of the light reflective members has a height that is 0.3 times or less than a distance between the adjacent light-emitting devices.
8. The integrated light-emitting device according to claim 6 , wherein each of the light reflective members has a height 0.2 times or less a distance between the adjacent light-emitting devices.
9. The integrated light-emitting device according to claim 1 , wherein each of the encapsulants has an upper surface with a convex curved shape.
10. The integrated light-emitting device according to claim 1 , wherein each of the encapsulants is formed in the dome shape.
11. The integrated light-emitting device according to claim 1 , wherein each of the light reflective films is configured such that a light transmissivity of the light reflective film for said first light has incident-angle dependence.
12. The integrated light-emitting device according to claim 1 , wherein a light transmissivity of the light reflective film for first said light increases as an absolute value of an incident angle of said first light increases.
13. The integrated light-emitting device according to claim 1 , wherein each of the light reflective films is formed of a dielectric multilayer film.
14. The integrated light-emitting device according to claim 1 , wherein:
a reflection wavelength range of each of the light reflective films for light perpendicularly incident on the light reflective film includes an emission peak wavelength of the light-emitting element, and
in the reflection wavelength range, a region on a longer wavelength side of the emission peak wavelength is wider than a region on a shorter wavelength side of the emission peak wavelength.
15. The integrated light-emitting device according to claim 1 , wherein the ratio (H/W) of a height (H) of each of the encapsulants to a width (W) of the bottom surface of the encapsulant is 0.3 or less.
16. The integrated light-emitting device according to claim 1 , wherein the light-emitting element is mounted in a flip-chip manner.
17. A light-emitting module comprising:
the integrated light-emitting device according claim 1 ; and
a wavelength conversion member located at a light extraction surface side of the integrated light-emitting device, the wavelength conversion member being configured to absorb part of light from the light-emitting element and to convert absorbed light to light with a wavelength different from an emission wavelength of the light-emitting element.
18. The integrated light-emitting device according to claim 10 , wherein the ratio (H/W) of a height (H) of each of the encapsulants to a width (W) of the bottom surface of the encapsulant is 0.3 or less.
19. A integrated light-emitting device comprising:
a base including a conductive wiring;
a plurality of light-emitting devices mounted on the base and configured to emit a first light, each of the light-emitting devices comprising a light-emitting element and a encapsulant covering the light-emitting element; and
a plurality of light reflective films, each provided on an upper surface of a respective one of the light-emitting elements; wherein:
a ratio (H/W) of a height (H) of each of the encapsulants to a width (W) of a bottom surface of that encapsulant is less than 0.5; and
30% or more of total light emitted from each of the light-emitting devices is emitted in a direction at an elevation angle of less than 20° relative to an upper surface of the base.
20. A integrated light-emitting device comprising:
a base including a conductive wiring;
a plurality of light-emitting devices mounted on the base and configured to emit a first light, each of the light-emitting devices comprising a light-emitting element and a encapsulant covering the light-emitting element; and
a plurality of light reflective films, each provided on an upper surface of a respective one of the light-emitting elements; wherein:
a ratio (H/W) of a height (H) of each of the encapsulants to a width (W) of a bottom surface of that encapsulant is less than 0.5; and
each of the light reflective films is configured such that a light transmissivity of the light reflective film for said first light has incident-angle dependence.