3D semiconductor device and structure with memory
A 3D semiconductor device, the device including: a first level including a first single crystal layer, the first level including a plurality of first transistors and at least one metal layer, where the at least one metal layer overlays the first single crystal layer, and where the at least one metal layer includes interconnects between the plurality of first transistors, the interconnects between the plurality of first transistors include forming first control circuits; a second level overlaying the at least one metal layer, the second level including a plurality of second transistors; a third level overlaying the second level, the third level including a plurality of third transistors, where the second level includes a plurality of first memory cells, the first memory cells each including at least one of the plurality of second transistors, where the third level includes a plurality of second memory cells, the second memory cells each including at least one of the plurality of third transistors, where at least one of the plurality of second memory cells is at least partially atop of the first control circuits, where the first control circuits are adapted to control data written to at least one of the plurality of second memory cells; and where the plurality of second transistors are horizontally oriented transistors.
1. A 3D semiconductor device, the device comprising:
a first level comprising a first single-crystal layer, said first level comprising a plurality of first transistors and at least one metal layer,
wherein said at least one metal layer overlays said first single-crystal layer, and
wherein said at least one metal layer comprises interconnects between said plurality of first transistors, said interconnects between said plurality of first transistors comprise forming first control circuits;
a second level overlaying said at least one metal layer, said second level comprising a plurality of second transistors;
a third level overlaying said second level, said third level comprising a plurality of third transistors,
wherein said second level comprises a plurality of first memory cells, said plurality of first memory cells each comprising at least one of said plurality of second transistors,
wherein said third level comprises a plurality of second memory cells, said plurality of second memory cells each comprising at least one of said plurality of third transistors,
wherein at least one of said plurality of second memory cells is at least partially atop of said first control circuits,
wherein said first control circuits are adapted to control data written to at least one of said plurality of second memory cells, and
wherein said plurality of second memory cells are DRAM memory cells; and
a fourth level disposed above said third level,
wherein said fourth level comprises a second single-crystal layer,
wherein said second level is bonded to said first level, and
wherein said bonded comprises oxide to oxide bonds.
2. The 3D semiconductor device according to claim 1 ,
wherein said first control circuits comprise memory peripheral circuits, and
wherein said memory peripheral circuits comprise a plurality of decoders.
3. The 3D semiconductor device according to claim 1 ,
wherein said plurality of second transistors are aligned to said plurality of first transistors with less than 450 nm and greater than 0.1 nm misalignment.
4. The 3D semiconductor device according to claim 1 ,
wherein said plurality of first memory cells are controlled thru a plurality of memory control lines, and
wherein said third level comprises at least one of said plurality of memory control lines.
5. The 3D semiconductor device according to claim 1 , further comprising:
at least one connecting via disposed through said first single-crystal layer.
6. The 3D semiconductor device according to claim 1 ,
wherein said second level is bonded to said first level, and
wherein said bonded comprises oxide-to-oxide bonds.
7. The 3D semiconductor device according to claim 1 ,
wherein at least one of said plurality of third transistors comprises a single-crystal channel.
8. A 3D semiconductor device, the device comprising:
a first level comprising a first single-crystal layer, said first level comprising a plurality of first transistors and at least one metal layer,
wherein said at least one metal layer overlays said first single-crystal layer, and
wherein said at least one metal layer comprises interconnects between said plurality of first transistors, said interconnects between said plurality of first transistors comprise forming first control circuits;
a second level overlaying said at least one metal layer, said second level comprising a plurality of second transistors;
a third level overlaying said second level, said third level comprising a plurality of third transistors,
wherein said second level comprises a plurality of first memory cells, said first memory cells each comprising at least one of said plurality of second transistors,
wherein said third level comprises a plurality of second memory cells, said second memory cells each comprising at least one of said plurality of third transistors,
wherein at least one of said plurality of second memory cells is disposed at least partially atop of said first control circuits,
wherein said first control circuits are adapted to control data written to at least one of said plurality of second memory cells,
wherein said plurality of second transistors are horizontally oriented transistors,
wherein said second level is bonded to said third level, and
wherein said bonded comprises oxide to oxide bonds.
9. The 3D semiconductor device according to claim 8 ,
wherein said first control circuits comprise memory peripheral circuits, and
wherein said memory peripheral circuits comprise a plurality of decoders.
10. The 3D semiconductor device according to claim 8 ,
wherein said plurality of second transistors are aligned to said plurality of first transistors with less than 450 nm and greater than 0.1 nm misalignment.
11. The 3D semiconductor device according to claim 8 ,
wherein said plurality of first memory cells are controlled thru a plurality of memory control lines, and
wherein said second level comprises at least one of said plurality of memory control lines.
12. The 3D semiconductor device according to claim 8 ,
wherein said second level comprises a second single-crystal layer.
13. The 3D semiconductor device according to claim 8 ,
wherein said plurality of second memory cells are DRAM memory cells.
14. The 3D semiconductor device according to claim 8 ,
wherein said second level is bonded to said first level, and
wherein said bonded comprises oxide-to-oxide bonds.
15. A 3D semiconductor device, the device comprising:
a first level comprising a first single-crystal layer, said first level comprising a plurality of first transistors and at least one metal layer,
wherein said at least one metal layer overlays said first single-crystal layer, and
wherein said at least one metal layer comprises interconnects between said plurality of first transistors, said interconnects between said plurality of first transistors comprise forming first control circuits;
a second level overlaying said at least one metal layer, said second level comprises a plurality of second transistors; and
a third level overlaying said second level, said third level comprising a plurality of third transistors,
wherein said second level comprises a plurality of first memory cells, said plurality of first memory cells each comprising at least one of said plurality of second transistors,
wherein said third level comprises a plurality of second memory cells, said plurality of second memory cells each comprising at least one of said plurality of third transistors,
wherein at least one of said plurality of second memory cells is disposed at least partially atop of said first control circuits,
wherein said first control circuits are adapted to control data written to at least one of said plurality of second memory cells,
wherein at least one of said plurality of second transistors is self-aligned to at least one of said plurality of third transistors, being processed in a same lithography step,
wherein said plurality of second memory cells are DRAM memory cells,
wherein said first level is bonded to said second level, and
wherein said bonded comprises oxide-to-oxide bonds.