Method for removing hard masks
Provided are compositions and methods useful in etching, i.e., removing amorphous carbon hard masks which have been doped with elements such as boron, chlorine, or nitrogen. The compositions utilize concentrated sulfuric acid, water, and at least one oxidizing agent. In the operation of the method, the composition selectively removes the doped hard mask layer, even in the presence of layers such as silicon dioxide, silicon nitride, tantalum nitride, and polysilicon, with good selectivity.
1. A method for removing an amorphous carbon hard mask from a microelectronic device, wherein said hard mask has been doped with an element selected from boron, chlorine, and nitrogen to form a doped hard mask, the method comprising contacting said microelectronic device with a composition comprising:
a. about 50 to about 98 weight percent of H 2 SO 4 , based on the total weight of the composition;
b. water; and
c. about 0.1 to about 30 weight percent of at least one oxidizing agent, based on the total weight of the composition, wherein the at least one oxidizing agent is chosen from nitric acid and perchloric acid,
wherein the composition has a doped hard mask etch rate greater than 400 Å/minute at 155° C. and contacting said microelectronic device with the composition is conducted at about 155° C.
2. The method of claim 1 , wherein the element is boron.
3. The method of claim 1 , wherein the oxidizing agent is utilized in a range of about 1 to about 15 weight percent.
4. The method of claim 1 , wherein the oxidizing agent is utilized in a range of about 5 to about 10 weight percent.
5. The method of claim 1 , wherein the composition comprises about 65 to about 85 weight percent of H 2 SO 4 .
6. The method of claim 1 , further comprising a second acid which is other than the at least one oxidizing agent or H 2 SO 4 .
7. The method of claim 6 , wherein the acid is chosen from methanesulfonic acid, trifluoromethanesulfonic acid, boric acid, and phosphoric acid.
8. The method of claim 1 , further comprising at least one surfactant.
9. The method of claim 1 , wherein further comprising contacting a 3D-NAND storage device.