Modular periphery tile for integrated circuit device
Systems or methods of the present disclosure may improve scalability (e.g., component scalability, product variation scalability) of integrated circuit systems by disaggregating periphery intellectual property (IP) circuitry into modular periphery IP tiles that can be installed as modules. Such an integrated circuit system may include a first die that includes programmable fabric circuitry and a second die that that includes a periphery IP tile. The periphery IP tile may be disaggregated from the programmable fabric die and may be communicatively coupled to the first die via a modular interface.
1. A multi-die package, comprising:
a package substrate;
a plurality of first dies mounted on the package substrate and comprising a first plurality of routers to facilitate off-package communication, wherein respective dies of the plurality of first dies perform processing; and
an input/output (I/O) die physically separate from the plurality of first dies, wherein the I/O die is mounted on the package substrate and configurable to support external memory interfaces comprising a second plurality of routers to facilitate off-package communication with the plurality of first dies by interfacing with the first plurality of routers, wherein the I/O die facilitates off-package communication between the plurality of first dies and one or more off-package devices via the package substrate.
2. The multi-die package of claim 1 , wherein the I/O die is configurable to support double data rate (DDR) external memory interface.
3. The multi-die package of claim 2 , wherein the plurality of first dies and the I/O die are communicatively coupled via the package substrate via one or more channels formed in the package substrate.
4. The multi-die package of claim 2 , comprising a packet transfer system spanning the plurality of first dies and the I/O die, wherein the packet transfer system comprises the first plurality of routers and the second plurality of routers to route data packets between the plurality of first dies and the I/O die.
5. The multi-die package of claim 1 , wherein respective dies of the plurality of first dies have a first size and the I/O die has a second size that is different than the first size.
6. The multi-die package of claim 1 , wherein:
the plurality of first dies are fabricated using a first process technology;
the I/O die is fabricated using a second process technology; and
the first process technology is different than the second process technology.
7. The multi-die package of claim 1 , wherein a die of the plurality of first dies comprises a security module to authenticate data for the die of the plurality of first dies.
8. The multi-die package of claim 1 , wherein respective dies of the plurality of first dies comprise a respective router of the first plurality of routers.
9. The multi-die package of claim 8 , wherein the respective router facilitates communication of packetized data to a destination processor.
10. The multi-die package of claim 1 , wherein the one or more off-package devices comprise Random-Access Memory (RAM), Read-Only Memory (ROM), flash memory, one or more hard drives, a network interface, one or more host processors, or any combination thereof.
11. An integrated circuit package, comprising:
a plurality of first dies mounted on a package substrate, the plurality of first dies comprising first packet transfer circuitry to facilitate communication, wherein respective dies of the plurality of first dies performs processing; and
an input/output (I/O) die to support external memory interfaces, wherein the I/O die is physically separate from the plurality of first dies, mounted on the package substrate, and comprises second packet transfer circuitry to facilitate communication with the plurality of first dies by interfacing with the first packet transfer circuitry, wherein the I/O die facilitates off-package communication between the plurality of first dies and one or more off-package devices via the package substrate, wherein respective dies of the plurality of first dies have a first size and the I/O die has a second size that is different than the first size.
12. The integrated circuit package of claim 11 , wherein the I/O die is configurable to support double data rate (DDR) external memory interfaces.
13. The integrated circuit package of claim 11 , wherein a die of the plurality of first dies comprises a security module to authenticate data for the die of the plurality of first dies.
14. The integrated circuit package of claim 11 , wherein the one or more off-package devices comprise Random-Access Memory (RAM), Read-Only Memory (ROM), flash memory, one or more hard drives, a network interface, one or more host processors, or any combination thereof.
15. A system, comprising:
one or more off-package devices; and
a multi-die package, comprising:
a package substrate;
a plurality of first dies mounted on the package substrate, wherein a respective die of the plurality of first dies performs processing, wherein the plurality of first dies comprises a first plurality of routers to facilitate communication; and
an input/output (I/O) die physically separate from the plurality of first dies, mounted on the package substrate, and configurable to support external memory interfaces, wherein the I/O die:
facilitates off-package communication between the plurality of first dies and the one or more off-package devices via the package substrate; and
comprises a second plurality of routers to facilitate communication with the plurality of first dies by interfacing with the first plurality of routers.
16. The system of claim 15 , wherein the one or more off-package devices comprise Random-Access Memory (RAM), Read-Only Memory (ROM), flash memory, one or more hard drives, a network interface, one or more host processors, or any combination thereof.
17. The system of claim 15 , wherein a die of the plurality of first dies comprises a security module to authenticate data for the die of the plurality of first dies.
18. The system of claim 15 , comprising a network interface configurable to communicate with one or more devices external to the multi-die package.
19. The system of claim 15 , wherein:
the plurality of first dies and the I/O die are communicatively coupled via the package substrate via one or more channels formed in the package substrate; and
respective dies of the plurality of first dies have a first size and the I/O die has a second size that is different that the first size.
20. The system of claim 15 , wherein:
the plurality of first dies are fabricated using a first process technology;
the I/O die is fabricated using a second process technology; and
the first process technology is different than the second process technology.