Semiconductor device
Provided is a semiconductor device that includes a drift region that is of a first conductivity type and is provided in a semiconductor substrate; a base region that is of a second conductivity type and is provided above the drift region; an accumulation region that is of the first conductivity type provided between the base region and the drift region; and an electric field relaxation region that is provided between the base region and the accumulation region, wherein the boundary between the electric field relaxation region and the accumulation region is a location for a half-value for the peak of the doping concentration of the accumulation region, and an integrated concentration of the electric field relaxation region is greater than or equal to 5E14 cm −2 and less than or equal to 5E15 cm −2 .
1. A semiconductor device, comprising:
a drift region that is of a first conductivity type and is provided in a semiconductor substrate;
a base region that is of a second conductivity type and is provided above the drift region;
an accumulation region that is of the first conductivity type, is provided between the base region and the drift region, and has a higher doping concentration than the drift region; and
an electric field relaxation region that is provided between the base region and the accumulation region, and has a doping concentration that is lower than a peak of the doping concentration of the accumulation region,
wherein
a boundary between the electric field relaxation region and the accumulation region is a location for a half-value for the peak of the doping concentration of the accumulation region, and
an integrated concentration of the electric field relaxation region is greater than or equal to 5E14 cm −2 and less than or equal to 5E15 cm −2 .
2. The semiconductor device according to claim 1 , wherein
a film thickness of the electric field relaxation region is greater than or equal to 0.4 μm and less than or equal to 3.0 μm.
3. The semiconductor device according to claim 1 , wherein
a film thickness of the electric field relaxation region is greater than or equal to 1.0 μm and less than or equal to 1.8 μm.
4. The semiconductor device according to claim 1 , wherein
a film thickness of the electric field relaxation region is greater than or equal to 1.5 μm and less than or equal to 2.0 μm.
5. The semiconductor device according to claim 1 , wherein
a film thickness of the electric field relaxation region is greater than or equal to a film thickness of the accumulation region.
6. The semiconductor device according to claim 1 , wherein
the electric field relaxation region includes a region with the same doping concentration as the doping concentration of the drift region.
7. The semiconductor device according to claim 2 , wherein
the electric field relaxation region includes a region with the same doping concentration as the doping concentration of the drift region.
8. The semiconductor device according to claim 3 , wherein
the electric field relaxation region includes a region with the same doping concentration as the doping concentration of the drift region.
9. The semiconductor device according to claim 1 , wherein
the doping concentration of the electric field relaxation region has a peak that is less than the half-value of the peak of the doping concentration of the accumulation region.
10. The semiconductor device according to claim 2 , wherein
the doping concentration of the electric field relaxation region has a peak that is less than the half-value of the peak of the doping concentration of the accumulation region.
11. The semiconductor device according to claim 3 , wherein
the doping concentration of the electric field relaxation region has a peak that is less than the half-value of the peak of the doping concentration of the accumulation region.
12. The semiconductor device according to claim 1 , wherein
the doping concentration of the accumulation region is less than a peak of a doping concentration of the base region.
13. The semiconductor device according to claim 2 , wherein
the doping concentration of the accumulation region is less than a peak of a doping concentration of the base region.
14. The semiconductor device according to claim 3 , wherein
the doping concentration of the accumulation region is less than a peak of a doping concentration of the base region.
15. The semiconductor device according to claim 1 , wherein
the doping concentration of the accumulation region is greater than or equal to 1E16 cm −3 and less than or equal to 4E16 cm −3 .
16. The semiconductor device according to claim 2 , wherein
the doping concentration of the accumulation region is greater than or equal to 1E16 cm −3 and less than or equal to 4E16 cm −3 .
17. The semiconductor device according to claim 3 , wherein
the doping concentration of the accumulation region is greater than or equal to 1E16 cm −3 and less than or equal to 4E16 cm −3 .
18. The semiconductor device according to claim 1 , wherein
a film thickness of the accumulation region is greater than or equal to 0.5 μm and less than or equal to 1.5 μm.
19. The semiconductor device according to claim 2 , wherein
a film thickness of the accumulation region is greater than or equal to 0.5 μm and less than or equal to 1.5 μm.
20. The semiconductor device according to claim 3 , wherein
a film thickness of the accumulation region is greater than or equal to 0.5 μm and less than or equal to 1.5 μm.