Method for manufacturing semiconductor structure same
The present disclosure provides a method for manufacturing a semiconductor structure. The method includes providing an underlying semiconductor layer; depositing an insulation layer over the underlying semiconductor layer; forming a first through semiconductor via extending continuously through the insulation layer; forming a second through semiconductor via extending continuously through the insulation layer; etching a portion of the insulation layer to expose a first upper end of the first through semiconductor via above the insulation layer and a second upper end of the second through semiconductor via above the insulation layer; and forming an upper conductive connecting portion laterally connected to a first upper lateral surface of the first upper end and a second upper lateral surface of the second upper end by a self-aligned deposition process.
1. A method for manufacturing a semiconductor structure, comprising:
providing an underlying semiconductor layer;
depositing an insulation layer over the underlying semiconductor layer;
forming a first through semiconductor via extending continuously through the insulation layer;
forming a second through semiconductor via extending continuously through the insulation layer;
etching a portion of the insulation layer to expose a first upper end of the first through semiconductor via above the insulation layer and a second upper end of the second through semiconductor via above the insulation layer;
depositing an upper conductive metal material directly and laterally connected to a first upper lateral surface of the first upper end and a second upper lateral surface of the second upper end by a self-aligned deposition process, wherein the first through semiconductor via includes copper material, and the second through semiconductor via includes copper material, and the upper conductive metal material includes a conductive copper alloy; and
continuously depositing the upper conductive metal material to form an upper conductive connecting portion to physically and electrically connect the first upper end of the first through semiconductor via and the second upper end of the second through semiconductor via.
2. The method of claim 1 , wherein the upper conductive connecting portion is formed by a plating process.
3. The method of claim 1 , wherein the upper conductive metal material is deposited by exposing the first upper end of the first through semiconductor via and the second upper end of the second through semiconductor via to GeH 4 gas or Ge 2 H 6 gas.
4. The method of claim 1 , wherein the upper conductive metal material includes copper-germanium alloy.
5. The method of claim 1 , wherein the first through semiconductor via is formed through the underlying semiconductor layer, the second through semiconductor via is formed through the underlying semiconductor layer, and the underlying semiconductor layer includes a semiconductor substrate.
6. The method of claim 5 , further comprising:
etching a portion of the underlying semiconductor layer from a bottom surface of the underlying semiconductor layer to expose a first bottom end of the first through semiconductor via opposite to the first upper end and a second bottom end of the second through semiconductor via opposite to the second upper end; and
depositing a bottom conductive metal material directly and laterally connected to a first bottom lateral surface of the first bottom end and a second bottom lateral surface of the second bottom end by a self-aligned deposition process.
7. The method of claim 6 , wherein the bottom conductive metal material is formed by a plating process.
8. The method of claim 6 , wherein the bottom conductive metal material includes copper material, and the bottom conductive metal material is deposited by exposing the first bottom end of the first through semiconductor via and the second bottom end of the second through semiconductor via to GeH 4 gas or Ge 2 H 6 gas.
9. A method for manufacturing a semiconductor structure, comprising:
providing an underlying semiconductor layer;
forming a first through semiconductor via extending continuously through the underlying semiconductor layer;
forming a second through semiconductor via extending continuously through the underlying semiconductor layer;
etching a portion of the underlying semiconductor layer from a bottom surface of the underlying semiconductor layer to expose a first bottom end of the first through semiconductor via and a second bottom end of the second through semiconductor via;
depositing a bottom conductive metal material directly and laterally connected to a first bottom lateral surface of the first bottom end and a second bottom lateral surface of the second bottom end by a self-aligned deposition process, wherein the first through semiconductor via includes copper material, and the second through semiconductor via includes copper material, and the bottom conductive metal material includes a conductive copper alloy; and
continuously depositing the bottom conductive metal material to form a bottom conductive connecting portion to physically and electrically connect the first bottom end of the first through semiconductor via and the second bottom end of the second through semiconductor via.
10. The method of claim 9 , wherein the bottom conductive metal material is formed by a plating process.
11. The method of claim 9 , wherein the bottom conductive metal material is deposited by exposing the first bottom end of the first through semiconductor via and the second bottom end of the second through semiconductor via to GeH 4 gas or Ge 2 H 6 gas.